Instrument Layout - Agilent Technologies 1100 Series Reference Manual

6
Introduction to the Variable Wavelength Dector
Figure 45 Electrical Connections

Instrument Layout

The industrial design of the module incorporates several innovative features. It uses
Agilent's E-PAC concept for the packaging of electronics and mechanical assemblies.
This concept is based upon the use of expanded polypropylene (EPP) layers foam
plastic spacers in which the mechanical and electronic boards components of the
module are placed. This pack is then housed in a metal inner cabinet which is enclosed
by a plastic external cabinet. The advantages of this packaging technology are:
• virtual elimination of fixing screws, bolts or ties, reducing the number of
• the plastic layers have air channels molded into them so that cooling air can be
• the plastic layers help cushion the electronic and mechanical parts from physical
• the metal inner cabinet shields the internal electronics from electromagnetic
182 1100 Series Variable Wavelength Detector Reference Manual
components and increasing the speed of assembly/disassembly,
guided exactly to the required locations,
shock, and
interference and also helps to reduce or eliminate radio frequency emissions from the
instrument itself.