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Quectel SG560D Series Hardware Design

Quectel SG560D Series Hardware Design

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SG560D Series
Hardware Design
Smart Module Series
Version: 1.1
Date: 2023-02-10
Status: Released

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Summary of Contents for Quectel SG560D Series

  • Page 1 SG560D Series Hardware Design Smart Module Series Version: 1.1 Date: 2023-02-10 Status: Released...
  • Page 2 Smart Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai...
  • Page 3 Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects.

  • Page 4: Safety Information

    Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.

  • Page 5: About The Document

    Smart Module Series About the Document Revision History Version Date Author Description Xiaomeng GUO/ 2022-05-13 Creation of the document Chris ZHANG Xiaomeng GUO/ 2022-06-22 First official release Chris ZHANG 1. Added n3, n5, and n8 for SG560D-CN (Table 3, Table 6, Table 36, Table38, Table 42 and Table 56).

  • Page 6: Table Of Contents

    Smart Module Series Contents Safety Information ............................ 3 About the Document ..........................4 Contents ..............................5 Table Index ............................... 8 Figure Index ............................10 Introduction ............................. 12 1.1. Special Mark ......................... 16 Product Overview ..........................17 2.1. Frequency Bands and Functions ..................17 2.2.
  • Page 7 Smart Module Series 4.9. UART/SPI/I2C/I2S Multiplexing Relationship ................ 71 4.10. ADC Interfaces ........................74 4.11. LCM Interface ........................75 4.12. Touch Panel Interface ......................77 4.13. Camera Interfaces ........................ 78 4.13.1. MIPI Design Considerations ................. 83 4.14. Sensor Interfaces ......................... 87 4.15.
  • Page 8 Smart Module Series Storage, Manufacturing and Packaging ..................128 8.1. Storage Conditions ......................128 8.2. Manufacturing and Soldering ....................129 8.3. Packaging Specification ...................... 131 8.3.1. Injection Tray ......................131 8.3.2. Packaging Process ....................132 Appendix References ........................133 SG560D_Series_Hardware_Design 7 / 133...
  • Page 9 Smart Module Series Table Index Table 1: Special Marks ..........................16 Table 2: Brief Introduction of the Module ....................17 Table 3: Wireless Network Type ......................17 Table 4: Key Features ..........................18 Table 5: I/O Parameters Definition ......................25 Table 6: Pin Description ...........................
  • Page 10 Smart Module Series Table 42: Conducted RF Rx Sensitivity of SG560D-CN ................93 Table 43: Conducted RF Rx Sensitivity of SG560D-EU (Unit:dBm) ............94 Table 44: Pin Definition of GNSS Antenna Interface ................97 Table 45: Operating Frequency ....................... 97 Table 46: GNSS Performance .........................
  • Page 11 Smart Module Series Figure Index Figure 1: Functional Diagram ........................18 Figure 2: Application Block Diagram ......................18 Figure 3: Pin Assignment ........................24 Figure 4: Reference Circuit for Battery Charging Circuit ................. 46 Figure 5: Reference Circuit of Power Supply ..................47 Figure 6: Power Supply Limits During Burst Transmission ..............
  • Page 12 Smart Module Series Figure 42: Recommended Footprint ...................... 126 Figure 43: Top & Bottom Views of the Module ..................127 Figure 44: Recommended Reflow Soldering Thermal Profile ..............129 Figure 45: Injection Tray Dimension Drawing ..................131 Figure 46: Packaging Process....................... 132 SG560D_Series_Hardware_Design 11 / 133...

  • Page 13: Introduction

    Smart Module Series Introduction This document defines the SG560D series module and describes its air interfaces and hardware interfaces which are connected to your applications. With this document, you can quickly understand module interface specifications, electrical and mechanical details, as well as other related information of the module. The document, coupled with application notes and user guides, makes it easy to design and set up mobile applications with the module.
  • Page 14 6875~7125 MHz: 2.20dBi • The product is provided with an approved antenna. Use only supplied or approved antenna by Quectel. Any changes or modifications to the Antenna may void the regulatory approvals obtained for the product. • Host device must comply with FCC Part 15 antenna requirements •...
  • Page 15 Smart Module Series and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The user’s manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.
  • Page 16 Smart Module Series two conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device." or "Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes : 1) l’appareil ne doit pas produire de brouillage;...

  • Page 17: Special Mark

    Smart Module Series flying above 10,000 ft. Avertissement: Utilisation limité e à l’inté rieur seulement; Utilisation interdite à bord de plateformes de forage pé trolier, de voitures, de trains, de bateaux et d’aéronefs, sauf à bord d’un gros aéronef volant à plus de 10 000 pieds d’altitude Enclosure Requirements: Host devices containing the SG560D-WF module and operating in the 5.925-7.125 GHz is prohibited from having a weatherized enclosure.

  • Page 18: Product Overview

    M2M applications, such as smart gateway, CPE, MiFi, MID, PND, POS, router, multimedia terminal, smart phone, digital signage, industrial PDA. Related information and details are listed in the table below: Table 2: Brief Introduction of the Module SG560D Series Packaging Pin Number Dimensions (42.5 ±0.2) mm ×...

  • Page 19: Key Features

    Smart Module Series n41/n77/n78 B1/B3/B5/B8 B1/B3/B5/B7/B8/B20/B28/B32 B34/B38/B39/B40/B41 B38/B39/B40/B41/B42 B1/B5/B8 B1/B5/B8 EGSM900/DCS1800 GPS/GLONASS/BDS/Galileo/Nav GPS/GLONASS/BDS/Galileo/NavI IC/SBAS/QZSS; L1 + L5 C/SBAS/QZSS; L1 + L5 802.11a/b/g/n/ac/ax 802.11a/b/g/n/ac/ax 802.11a/b/g/n/ac/ax Bluetooth 5.2 Bluetooth 5.2 (BR/EDR + BLE) Bluetooth 5.2 (BR/EDR + BLE) (BR/EDR + BLE) 2.2. Key Features Table 4: Key Features Parameter Details...
  • Page 20 Smart Module Series Operating System Android 12 ⚫ Supply voltage: 3.55–4.4 V Power Supply ⚫ Typical supply voltage: 4.0 V ⚫ Text and PDU mode ⚫ Point-to-point MO and MT ⚫ SMS cell broadcast ⚫ SMS storage: ME by default ⚫...
  • Page 21 Smart Module Series 480 Mbps ⚫ Only support host mode (external VBUS power supply is needed) ⚫ Supports DisplayPort 1.4 function through USB0_SS1 and USB0_SS2 DisplayPort Interface ⚫ Supports up to 4K (3840 × 2160) @ 60 fps ⚫ USB 3.1 and DisplayPort 1.4 can work concurrently PCIe Interface Supports 2-lane PCIe Gen 3, up to 8 Gbps ⚫...
  • Page 22 Smart Module Series ⚫ ANT_WIFI/BT, ANT_WIFI_MIMO(SG560D-WF) ⚫ Class 4 (33 dBm ± 2 dB) for EGSM900 ⚫ Class 1 (30 dBm ± 2 dB) for DCS1800 ⚫ Class E2 (27 dBm ±3 dB) for EGSM900 8 -PSK ⚫ Class E2 (26 dBm ±3 dB) for DCS1800 8 -PSK ⚫...

