Manufacturing And Soldering - Quectel SG560D Series Hardware Design

NOTE
1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module
to the air is forbidden.
2. Take out the module from the package and put it on high-temperature-resistant fixtures before
baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure.
3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules.

8.2. Manufacturing and Soldering

Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the
stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean
stencil surface on a single pass. To guarantee module soldering quality, the thickness of stencil for the
module is recommended to be 0.15–0.18 mm. For more details, see document [3].
The recommended peak reflow temperature should be 235–246 º C , with 246 º C as the absolute
maximum reflow temperature. To avoid damage to the module caused by repeated heating, it is
recommended that the module should be mounted only after reflow soldering for the other side of PCB
has been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and
related parameters are shown below.
Temp. (° C)
246
235
217
200
Soak Zone
150
100
Figure 42: Recommended Reflow Soldering Thermal Profile
SG560D_Series_Hardware_Design
A
Ramp-to-soak slope:
0–2 ° C/s
Smart Module Series
Reflow Zone
Ramp-up
Cool-down
C
slope:
slope:
-1–0 ° C/s
0–1 ° C/s
B
D
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