Quectel SG560D Series Hardware Design page 12

Smart Module Series
Figure 42: Recommended Footprint ...................................................................................................... 126
Figure 43: Top & Bottom Views of the Module ....................................................................................... 127
Figure 44: Recommended Reflow Soldering Thermal Profile ................................................................ 129
Figure 45: Injection Tray Dimension Drawing ........................................................................................ 131
Figure 46: Packaging Process............................................................................................................... 132
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