  • Page 23: Functional Diagram

    Smart Module Series ⚫ DC-HSDPA: Max. 42 Mbps (DL) ⚫ HSUPA: Max. 5.76 Mbps (UL) ⚫ WCDMA: Max. 384 kbps (DL)/ 384 kbps (UL) ⚫ Class 4 (33 dBm ±2 dB) for EGSM 900 ⚫ Class 1 (30 dBm ± 2 dB) for DCS1800 ⚫...
  • Page 24 Smart Module Series - Touch Panel Interface - Camera (MIPI) Interfaces - Sensor Interfaces - Emergency Download Interface - PCIe Interface - NFC Interface* NOTE For SG560D-EU, the I/O directions of ANT1 and ANT2 are analog input/output. For SG560D-CN, the I/O directions of ANT1 and ANT2 are analog input.

  • Page 25: Pin Assignment

    Smart Module Series 2.4. Pin Assignment The following figure illustrates the pin assignment of the module. VBAT VBAT ANT_GNSS VBAT VBAT VBAT RESERVED FLASH_LED RESERVED ADC1 RESERVED ANT3 CSI0_CLK CSI0_LN0_ CSI0_LN0 ADC2 RESERVED CSI0_CLK CSI0_LN1_ RESERVED CSI0_LN1 GPIO_7 RESERVED CSI0_LN2_ CSI0_LN2 RESERVED CAM0_...

  • Page 26: Pin Description

    Smart Module Series 2.5. Pin Description The following table shows the DC characteristics and pin descriptions. Table 5: I/O Parameters Definition Type Description Analog Input Analog Input/Output Analog Output Digital Input Digital Input/Output Digital Output Open Drain Power Input Power Input/Output Power Output Table 6: Pin Description Power Supply...
  • Page 27 Smart Module Series When using it, it is recommended to add 1–4.7 μF 3.0 V output Vnom = 3.0 V LDO7C_3V0 (3.0 V output for bypass capacitors max = 600 mA sensors and TP) with a total capacitance not exceeding 18.8 μF. When using it, it is recommended to 2.8 V output...
  • Page 28 Smart Module Series to add 1–4 μF bypass capacitors 1.8 V output Vnom = 1.8 V LDO2C_1V8 with a total (reserved power) max = 150 mA capacitance not exceeding 4 μF. Vmin = 2.0 V Power supply for VRTC Vnom = 3.0 V Vmax = 3.25 V 6, 8–10, 12, 13, 22, 23, 32, 34, 35, 37, 39, 46, 47, 56–58, 76–78, 81–85, 87–91, 93, 96, 97, 100, 101, 105, 108, 114, 115, 118, 125, 127, 129, 132, 143, 146, 171, 179, 182,...
  • Page 29 Smart Module Series USB Interfaces Pin Name Pin No. Description DC Characteristics Comment USB/charger insertion detection； The maximum Vmax = 12.6 V Charging power output current in USB_VBUS 429–432 Vmin = 3.7 V input； OTG mode is Vnom = 5.0 V Power output for 1.5 A.
  • Page 30 Smart Module Series dedicated boost converter. When Micro-USB USB Type-C detect mode is used, this USB0_CC1 pin can be used as USB_ID. USB Type-C detect USB0_CC2 When USB Type-C mode is used, connect it to SS_DIR_OUT. When Micro-USB USB_PHY_PS CC status detection mode is used, this pin should be connected to the...
  • Page 31 Smart Module Series Pin Name Pin No. Description DC Characteristics Comment PCIe1 reference PCIE1_REFCLK_P clock (+) PCIE1_REFCLK_ PCIe1 reference clock (-) PCIE1_RX0_P PCIe1 recive 0 (+) PCIE1_RX0_M PCIe1 recive 0 (-) Requires PCIE1_RX1_P PCIe1 recive 1 (+) differential impedance of PCIE1_RX1_M PCIe1 recive 1 (-) 85 Ω.
  • Page 32 Smart Module Series LCD MIPI lane 2 DSI_LN2_N data (-) LCD MIPI lane 3 DSI_LN3_P data (+) LCD MIPI lane 3 DSI_LN3_N data (-) LCD_TE LCD tearing effect 1.8 V External pull-up is LCD_RST LCD reset not required. Camera Interfaces Pin Name Pin No.
  • Page 33 Smart Module Series MIPI CSI1 lane 0 CSI1_LN0_N data (-) MIPI CSI1 lane 1 CSI1_LN1_P data (+) MIPI CSI1 lane 1 CSI1_LN1_N data (-) MIPI CSI1 lane 2 CSI1_LN2_P data (+) MIPI CSI1 lane 2 CSI1_LN2_N data (-) MIPI CSI1 lane 3 CSI1_LN3_P data (+) MIPI CSI1 lane 3...
  • Page 34 Smart Module Series differential CSI3_CLK_N MIPI CSI3 clock (-) impedance of MIPI CSI3 lane 0 85 Ω. CSI3_LN0_P data (+) MIPI CSI3 lane 0 CSI3_LN0_N data (-) MIPI CSI3 lane 1 CSI3_LN1_P data (+) MIPI CSI3 lane 1 CSI3_LN1_N data (-) MIPI CSI3 lane 2 CSI3_LN2_P data (+)
  • Page 35 Smart Module Series Either 1.8 V or 2.95 V (U)SIM card is supported and can be identified automatically by Vmin = 1.65 V the module. (U)SIM1 card USIM1_VDD Vmax = 3.05 V When using it, it is power supply Imax = 150 mA recommended to add bypass capacitors with a...
  • Page 36 Smart Module Series Pull it up to USIM2_VDD with USIM2_DATA (U)SIM2 card data an external 20 kΩ resistor. 1.8/2.95 V USIM2_CLK (U)SIM2 card clock USIM2_RST (U)SIM2 card reset Active low. Pull it up to 1.8 V externally. If not used, keep it (U)SIM2 card unconnected.
  • Page 37 Smart Module Series power supply; max = 150 mA pull-up. When 1.8/2.95 V output using it, it is recommended to add 1–3 μF bypass capacitors with a total capacitance not exceeding 3 μF. UART Interfaces Pin Name Pin No. Description DC Characteristics Comment Debug UART...
  • Page 38 Smart Module Series I2C clock of camera CCI_I2C_SCL1 I2C data of camera CCI_I2C_SDA0 I2C clock of camera CCI_I2C_SCL0 I2S Interfaces Pin Name Pin No. Description DC Characteristics Comment MI2S_MCLK I2S master clock MI2S_SCLK I2S serial clock MI2S_WS I2S word select MI2S_DATA0 I2S data channel 0 MI2S_DATA1...
  • Page 39 Smart Module Series LPI digital MIC3 LPI_DMIC3_CLK clock LPI digital MIC3 LPI_DMIC3_DATA data TP Interface Pin Name Pin No. Description DC Characteristics Comment TP_RST TP reset TP_INT TP interrupt 1.8 V External 1.8 V TP_I2C_SCL TP I2C clock pull-up is required. If not used, keep TP_I2C_SDA TP I2C data...
  • Page 40 Smart Module Series RGB Interfaces Pin No. Pin No. Description DC Characteristics Comment RGB_BLU RGB light-blue RGB_GRN RGB light-green max = 12 mA RGB_RED RGB light-red Interface* Pin No. Pin No. Description DC Characteristics Comment NFC_CLK NFC clock NFC_CLK_REQ NFC clock request NFC download NFC_DWL_REQ control request...
  • Page 41 Smart Module Series Pin No. Pin No. Description DC Characteristics Comment GPIO_6 GPIO_7 Wakeup. GPIO_8 GPIO_9 GPIO_12 Wakeup. GPIO_13 Do not pull it up GPIO_14 during startup Do not pull it up GPIO_15 during startup. Wakeup. GPIO_16 Wakeup. GPIO_17 GPIO_18 General-purpose 1.8 V input/output...
  • Page 42 Smart Module Series GPIO_61 GPIO_62 Do not pull it up GPIO_63 during startup. GPIO_68 Wakeup. Do not pull it up GPIO_93 during startup. Wakeup. GPIO_105 GPIO_106 GPIO_107 GPIO_108 GPIO_165 GPIO_166 GPIO_158 Wakeup. RF Antenna Interface Pin No. Pin No. Description DC Characteristics Comment SG560D-CN:...
  • Page 43 Smart Module Series (n1/n41/n78/n79 DRX MIMO) & LTE (B1/B41 DRX MIMO) SG560D-EU: NR MHB PRX MIMO + n28 TRX0 LTE MHB PRX MIMO + B28 TRX0 SG560D-CN: 5G NR (n1 PRX MIMO, n41/n78/n79 TRX0) & LTE (B1/B41 PRX MIMO) SG560D-EU: NR LB DRX ANT3 NR MHB (TX1 +...

