Lenovo BladeCenter HS23E Problem Determination And Service Manual page 147

v Follow the suggested actions in the order in which they are listed in the Action column until the problem is
solved.
v See Chapter 4, "Parts listing," on page 41 to determine which components are consumable, structural, or CRU
parts.
v If an action step is preceded by "(Trained technician only)," that step must be performed only by a trained
technician.
Error Code Event ID
0x80030100 8003010e-2581ffff
0x80030100 8003010f-2101ffff
0x80030100 80030128-2101ffff
0x8006f0021 806f0021-2201ffff
0x80070100 80070101-0301ffff
80070101-0302ffff
Type Error Message
Info Sensor (Memory
Resized) has
asserted.
Info System mgmt
software, firmware
progress (Phy
Presence Jmp) has
occurred.
Info System mgmt
software, blade
mgmt subsystem
health (Low
Security Jmp) has
occurred.
Error FW/BIOS,
connector (No Op
ROM Space) PCI
express slot X fault.
[Note: X=1,2]
Warning Processor X,
temperature (CPU
X OverTemp)
warning [Note:
X=1,2]
Action
This is a UEFI detected event. The UEFI
diagnostic code for this event can be found
in the logged IMM message text. Please refer
to "UEFI/POST error codes" on page 99 for
the appropriate actions.
Information only; no action is required.
Information only; no action is required.
This is a UEFI detected event. The UEFI
diagnostic code for this event can be found
in the logged IMM message text. Please refer
to "UEFI/POST error codes" on page 99 for
the appropriate actions.
1. Check the system event log for additional
temperature and fan information (see
"Event logs" on page 96).
2. Make sure that the room temperature is
within the operating specifications (see
"Features and specifications" on page 7).
3. Make sure that none of the air vents on
the BladeCenter unit and on the blade
server are blocked.
4. Make sure that all of the fans on the
BladeCenter unit are running.
5. Make sure that each bay of the
BladeCenter unit has either a device or a
filler installed.
6. Make sure that the blade server is not
missing any heat sinks, DIMMs, heat-sink
fillers, or DIMM fillers (see Chapter 4,
"Parts listing," on page 41).
7. Make sure that the CPU heat sink is
properly attached to the CPU (see
"Installing a microprocessor and heat
sink" on page 84).
Chapter 6. Diagnostics
133