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Quectel SC606T Series Hardware Design

Quectel SC606T Series Hardware Design

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SC606T Series
Hardware Design
Smart Module Series
Version: 1.0
Date: 2021-03-16
Status: Released

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Summary of Contents for Quectel SC606T Series

  • Page 1 SC606T Series Hardware Design Smart Module Series Version: 1.0 Date: 2021-03-16 Status: Released...
  • Page 2 To the maximum extent permitted by law, Quectel excludes all liability for any loss or damage suffered in connection with the use of the functions and features under development, regardless of whether such loss or damage may have been foreseeable.
  • Page 3 SC606T Series Hardware Design Copyright The information contained here is proprietary technical information of Quectel. Transmitting, reproducing, disseminating and editing this document as well as using the content without permission are forbidden. Offenders will be held liable for payment of damages. All rights are reserved in the event of a patent grant or registration of a utility model or design.

  • Page 4: Safety Information

    Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.

  • Page 5: About The Document

    Smart Module Series SC606T Series Hardware Design About the Document Revision History Version Date Author Description Dorian MENG/ 2021-01-25 Creation of the document Mike ZENG Dorian MENG/ 2021-03-16 First official release Mike ZENG SC606T_Series_Hardware_Design 4 / 116...

  • Page 6: Table Of Contents

    Smart Module Series SC606T Series Hardware Design Contents Safety Information ............................3 About the Document ........................... 4 Contents ............................... 5 Table Index ..............................8 Figure Index ............................... 10 Introduction ............................12 Product Concept ..........................15 2.1. General Description ........................15 2.2.
  • Page 7 Smart Module Series SC606T Series Hardware Design 3.20.1. Reference Design for Microphone Interfaces ..............68 3.20.2. Reference Design for Earpiece Interface ............... 69 3.20.3. Reference Design for Headphone Interface ..............69 3.20.4. Reference Design for Loudspeaker Interface ..............70 3.20.5. Design Considerations ....................70 3.21.
  • Page 8 Smart Module Series SC606T Series Hardware Design 10 Appendix A References........................111 11 Appendix B GPRS Coding Schemes ..................... 116 12 Appendix C GPRS Multi-slot Classes .................... 117 13 Appendix D EDGE Modulation and Coding Schemes ..............119 SC606T_Series_Hardware_Design 7 / 116...
  • Page 9 Smart Module Series SC606T Series Hardware Design Table Index Table 1: Frequency Bands, CA Combinations and GNSS Types of SC606T-EM ........15 Table 2: Frequency Bands, CA Combinations and GNSS Types of SC606T-NAD ........16 Table 3: Frequency Bands, CA Combinations and GNSS Types of SC606T-JP ........16 Table 4: Frequency Bands of SC606T-WF ....................
  • Page 10 Smart Module Series SC606T Series Hardware Design Table 42: SC606T-JP Current Consumption ....................91 Table 43: SC606T-EM Current Consumption .................... 93 Table 44: SC606T-JP RF Output Power ....................97 Table 45: SC606T-EM RF Output Power ....................97 Table 46: SC606T-NAD RF Output Power ....................98 Table 47: SC606T-JP RF Receiving Sensitivity ..................
  • Page 11 Smart Module Series SC606T Series Hardware Design Figure Index Figure 1: Functional Diagram ........................21 Figure 2: Pin Assignment (Perspective View) .................... 23 Figure 3: Voltage Drop Sample ........................38 Figure 4: Star Structure of Power Supply ....................38 Figure 5: Reference Design for Power Supply ..................39 Figure 6: Turn On Module Using Driving Circuit ..................
  • Page 12 Smart Module Series SC606T Series Hardware Design Figure 42: Top and Side Dimensions (Unit: mm) ..................103 Figure 43: Bottom Dimensions (Perspective View) ................. 104 Figure 44: Recommended Footprint (Perspective View) ................. 105 Figure 45: Top and Bottom Views ......................106 Figure 46: Recommended Reflow Soldering Thermal Profile ..............

  • Page 13: Introduction

    This document provides information on the functional features, interface specifications, as well as electrical and mechanical details of the SC606T series modules (SC606T-EM, SC606T-NAD, SC606T-JP, and SC606T-WF). Consult this document to learn about the air and hardware interfaces and external application reference designs among other related information of the series modules.
  • Page 14 Smart Module Series SC606T Series Hardware Design LTE BAND 25 8.00 8.00 LTE BAND 26(814-824) 9.36 LTE BAND 26(824-849) 9.41 8.25 LTE BAND 41 8.00 8.00 LTE BAND 66 5.00 5.00 LTE BAND 71 7.15 7.62 5. This module must not transmit simultaneously with any other antenna or transmitter 6.
  • Page 15 Smart Module Series SC606T Series Hardware Design a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring that the after the module is installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements.