  • Page 44: Evb Kit

    346, 347, 355, 383, 391, 395, 415, 422, 423, 581–591, 608–610, 613–618, 625, 627–636 2.6. EVB Kit To help you develop applications with the module, Quectel supplies an evaluation board with accessories to control or test the module. For more details, see document [1]. SG560D_Series_Hardware_Design...

  • Page 45: Operating Characteristics

    3.1. Power Supply 3.1.1. Power Supply Pins SG560D series module provides five VBAT pins, which are dedicated for connection to external power supply. The power supply range of the module is 3.55–4.4 V, and the recommended value is 4.0 V.
  • Page 46 Battery ID detect unconnected. SG560D series module supports battery temperature detection in the condition that the battery integrates a thermistor (100 kΩ ±1 % NTC thermistor with a B-constant of 4250 kΩ ±1 % by default) and the thermistor is connected to BAT_THERM. If BAT_THERM is not connected, there will be malfunctions such as battery charging failure, battery level display error.

  • Page 47: Reference Design For Power Supply

    Smart Module Series A reference design for the battery charging circuit is shown below. Adapter or USB USB_VBUS BAT_P BAT_M VBAT VBAT BAT_ID BAT_ID BAT_THERM 100 K 100 μF 4.7 μF 33 pF 10 pF 100 nF SG560D Battery Figure 2: Reference Circuit for Battery Charging Circuit Mobile devices such as mobile phones and handheld POS systems are powered by batteries.

  • Page 48: Requirements For Voltage Stability

    Smart Module Series The following figure illustrates a reference design for +5 V input power source. DC_IN VBAT 220K 100 nF 470 μF 470R 470 μF 100 nF 100K Figure 3: Reference Circuit of Power Supply 3.1.4. Requirements for Voltage Stability The recommended power supply value of the module is 4 V.

  • Page 49: Turn On

    Smart Module Series In addition, in order to get a stable power source, it is suggested to use a TVS diode and place it as close to the VBAT pins as possible to enhance surge protection. The following figure shows the structure of the power supply.
  • Page 50 Smart Module Series Another way to control the PWRKEY pin is to use a button directly. When you press the button, electrostatic strike may be generated from finger. Therefore, you must place a TVS component nearby the button for ESD protection. Additionally, a 1 kΩ resistor is connected in series to PWRKEY for ESD protection.

  • Page 51: Turn Off/Restart

    Smart Module Series 3.3. Turn Off/Restart The module can be turned off by driving the PWRKEY pin low for at least 3 s. If the PWRKEY pin is pulled low for at least 3 s, you can choose to turn off the module in the prompt window popped up. It is also possible to restart the module by driving the PWRKEY pin low for at least 8 s.

  • Page 52: Power Output

    Smart Module Series VRTC Core Large Capacitance Capacitor Module Figure 11: RTC Powered by Capacitor ⚫ If RTC fails, the module can synchronize time through the network after being powering up. ⚫ The recommended input voltage range for VRTC is 2.0–3.25 V and the recommended typical value is 3.0 V.
  • Page 53 Smart Module Series Keep on. When using it, it is recommended to add 1.8 V output 1–4.7 μF bypass LDO18B_1V8 (1.8 V output for I/O pull-up) capacitors with a total capacitance not exceeding 14.1 μF. When using it, it is recommended to add 1–4.7 μF bypass 1.8 V output...
  • Page 54 Smart Module Series exceeding 3 μF. When using it, it is recommended to add 1–4.7 μF bypass SD_LDO9C Power supply for SD card capacitors with a total capacitance not exceeding 18.8 μF. Only for SD card pull-up. When using it, it is recommended to add 1–3 μF bypass SD_LDO6C SD card pull-up power supply...

  • Page 55: Application Interfaces

    Application Interfaces 4.1. USB Interfaces SG560D series module provides two USB interfaces: USB0 and USB1. USB0 complies with USB 3.1 Gen1 and USB 2.0 specifications and supports USB OTG. USB1 complies with USB 2.0 specification and only supports host mode. The module supports SuperSpeed (5 Gbps) for USB 3.1, and supports high-speed (480 Mbps), full-speed (12 Mbps) and low-speed (1.5 Mbps) for USB 2.0.
  • Page 56 Smart Module Series USB 3.1 channel 2 SuperSpeed USB0_SS2_TX_P transmit (+) USB 3.1 channel 2 SuperSpeed USB0_SS2_TX_M transmit (-) USB 3.1 channel 2 SuperSpeed USB0_SS2_RX_P receive (+) USB 3.1 channel 2 SuperSpeed USB0_SS2_RX_M receive (-) Externally connected to USB_VCONN Power supply for E-Mark cables VPH_PWR or dedicated boost converter.

