Design Principles For Usb Interfaces - Quectel SG560D Series Hardware Design

Smart module
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4.1.3. Design Principles for USB Interfaces

Table 14: USB Trace Length Inside the Module
Pin No.
Signal
354
USB0_DP
358
USB0_DM
360
USB0_SS1_TX_P
357
USB0_SS1_TX_M
356
USB0_SS1_RX_P
353
USB0_SS1_RX_M
348
USB0_SS2_TX_P
345
USB0_SS2_TX_M
352
USB0_SS2_RX_P
349
USB0_SS2_RX_M
622
USB1_DP
621
USB1_DM
620
USB0_DP_AUX_P
619
USB0_DP_AUX_M
To ensure USB performance, follow the following principles while designing the USB interface.
It is important to route the USB signal traces as differential pairs with total grounding. The impedance
of USB differential trace is 90 Ω.
The ground reference plane under the USB signals must be continuous without any cuts or any holes
to ensure impedance continuity.
Pay attention to the influence of junction capacitance of ESD protection components on USB data
lines. Typically, the capacitance value should be less than 2 pF for USB 2.0 and less than 0.5 pF for
USB 3.1. Keep the ESD protection components as close as possible to the USB connector.
Do not route USB signal traces under crystals, oscillators, magnetic devices, audio signal, and RF
signal traces. Route USB differential traces in inner-layer with ground shielding on not only upper and
lower layers but also right and left sides.
Do not route USB 3.1 signal traces under RF signal traces. Crossing or paralleling with RF signal
SG560D_Series_Hardware_Design
Length (mm)
35.95
35.48
26.51
26.65
24.03
24.13
26.16
26.30
26.79
26.67
22.95
22.54
21.41
21.22
Smart Module Series
Length Difference (P - M)
0.47
-0.14
-0.10
-0.14
0.12
0.41
0.19
59 / 134

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