Table 9.1. Pcb Land Pattern Dimensions - Silicon Laboratories Si4010-C2 Manual

Table 9.1. PCB Land Pattern Dimensions

Dimension
C1
E
X1
Y1
Notes:
General
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This land pattern design is based on the IPC-7351 guidelines.
Solder Mask Design
1. All metal pads are to be non-solder mask defined (NSMD). Clearance
between the solder mask and the metal pad is to be 60 µm minimum,
all the way around the pad.
Stencil Design
1. A stainless steel, laser-cut and electro-polished stencil with
trapezoidal walls should be used to assure good solder paste release.
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1 for all
perimeter pads.
Card Assembly
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-
020 specification for Small Body Components.
MIN MAX
5.30 5.40
1.27 BSC
0.50 0.60
1.45 1.55
Rev. 1.0
Si4010-C2
27