  • Page 57: Usb Type-C Mode

    Smart Module Series 4.1.1.1. USB Type-C Mode A reference circuit of USB Type-C mode of USB0 is shown below. USB Type_C VBUS USB_VBUS USB0_DM USB0_DP USB0_CC1 USB0_CC2 USB_PHY_PS Module SS_DIR_OUT 330 nF USB0 _ SS1 _RX_P RX1+ 330 nF USB0 _ SS1 _RX_M RX1- 220 nF USB0 _ SS1 _TX_P...

  • Page 58: Displayport Mode

    Smart Module Series 4.1.1.3. DisplayPort Mode SG560D series module supports DisplayPort 1.4, which is implemented through USB Type-C interface and supports 4-lane interface with a resolution of 4K @ 60 fps. Pin mapping between USB Type-C interface and DisplayPort interface is defined as follows.

  • Page 59: Usb1 Interface

    Smart Module Series A reference circuit of the DisplayPort interface is given as follows. USB Type_C VBUS USB_VBUS USB0_DM USB0_DP USB0_CC1 USB0_CC2 SBU1 Module SBU2 330 nF USB0 _ SS1 _RX_P RX1+ 330 nF USB0 _ SS1 _RX_M RX1- 220 nF USB0 _ SS1 _TX_P TX1+ 220 nF...

  • Page 60: Design Principles For Usb Interfaces

    Smart Module Series 4.1.3. Design Principles for USB Interfaces Table 14: USB Trace Length Inside the Module Pin No. Signal Length (mm) Length Difference (P - M) USB0_DP 35.95 0.47 USB0_DM 35.48 USB0_SS1_TX_P 26.51 -0.14 USB0_SS1_TX_M 26.65 USB0_SS1_RX_P 24.03 -0.10 USB0_SS1_RX_M 24.13 USB0_SS2_TX_P...

  • Page 61: U)Sim Interfaces

    Smart Module Series traces is forbidden. Isolation between USB 3.1 signals and RF signals should be more than 90 dB. Otherwise, the RF signals will be seriously affected. ⚫ Ensure the trace length difference between TX_P and TX_M, as well as RX_P and RX_M of USB 3.1 does not exceed 0.7 mm.
  • Page 62 Smart Module Series Active low. Pull it up to 1.8 V externally. If not used, keep it (U)SIM1 card hot-swap USIM1_DET unconnected. detect Disabled by default, and can be enabled via software configuration. Either 1.8 V or 2.95 V (U)SIM card is supported and can be identified automatically by the...
  • Page 63 Smart Module Series The following figure shows a reference design for (U)SIM interface with an 8-pin (U)SIM card connector. LDO18B_1V8 (U)SIM Card Connector 100 n F 100K USIM_ VDD USIM_ RST 22 R Module USIM_ CLK 22 R USIM_ DET USIM_ DATA 22 R 22 pF...

  • Page 64: Sd Card Interface

    Smart Module Series ⚫ To offer good ESD protection, it is recommended to add a TVS diode array with a parasitic capacitance not exceeding 50 pF. The 22 Ω resistors should be added in series between the module and the (U)SIM card to facilitate debugging. Add 22 pF capacitors parallel on USIM_DATA, USIM_CLK and USIM_RST signal traces to filter RF interference, and place them as close to the (U)SIM card connector as possible.
  • Page 65 Smart Module Series A reference circuit for SD card interface is shown below. SD_LDO9C SD_LDO6C LDO18B_1V8 120K NM_51K NM_51K NM_10K NM_51K NM_51K SD_DATA2 P1-DAT2 SD_DATA3 P2-CD/DAT3 SD_CMD P3-CMD P4-VDD SD_CLK P5-CLK P6-VSS SD_DATA0 P7-DAT0 SD_DATA1 P8-DAT1 DETECTIVE SD_DET Module 4.7 μF 33 pF SD Card Connector Figure 17: Reference Circuit for SD Card Interface...

  • Page 66: Gpio Interfaces

    Smart Module Series SD_CMD 49.16 SD_DATA0 49.46 SD_DATA1 49.79 SD_DATA2 49.42 SD_DATA3 49.64 4.4. GPIO Interfaces The module has abundant GPIO interfaces with power domain of 1.8 V. The pin definition is listed below. Table 18: Pin Definition of GPIO Interfaces Pin Name Pin No.
  • Page 67 Smart Module Series GPIO_32 GPIO_33 GPIO_34 Wakeup. GPIO_35 GPIO_42 GPIO_43 GPIO_44 Wakeup. GPIO_45 GPIO_46 GPIO_47 Wakeup. GPIO_61 GPIO_62 Do not pull it up GPIO_63 during startup. GPIO_68 Wakeup. Do not pull it up GPIO_93 during startup; Wakeup. GPIO_105 GPIO_106 GPIO_107 GPIO_108 GPIO_165 GPIO_166...

  • Page 68: Uart Interfaces

    Smart Module Series 4.5. UART Interfaces The module supports up to eleven groups of UART interfaces. Two of them are default configurations, see Table 19 for details. Nine of them can be multiplexed from other interfaces, see Table 23 for details. Two default UART interfaces are: ⚫...

  • Page 69: I2C Interfaces

    Smart Module Series A level translator and an RS-232 level-shifting chip are recommended to be added between the module and PC, as shown below. 1.8 V 3.3 V VCCA VCCB TXD_3.3V UART_TXD TXD_1.8V DIN1 DOUT1 RTS_3.3V UART_RTS RTS_1.8V DIN2 DOUT2 DIN3 DOUT3 DIN4...

  • Page 70: Spi Interface

    Smart Module Series LPI_SENSOR_I2C1_ them unconnected. I2C data 1 for external sensor 1.8 V power domain. LPI_SENSOR_I2C1_ I2C clock 1 for external sensor LPI_SENSOR_I2C2_ I2C data 2 for external sensor LPI_SENSOR_I2C2_ I2C clock 2 for external sensor TP_I2C_SCL TP I2C clock TP_I2C_SDA TP I2C data NFC_I2C_SDA...

  • Page 71: I2S Interfaces

    Smart Module Series SPI_MOSI SPI master-out slave-in 4.8. I2S Interfaces The module supports up to five groups of I2S interfaces. Two of them are default configurations, see Table 22 for details. Three of them can be multiplexed from other interfaces, see Table 25 for details. Table 22: Pin Definition of I2S Interfaces Pin Name Pin No.