  • Page 16: Product Concept

    Smart Module Series SC606T Series Hardware Design Product Concept 2.1. General Description SC606T is a series of smart modules applicable to Linux operating system and provides industrial-grade performance. Their general features are listed below: ⚫ Support LTE-FDD, LTE-TDD, DC-HSDPA, DC-HSUPA, HSPA+, HSDPA, HSUPA, WCDMA, EDGE, GPRS and GSM;...
  • Page 17 Smart Module Series SC606T Series Hardware Design GPS: 1575.42 ±1.023 MHz GNSS GLONASS: 1597.5–1605.8 MHz BeiDou: 1561.098 ±2.046 MHz Table 2: Frequency Bands, CA Combinations and GNSS Types of SC606T-NAD Mode Details LTE-FDD B2/B4/B5/B7/B12/B13/B14/B17/B25/B26/B66/B71 LTE-TDD 2A-2A, 2C, 4A-4A, 5A-5A, 5B, 7A-7A,7C, 66A-66A, 66B, 66C,...

  • Page 18: Key Features

    2402–2480 MHz GNSS SC606T series module is an SMD-type module, which can be embedded into applications through its 323 pins (152 LCC and 171 LGA pins). With a compact profile of 43.0 mm × 44.0 mm × 2.85 mm, the module can meet almost all requirements for M2M applications such as smart metering, smart home, security, wireless POS, mobile computing devices, PDA phone and tablet PC.
  • Page 19 Smart Module Series SC606T Series Hardware Design Class 4 (33 dBm ±2 dB) for GSM850 Class 4 (33 dBm ±2 dB) for EGSM900 Class 1 (30 dBm ±2 dB) for DCS1800 Class 1 (30 dBm ±2 dB) for PCS1900 Class E2 (27 dBm ±3 dB) for GSM850 8-PSK Transmitting Power Class E2 (27 dBm ±3 dB) for EGSM900 8-PSK...
  • Page 20 Smart Module Series SC606T Series Hardware Design SMS cell broadcast Support two groups of 4-lane MIPI_DSI LCM Interfaces Support dual LCDs Support WUXGA up to 1200 (RGB) × 1920 @ 60 fps Support three groups of 4-lane MIPI_CSI, up to 2.1 Gbps per lane...

  • Page 21: Functional Diagram

    Smart Module Series SC606T Series Hardware Design Main antenna, Rx-diversity antenna, GNSS antenna, Wi-Fi/BT antenna, and Antenna Interfaces FM antenna Size: (43.0 ±0.15) mm × (44.0 ±0.15) mm × (2.85 ±0.2) mm Physical Characteristics Package: LCC + LGA Weight: approx. 13.0 g Operating temperature range: -35 to +75 °C...

  • Page 22: Evaluation Board

    Figure 1: Functional Diagram 2.4. Evaluation Board To help you develop applications with the module conveniently, Quectel supplies an evaluation board, a USB to RS232 converter cable, a USB Type-C data cable, a power adapter, an earphone, an antenna, and other peripherals to control or test the module. For more details, see document [1].

  • Page 23: Application Interfaces

    Smart Module Series SC606T Series Hardware Design Application Interfaces 3.1. General Description The following chapters describe in detail the pins/interfaces listed below. ⚫ Power supply ⚫ VRTC interface ⚫ USB interface ⚫ UART interfaces ⚫ (U)SIM interfaces ⚫ SD card interface ⚫...

  • Page 24: Pin Assignment

    Smart Module Series SC606T Series Hardware Design 3.2. Pin Assignment The following figure shows the pin assignment of the series. GN D GN D LCD1_TE VDD_RF VDD_RF LCD1_RST GN D GN D GN D DSI1_LN3_N UART2_TXD DSI1_LN3_P UART2_RXD DSI1_LN2_N RESER VED...