  • Page 72: Uart/Spi/I2C/I2S Multiplexing Relationship

    Smart Module Series 4.9. UART/SPI/I2C/I2S Multiplexing Relationship UART/SPI/I2C multiplexing relationship is shown in the following table. Table 23: UART/SPI/I2C Multiplex Relationship Multiplex Function Channel Pin Name GPIO No. UART I2C0_SDA GPIO_0 UART00_CTS SPI00_MISO I2C00_SDA I2C0_SCL GPIO_1 UART00_RTS SPI00_MOSI I2C00_SCL QUP0-SE0 PCIE1_RST_N GPIO_2 UART00_TXD...
  • Page 73 Smart Module Series NFC_EN* GPIO_38 UART11_TXD SPI11_CLK NFC_CLK_REQ* GPIO_39 UART11_RXD SPI11_CS0 NFC_DWL_REQ* GPIO_40 UART12_CTS SPI12_MISO I2C12_SDA NFC_INT* GPIO_41 UART12_RTS SPI12_MOSI I2C12_SCL QUP1-SE2 GPIO_42 GPIO_42 UART12_TXD SPI12_CLK GPIO_43 GPIO_43 UART12_RXD SPI12_CS0 GPIO_44 GPIO_44 UART13_CTS SPI13_MISO I2C13_SDA GPIO_45 GPIO_45 UART13_RTS SPI13_MOSI I2C13_SCL QUP1-SE3 GPIO_46 GPIO_46...
  • Page 74 Smart Module Series GPIO_63 GPIO_63 SPI16_CS2 UART_TXD GPIO_50 SPI16_CS3 NOTE The QUP SE channel can be used flexibly to support UART, SPI and I2C interfaces. Note that one QUP SE channel cannot support two protocols at the same time. For example, QUP0-SE0 cannot support UART and I2C at the same time.

  • Page 75: Adc Interfaces

    Smart Module Series ACCEL_GYRO_INT1 GPIO_103 MI2S2_WS MAG_INT GPIO_104 MI2S2_DATA1 LPI_MI2S_SCLK GPIO_144 LPI_MI2S_SCLK LPI_MI2S_WS GPIO_145 LPI_MI2S_WS LPI_MI2S_DATA0 GPIO_146 LPI_MI2S_DATA0 LPI_MI2S_DATA1 GPIO_147 LPI_MI2S_DATA1 LPI_MI2S_DATA2 GPIO_148 LPI_MI2S_DATA2 LPI_MI2S_DATA3 GPIO_149 LPI_MI2S_DATA3 4.10. ADC Interfaces The module provides four analog-to-digital converter (ADC) interfaces that support up to 15-bit resolution. The pin definition is shown below.

  • Page 76: Lcm Interface

    Smart Module Series 4.11. LCM Interface The module provides one LCM interface based on MIPI_DSI standard. The interface supports one group of 4-lane high-speed differential data transmission with maximum speed rate of 2.5 Gbps/lane and supports FHD + (1200 × 2520 ) @144 fps. The pin definition of the LCM interface is shown below. Table 26: Pin Definition of LCM Interface Pin Name Pin No.
  • Page 77 Smart Module Series The following figure shows a reference design for LCM interface. LDO13C_2V8 LDO12C_1V8 LDO17B_1V8 LEDA LCM _ LED+ N M _0R LCM _LED- LEDK LCD_TE LPTE RESET LCD_ RST N M _0R LCD_ID NC (SDA-TP) NC (SCL-TP) NC (RST-TP) 1 μF 100 nF 1 μF...

  • Page 78: Touch Panel Interface

    Smart Module Series VPH_PWR LCM_LED+ Backlight LCM_LED- Driver PWM1 2.2 μF Module Figure 21: LCM External Backlight Driver Reference Circuit 4.12. Touch Panel Interface The module provides one group of I2C interface for connection with Touch Panel (TP), and provides the corresponding power supply and interrupt pins for TP.

  • Page 79: Camera Interfaces

    Smart Module Series A reference design for TP interface is shown below. LDO7C_3V0 LDO18B_1V8 2.2K 2.2K SDA 1.8 V TP_I2C_SDA TP_I2C_SCL SCL 1.8 V RESET 1.8 V TP_RST INT 1.8 V TP_INT 4.7 μF 100 nF Module Figure 22: Reference Circuit for TP Interface 4.13.
  • Page 80 Smart Module Series a total VREG_L6P_1P8 DOVDD for cameras 0, 1, 2 and 3 capacitance not exceeding VREG_L7P_2P8 AVDD for camera 2 19 μF. CSI0_CLK_P MIPI CSI0 clock (+) CSI0_CLK_N MIPI CSI0 clock (-) CSI0_LN0_P MIPI CSI0 lane 0 data (+) CSI0_LN0_N MIPI CSI0 lane 0 data (-) Requires...
  • Page 81 Smart Module Series CAM1_RST Reset of camera 1 CSI2_CLK_P MIPI CSI2 clock (+) CSI2_CLK_N MIPI CSI2 clock (-) CSI2_LN0_P MIPI CSI2 lane 0 data (+) CSI2_LN0_N MIPI CSI2 lane 0 data (-) Requires CSI2_LN1_P MIPI CSI2 lane 1 data (+) differential impedance of CSI2_LN1_N...
  • Page 82 Smart Module Series The following is a reference circuit for dual-camera applications. VREG_L5P_2P8 AFVDD VREG_L4P_2P9 AVDD VREG_L2P_1P1 DVDD CAM0_RST VREG_L6P_1P8 DOVDD GPIO_12 CAM0_MCLK CCI_I2C_SDA0 CCI_I2C_SCL0 CSI0_LN3_P CSI0_LN3_N CSI0_LN2_P CSI0_LN2_N CSI0_LN1_P CSI0_LN1_N CSI0_LN0_P CSI0_LN0_N CSI0_CLK_P AVDD VREG_L3P_2P8 CSI0_CLK_N 2.2K VREG_L1P_1P05 DVDD DOVDD 2.2K CCI_I2C_SDA1...
  • Page 83 Smart Module Series The following is a reference circuit for tri-camera applications. VREG_L5P_2P8 AFVDD VREG_L4P_2P9 AVDD VREG_L2P_1P1 DVDD CAM0_RST VREG_L6P_1P8 DOVDD GPIO_12 CAM0_MCLK CCI_I2C_SDA0 CCI_I2C_SCL0 CSI0_LN3_P CSI0_LN3_N CSI0_LN2_P CSI0_LN2_N CSI0_LN1_P CSI0_LN1_N CSI0_LN0_P CSI0_LN0_N CSI0_CLK_P VREG_L3P_2P8 AVDD CSI0_CLK_N VREG_L1P_1P05 DVDD 2.2K DOVDD 2.2K CCI_I2C_SDA1...

  • Page 84: Mipi Design Considerations

    Smart Module Series 4.13.1. MIPI Design Considerations ⚫ Special attention should be paid to the pin definition of LCM/camera connectors. Ensure that the module and the connectors are correctly connected. ⚫ MIPI are high speed signal lines, supporting maximum data rate of 2.5 Gbps/lane. The differential impedance should be controlled to 85 Ω.
  • Page 85 Smart Module Series 152.4 -3.5 < 150 Table 30: Relationship Between DSI Rate and Line Length (D-PHY) Data Rate Cable Length (mm) Cable Insertion Loss (dB) Line Length (mm) 76.2 -0.5 < 280 500 Mbps/Lane 152.4 -1.0 < 210 76.2 -0.7 <...
  • Page 86 Smart Module Series DSI_LN0_N 25.81 0.33 DSI_LN0_P 26.14 DSI_LN1_N 26.22 -0.16 DSI_LN1_P 26.06 DSI_LN2_N 25.65 0.14 DSI_LN2_P 25.79 DSI_LN3_N 26.01 -0.05 DSI_LN3_P 25.96 CSI0_CLK_N 45.18 -0.03 CSI0_CLK_P 45.15 CSI0_LN0_N 45.23 -0.01 CSI0_LN0_P 45.22 CSI0_LN1_N 45.18 -0.08 CSI0_LN1_P 45.10 CSI0_LN2_N 45.25 -0.08 CSI0_LN2_P 45.17...
  • Page 87 Smart Module Series CSI1_LN2_P 41.72 CSI1_LN3_N 41.70 0.04 CSI1_LN3_P 41.74 CSI2_CLK_N 40.54 0.15 CSI2_CLK_P 40.69 CSI2_LN0_N 40.69 0.17 CSI2_LN0_P 40.86 CSI2_LN1_N 40.84 0.09 CSI2_LN1_P 40.93 CSI2_LN2_N 40.51 0.20 CSI2_LN2_P 40.71 CSI2_LN3_N 41.01 -0.16 CSI2_LN3_P 40.85 CSI3_CLK_N 39.49 -0.06 CSI3_CLK_P 39.43 CSI3_LN0_N 39.33 0.05...

  • Page 88: Sensor Interfaces

    Smart Module Series 4.14. Sensor Interfaces The module supports communication with sensors via I2C interface, and supports various sensors such as acceleration sensor, gyroscopic sensor, compass, light sensor and temperature sensor. Table 32: Pin Definition of Sensor Interfaces Pin Name Pin No.

  • Page 89: Pcie Interface

    Smart Module Series 4.16. PCIe Interface The module provides one PCIe interface, which supports 2-lane PCIe Gen 3 with data rate up to 8 Gbps. Table 33: Pin Definition of PCIe Interface Pin Name Pin No. Description Comment PCIE1_REFCLK_P PCIe1 reference clock (+) PCIE1_REFCLK_M PCIe1 reference clock (-) PCIE1_RX0_P...

  • Page 90: Nfc Interface

    0.15 PCIE1_RX0_M 19.17 PCIE1_RX1_P 21.40 0.10 PCIE1_RX1_M 21.30 4.17. NFC Interface* SG560D series module provides one NFC interface. Table 35: Pin Definition of NFC Interface Pin Name Pin No. Description Comment NFC_CLK NFC clock NFC_CLK_REQ NFC clock request NFC download control...

  • Page 91: Rf Specifications

    Smart Module Series RF Specifications Appropriate antenna type and design should be used with matched antenna parameters according to specific application. It is required to perform a comprehensive functional test for the RF design before mass production of terminal products. The entire content of this chapter is provided for illustration only. Analysis, evaluation and determination are still necessary when designing target products.
  • Page 92 Smart Module Series NR MHB PRX MIMO + n28 TRX0 ANT1 LTE MHB PRX MIMO + B28 TRX0 NR MHB DRX + n77/n78 DRX MIMO + n28 TRX1 ANT2 LTE MHB DRX + B42 DRX MIMO + B28 TRX1 WCDMA B1 DRX NR LB DRX NR MHB (TX1 + DRX MIMO) n5/n77/n78 TRX1...

  • Page 93: Transmitting Power

    Smart Module Series Table 39: Operating Frequency of SG560D-EU Operating Receive Transmit (MHz) LTE-FDD LTE-TDD UMTS Frequency (MHz) IMT (2100) 1920–1980 2110–2170 1710–1785 1805–1880 DCS1800 B3 824–849 869–894 2500-2570 2620-2690 880–915 925–960 GSM900 832–862 791-821 703–748 758–803 1452-1496 2570–2620 2570–2620 1880–1920 1880–1920 2300–2400...

  • Page 94: Rx Sensitivity

    Smart Module Series Other LTE bands 23 dBm ±2 dB (Class 3) < -40 dBm 5G NR HPUE bands 26 dBm +2/-3 dB (Class 2) < -40 dBm (n41/n78/n79) 5G NR Other 5G NR bands 23 dBm ±2 dB (Class 3) <...
  • Page 95 Smart Module Series LTE-FDD B3 (10 MHz) -100 -93.3 dBm LTE-FDD B5 (10 MHz) -99.5 -100.5 -103 -94.3 dBm LTE-FDD B8 (10 MHz) -98.5 -100 -102 -93.3 dBm LTE- TDD B34 (10 MHz) -101 -96.3 dBm LTE- TDD B38 (10 MHz) -96.5 -99.5 -96.3 dBm...
  • Page 96 Smart Module Series WCDMA B8 -110.5 -112 -103.7 LTE-FDD B1 (10 MHz) -98.8 -102.6 -96.3 LTE-FDD B3 (10 MHz) -97.5 -98.2 -102.9 -93.3 LTE-FDD B5 (10 MHz) -99.5 -100.5 -102.6 -94.3 LTE-FDD B7 (10 MHz) -97.3 -101.5 -94.3 LTE-FDD B8 (10 MHz) -100.5 -102.4 -93.3...

  • Page 97: Reference Design Of Cellular Antenna Interfaces

    Smart Module Series 5G NR TDD n78 (100 MHz) -87.2 -87.7 -93.5 -85.6 5.1.4. Reference Design of Cellular Antenna Interfaces The module provides four RF antenna interfaces for antenna connection. It is recommended to reserve a π-type matching circuit for better RF performance, and the π-type matching components (a capacitor-resistor-capacitor group) should be placed as close to the antenna as possible.

  • Page 98: Gnss Performance

    Smart Module Series Table 44: Pin Definition of GNSS Antenna Interface Pin Name Pin No. Description ANT_GNSS GNSS antenna interface Table 45: Operating Frequency Type Frequency Unit 1575.42 ± 1.023 (L1) GPS/SBAS/QZSS 1176.45 ± 1 0.23 (L5) GLONASS 1597.5–1605.8 1575.42 ± 2.046 (E1) Galileo 1176.45 ±...

  • Page 99: Reference Design

    Smart Module Series NOTE Tracking sensitivity: the minimum GNSS signal power at which the module can maintain lock (keep positioning for at least 3 minutes continuously). Reacquisition sensitivity: the minimum GNSS signal power required for the module to maintain lock within 3 minutes after loss of lock.