  • Page 25: Pin Description

    Smart Module Series SC606T Series Hardware Design 3.3. Pin Description Table 6: I/O Parameters Definition Type Description Analog input Analog output Analog input/output Digital input Digital output Digital input/output Open drain Power input Power output The following tables show the module’s pin definition and electrical characteristics.
  • Page 26 Smart Module Series SC606T Series Hardware Design It can provide a maximum continuous current of 1 A Vmax = 4.4 V Power supply for approximately. VPH_PWR 220, 221 Vmin = 3.55 V peripherals The value of Vnom = 3.8 V...
  • Page 27 Smart Module Series SC606T Series Hardware Design pin open. 3, 4, 18, 20, 31, 34, 35, 40, 43, 47, 56, 62, 87, 98, 101, 112, 125, 128, 130, 133, 135, 148, 150, 159, 160, 163, 170, 173, 176, 182, 193, 195, 219, 225, 243, 257–323...
  • Page 28 Smart Module Series SC606T Series Hardware Design Pin Name Pin No. Description DC Characteristics Comment Vmax = 10.0 V USB connection USB_VBUS 41, 42 Vmin = 4.0 V detect Vnom = 5.0 V 90 Ω differential USB differential USB_DM data (-) impedance.
  • Page 29 Smart Module Series SC606T Series Hardware Design 1.8 V. If unused, keep this pin open. Disabled by default, and can be enabled through software configuration. max = 0.4 V USIM1_RST (U)SIM1 card reset min = 0.8 × USIM1_VDD max = 0.4 V...
  • Page 30 Smart Module Series SC606T Series Hardware Design 0.2 × USIM2_VDD up to USIM2_VDD min = with a 10 kΩ resistor. 0.7 × USIM2_VDD max = 0.4 V min = 0.8 × USIM2_VDD 1.8 V (U)SIM: Vmax = 1.90 V Either 1.8 V or 2.95 V (U)SIM2 card Vmin = 1.70 V...
  • Page 31 Smart Module Series SC606T Series Hardware Design min = 1.27 V max = 0.45 V min = 1.4 V 2.95 V SD card: max = 0.73 V min = 1.84 V max = 0.37 V min = 2.2 V 1.8 V SD card:...
  • Page 32 Smart Module Series SC606T Series Hardware Design LCM Interfaces Pin Name Pin No. Description DC Characteristics Comment General-purpose max = 0.45 V PMU_MPP4 ADC interface min = 1.35 V If the default function General-purpose of this pin is not used,...
  • Page 33 Smart Module Series SC606T Series Hardware Design LCD1 MIPI lane 0 DSI1_LN0_N data (-) LCD1 MIPI lane 0 DSI1_LN0_P data (+) LCD1 MIPI lane 1 DSI1_LN1_N data (-) LCD1 MIPI lane 1 DSI1_LN1_P data (+) LCD1 MIPI lane 2 DSI1_LN2_N...
  • Page 34 Smart Module Series SC606T Series Hardware Design MIPI clock of depth CSI1_CLK_P camera (+) MIPI lane 0 data of CSI1_LN0_N depth camera (-) MIPI lane 0 data of CSI1_LN0_P depth camera (+) MIPI lane 1 data of CSI1_LN1_N depth camera (-)
  • Page 35 Smart Module Series SC606T Series Hardware Design Reset of rear max = 0.45 V MCAM_RST 1.8 V power domain. camera min = 1.35 V Power down of rear max = 0.45 V MCAM_PWDN 1.8 V power domain. camera min = 1.35 V Reset of front max = 0.45 V...
  • Page 36 Smart Module Series SC606T Series Hardware Design ADC Interface Pin Name Pin No. Description DC Characteristics Comment General-purpose Maximum input PMU_MPP2 ADC interface voltage: 1.7 V. Antenna Interfaces Pin Name Pin No. Description DC Characteristics Comment Main antenna ANT_MAIN interface...
  • Page 37 Smart Module Series SC606T Series Hardware Design General-purpose GPIO_89 input/output General-purpose GPIO_90 input/output General-purpose GPIO_96 input/output General-purpose GPIO_97 input/output General-purpose GPIO_98 input/output General-purpose GPIO_99 input/output SPI Interfaces Pin Name Pin No. Description DC Characteristics Comment SPI_CS SPI chip select SPI_CLK...

  • Page 38: Power Supply

    Smart Module Series SC606T Series Hardware Design For test purpose only. GNSS_LNA_ GNSS LNA enable If unused, keep this control pin open. Generic RF GRFC_5 controller Only used for RF tuner control. Generic RF GRFC_7 controller S1A and S1B are...

  • Page 39: Reference Design For Power Supply

    Smart Module Series SC606T Series Hardware Design Figure 3: Voltage Drop Sample To decrease voltage drop, a bypass capacitor of about 100 µF with low ESR (0.7 Ω) should be used for VBAT pins, and multi-layer ceramic chip capacitor (MLCC) arrays should also be added for their ultra-low ESR.