  • Page 100: Gnss Rf Design Guidelines

    Smart Module Series Active Antenna 10 Ω 1 μF 100 pF 56 nH ANT_GNSS 0 Ω 100 pF Module Figure 28: Reference Circuit for GNSS Active Antenna 5.2.3.3. GNSS RF Design Guidelines Improper design of antenna and layout may cause reduced GNSS receiving sensitivity, longer GNSS positioning time, or reduced positioning accuracy.

  • Page 101: Antenna Interface & Frequency Bands

    Smart Module Series 5.3.1. Antenna Interface & Frequency Bands Table 47: Pin Definition of Wi-Fi/Bluetooth Interfaces Pin Name Pin No. Description ANT_WIFI/BT Wi-Fi/Bluetooth antenna interface ANT_WIFI_MIMO Wi-Fi MIMO antenna interface Table 48: Wi-Fi/Bluetooth Frequency Type Frequency Unit 2402–2482 Wi-Fi 802.11a/b/g/n/ac/ax 5180–5825 5925-7125 Bluetooth 5.2 LE...
  • Page 102 Smart Module Series The following table lists the Wi-Fi transmitting and receiving performance of the module. Table 49: Wi-Fi Transmitting Performance Frequency Standard Rate Output 802.11b 1 Mbps 18 dBm ± 2.5 dB 802.11b 11 Mbps 16 dBm ±2.5 dB 802.11g 6 Mbps 18 dBm ±...
  • Page 103 Smart Module Series 802.11n HT40 MCS0 16.5 dBm ± 2.5 dB 802.11n HT40 MCS7 15.5 dBm ± 2.5 dB 802.11ac VHT20 MCS0 17 dBm ± 2.5 dB 802.11ac VHT20 MCS8 16 dBm ± 2.5 dB 802.11ac VHT40 MCS0 16.5 dBm ± 2.5 dB 802.11ac VHT40 MCS9 15.5 dBm ±...
  • Page 104 Smart Module Series 802.11ax HE160 MCS9 12.5 dBm ± 2.5 dB 802.11ax HE160 MCS11 11.5 dBm ± 2.5 dB 802.11ax HE160 MCS13 10.5 dBm ± 2.5 dB 802.11a 6 Mbps 8.5 dBm ± 2.5 dB 802.11a 54 Mbps 7.5 dBm ± 2.5 dB 802.11ax HE20 MCS0 8.5 dBm ±...
  • Page 105 Smart Module Series Table 50: Wi-Fi Receiving Performance Frequency Standard Rate Sensitivity 802.11b 1 Mbps -96 dBm 802.11b 11 Mbps -87 dBm 802.11g 6 Mbps -91 dBm 802.11g 54 Mbps -73 dBm 802.11n HT20 MCS0 -90 dBm 802.11n HT20 MCS7 -72 dBm 802.11n HT40 MCS0...
  • Page 106 Smart Module Series 802.11n HT40 MCS7 -66 dBm 802.11ac VHT20 MCS0 -87 dBm 802.11ac VHT20 MCS8 -66 dBm 802.11ac VHT40 MCS0 -84 dBm 802.11ac VHT40 MCS9 -64 dBm 802.11ac VHT80 MCS0 -81 dBm 802.11ac VHT80 MCS9 -60 dBm 802.11ax HE20 MCS0 -86 dBm 802.11ax HE20...
  • Page 107 Smart Module Series 802.11ax HE160 MCS11 -49 dBm 802.11ax HE160 MCS13 -43 dBm 802.11a 6 Mbps -89 dBm 802.11a 54 Mbps -70 dBm 802.11ax HE20 MCS0 -85 dBm 802.11ax HE20 MCS7 -67 dBm 802.11ax HE20 MCS9 -63 dBm 802.11ax HE20 MCS11 -59 dBm 802.11ax HE20...

  • Page 108: Bluetooth Overview

    Smart Module Series NOTE The module conforms to the IEEE specifications. 5.3.3. Bluetooth Overview The module supports Bluetooth 5.2 (BR/EDR+BLE) specification, as well as GFSK, 8-DPSK, π/4-DQPSK modulation modes. ⚫ Maximally support up to 7-lane wireless connections. ⚫ Maximally support up to 3.5 Piconets at the same time. ⚫...

  • Page 109: Reference Design

    Smart Module Series Table 52: Bluetooth Transmitting and Receiving Performance Transmitter Performance Packet Types 2-DH5 3-DH5 Transmitting Power 10 ±2.5 dBm 8 ± 2.5 dBm 8 ± 2.5 dBm Receiver Performance Packet Types 2-DH5 3-DH5 Receiving Sensitivity -93 dBm -92 dBm -86 dBm 5.3.4.

  • Page 110: Reference Design Of Rf Routing

    Smart Module Series 5.4. Reference Design of RF Routing When designing PCB, characteristic impedance of all RF traces should be controlled to 50 Ω. Generally, the impedance of RF traces is determined by materials’ dielectric constant, trace width (W), spacing between RF traces and grounds (S) and height from the reference ground to the signal layer (H).
  • Page 111 Smart Module Series Figure 34: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure better RF performance and reliability, the following conditions should be complied with in RF layout design: ⚫ Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 Ω.

  • Page 112: Antenna Installation

    Smart Module Series 5.5. Antenna Installation 5.5.1. Antenna Design Requirement Requirements for antenna design are as follows: Table 53: Antenna Design Requiremets Antenna Type Requirements ⚫ Frequency range: L1: 1559–1609 MHz L5: 1166–1187 MHz ⚫ Polarization: RHCP or linear ⚫ VSWR: ≤...

  • Page 113: Rf Connector Recommendation

    Smart Module Series 5.5.2. RF Connector Recommendation If RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector provided by Hirose. Figure 35: Dimensions of the Receptacle (Unit: mm) U.FL-LP series mated plugs listed in the following figure can be used to match the U.FL-R-SMT connector.
  • Page 114 Smart Module Series The following figure describes the space factor of mated connector. Figure 37: Space Factor of Mated Connectors (Unit: mm) Please visit http://www.hirose.com for more information. SG560D_Series_Hardware_Design 113 / 134...

  • Page 115: Electrical Characteristics And Reliability

    Smart Module Series Electrical Characteristics and Reliability 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 54: Absolute Maximum Ratings Parameter Min. Max.

  • Page 116: Power Consumption

    Smart Module Series Charging power input； Power output for OTG device Power supply for VRTC 3.25 6.3. Power Consumption Table 56: Power Consumption of SG560D-CN Mode Conditions Typ. Unit μA OFF state Power down WCDMA PF = 64 WCDMA PF = 128 WCDMA PF = 256 WCDMA PF = 512 LTE-FDD PF = 32...
  • Page 117 Smart Module Series 5G NR FDD PF = 256 5G NR TDD PF = 32 10.3 5G NR TDD PF = 64 5G NR TDD PF = 128 5G NR TDD PF = 256 B1 @ max power WCDMA voice calls B5 @ max power B8 @ max power LTE-FDD B1 @ max power...
  • Page 118 Smart Module Series n28 @ max power 30 MHz, SCS 15 kHz n41 @ max power 100 MHz, SCS 30 kHz n78 @ max power 100 MHz, SCS 30 kHz n79 @ max power 100 MHz, SCS 30 kHz DC_3A_n41A 100 MHz, SCS 30 kHz DC_39A_n41A 100 MHz, SCS 30 kHz...
  • Page 119 Smart Module Series @ DRX = 9 WCDMA PF = 64 7.38 WCDMA PF = 128 6.87 WCDMA PF = 256 6.56 WCDMA PF = 512 LTE-FDD PF = 32 10.07 LTE-FDD PF = 64 8.11 LTE-FDD PF = 128 7.23 LTE-FDD PF = 256 6.75...
  • Page 120 Smart Module Series DCS1800 @ PCL 7 DCS1800 @ PCL 15 B1 @23dBm WCDMA voice calls B5 @22.87dBm B8 @22.9dBm LTE-FDD B1 @ 22.48dBm 1029 LTE-FDD B3 @ 22.69dBm LTE-FDD B5 @ 22.79dBm LTE-FDD B7 @ 22.65dBm LTE-FDD B8 @ 22.69dBm LTE-FDD B20 @ 22.63dBm LTE data transmission LTE-FDD B28 @ 22.59dBm...
  • Page 121 Smart Module Series DCS1800 (2UL/3DL) @ PCL 0 DCS1800 (3UL/2DL) @ PCL 0 DCS1800 (4UL/1DL) @ PCL 0 EGSM900 (1UL/4DL) @ PCL 8 EGSM900 (2UL/3DL) @ PCL 8 EGSM900 (3UL/2DL) @ PCL 8 EGSM900 (4UL/1DL) @ PCL 8 EDGE data transmission DCS1800 (1UL/4DL) @ PCL 2 DCS1800 (2UL/3DL) @ PCL 2 DCS1800 (3UL/2DL) @ PCL 2...

  • Page 122: Digital I/O Characteristic

    ⚫ NOTE The power consumption data above is for reference only, which may vary among different modules. For detailed information, contact Quectel Technical Support for the power consumption test report of the specific module. 6.4. Digital I/O Characteristic Table 58: 1.8 V I/O Requirements...
  • Page 123 Smart Module Series Input low voltage -0.3 0.39 Output high voltage 1.32 1.95 Output low voltage Table 60: (U)SIM 2.95 V I/O Requirements Parameter Description Min. Max. Unit SD card pull-up power USIM_VDD 3.05 supply Input high voltage 1.89 3.35 Input low voltage -0.3 0.61...

  • Page 124: Esd Protection

    Smart Module Series Output high voltage 2.04 3.54 Output low voltage 0.44 6.5. ESD Protection Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly and testing of the module;...

  • Page 125: Mechanical Information

    Smart Module Series Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are ± 0.2 mm unless otherwise specified. 7.1. Mechanical Dimensions Pin 1 Figure 38: Module Top and Side Dimensions SG560D_Series_Hardware_Design 124 / 134...
  • Page 126 Smart Module Series Figure 39: Module Bottom Dimensions (Bottom View) NOTE The package warpage level of the module conforms to the JEITA ED-7306 standard. SG560D_Series_Hardware_Design 125 / 134...

  • Page 127: Recommended Footprint

    Smart Module Series 7.2. Recommended Footprint Figure 40: Recommended Footprint NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. SG560D_Series_Hardware_Design 126 / 134...

  • Page 128: Top And Bottom Views

    Figure 41: Top & Bottom Views of the Module NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. SG560D_Series_Hardware_Design 127 / 134...

  • Page 129: Storage, Manufacturing And Packaging

    Smart Module Series Storage, Manufacturing and Packaging 8.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: the temperature should be 23 ± 5 ° C and the relative humidity should be 35–60 %.

  • Page 130: Manufacturing And Soldering

    Smart Module Series NOTE To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules.
  • Page 131 4. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 5. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [3].

  • Page 132: Packaging Specification

    Smart Module Series 8.3. Packaging Specification This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery. The module adopts injection tray packaging and details are as follow: 8.3.1.

  • Page 133: Packaging Process

    Smart Module Series 8.3.2. Packaging Process Each injection tray packs 8 modules. Stack Packing 11 injection trays together. Place 1 10 injection trays with modules together, humidity indicator card and 1 desiccant bag on and put 1 empty injection tray on the top. the top of injection tray, then put 2 EPE on the top and bottom of injection tray.

  • Page 134: Appendix References

    Smart Module Series Appendix References Table 66: Related Documents Document Name [1] Quectel_Smart_5G_EVB_User_Guide [2] Quectel_RF_Layout_Application_Note [3] Quectel_Module_Secondary_SMT_Application_Note Table 67: Terms and Abbreviations Abbreviation Description Adaptive Multi-Rate BeiDou Navigation Satellite System Bluetooth Low Energy Bytes per second BPSK Binary Phase Shift Keying Basic Rate CDMA Code Division Multiple Access...
  • Page 135 Smart Module Series Clear To Send Dual Band Simultaneous Data Communications Equipment Data Coding Scheme DMIC Digital Microphone Discontinuous Reception Display Serial Interface Data Terminal Equipment Enhanced Data Rate Enhanced Full Rate Expandable Polyethylene EGSM Enhanced GSM eSCO Extended Synchronous Connection Oriented Electrostatic Discharge Equivalent Series Resistance ETSI...
  • Page 136 Smart Module Series GPIO General-Purpose Input/Output GPRS General Packet Radio Service Global Positioning System Graphics Processing Unit Global System for Mobile Communications HPUE High Power User Equipment Half Rate HSDPA High Speed Downlink Packet Access HTTP Hypertext Transfer Protocol Inter-IC Sound IEEE Institute of Electrical and Electronics Engineers International Mobile Telecommunications...
  • Page 137 Smart Module Series Non-Standalone Negative Temperature Coefficient Over-the-air programming On-The-Go Printed Circuit Board Personal Digital Assistant Protocol Data Unit Paging Frame Power Management Unit Portable Navigation Devices Point of Sale Phase Shift Keying Quadrature Amplitude Modulation QPSK Quadrature Phase Shift Keying QZSS Quasi-Zenith Satellite System Radio Frequency...
  • Page 138 Smart Module Series Short Message Service Serial Peripheral Interface Station Time Division Duplexing TD-SCDMA Time Division-Synchronous Code Division Multiple Access Touch Panel TTFF Time to First Fix Transient Voltage Suppressor UART Universal Asynchronous Receiver/Transmitter Universal Flash Storage UMTS Universal Mobile Telecommunications System Universal Serial Bus (U)SIM (Universal) Subscriber Identity Module...

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