  • Page 40: Turn-On And Turn-Off Timing

    Smart Module Series SC606T Series Hardware Design The following figure shows the reference design for a +5 V power supply which is regulated with an LDO (MIC29502WU) from Microchip. The typical output volage of the LDO is 3.8 V and the rated current of it is 5.0 A.
  • Page 41 Smart Module Series SC606T Series Hardware Design Another way to control PWRKEY is with a button. A Transient Voltage Suppressor (TVS) should be placed nearby the button for ESD protection. A reference design is shown in the following figure. PWRKEY...

  • Page 42: Turn Off Module

    Smart Module Series SC606T Series Hardware Design 3.5.2. Turn Off Module One way to turn off the module is to pull down PWRKEY for at least 1 s, and then choose to turn off when the prompt window comes up on the display screen connected to an LCM interface of the module.

  • Page 43: Power Output

    Smart Module Series SC606T Series Hardware Design being 3.0 V; ⚫ When powered by VBAT, the RTC has an error rate of 50 ppm, while when powered by VRTC, the RTC deviation is about 200 ppm; ⚫ If a rechargeable battery is used, the ESR of the battery should be less than 2 kΩ, and it is recommended to use the battery MS621FE FL11E from Seiko.

  • Page 44: Usb Interface

    Smart Module Series SC606T Series Hardware Design 3.8. USB Interface The module is integrated with a USB interface that is USB 3.0/2.0 specifications compliant and supports super speed (5 Gbps) on USB 3.0, high speed (480 Mbps) and full speed (12 Mbps) modes on USB 2.0, as well as USB OTG function on both USB 2.0 and USB 3.0.
  • Page 45 Smart Module Series SC606T Series Hardware Design USB_ID and GPIO_1 pins. When an OTG is connected to the USB Type-C interface, the USBC_CC1 and USBC_CC2 will force the USB_ID to output a low voltage level to pull down GPIO_1, thus making the module enter Host mode.
  • Page 46 Smart Module Series SC606T Series Hardware Design The following is a reference design for the USB Type-C interface: AW3605DNR 1.0 μH VBUS VOUT VOUT 10 μF 22 μF VPH_PWR GPIO_97 GPIO_1 USB_ID USB Type_C USB_ VBUS VBUS_ VBUS USB_DM USB_DP...

  • Page 47: Uart Interfaces

    Smart Module Series SC606T Series Hardware Design Table 10: USB Trace Length Inside the Module Pin No. Signal Length (mm) Length Difference (mm) USB_DM 39.52 -0.45 USB_DP 39.07 USB_SS_RX_P 28.55 0.32 USB_SS_RX_M 28.23 USB_SS_TX_P 19.58 0.23 USB_SS_TX_M 19.35 3.9. UART Interfaces The module provides the following three UART interfaces: ⚫...
  • Page 48 Smart Module Series SC606T Series Hardware Design application is equipped with a 3.3 V UART interface. The level translator chip TXS0104EPWR provided by Texas Instruments is recommended. The following figure shows a reference design for the level translator chip. Figure 13: Reference Design for Level Translator Chip (for UART5) The following figure is an example connection between the module and PC.

  • Page 49: U)Sim Interfaces

    Smart Module Series SC606T Series Hardware Design 3.10. (U)SIM Interfaces The module provides two (U)SIM interfaces which meet ETSI and IMT-2000 requirements. Dual SIM Dual Standby is supported by default. Both 1.8 V and 2.95 V (U)SIM cards are supported, and the (U)SIM interfaces are powered via dedicated LDOs in the module.
  • Page 50 Smart Module Series SC606T Series Hardware Design an 8-pin (U)SIM card connector is shown below. LD05_1P8 USIM_ VDD 100K (U)SIM Card Connector 100 nF USIM_ VDD USIM_ RST Module USIM_ CLK USIM_ DET USIM_ DATA 22 pF 22 pF 22 pF Figure 15: Reference Design for (U)SIM Interface with an 8-pin (U)SIM Card Connector If there is no need to use USIM_DET, keep it open.

  • Page 51: Sd Card Interface

    Smart Module Series SC606T Series Hardware Design EMI spurious transmission and enhance ESD protection. Ensure the ESD device is close to the (U)SIM card connector. ⚫ Add 22 pF capacitors in parallel on USIM_DATA, USIM_CLK and USIM_RST signal traces so as to filter RF interference, and place these capacitors as close to the (U)SIM card connector as possible.
  • Page 52 Smart Module Series SC606T Series Hardware Design SD_LDO11 SD_LDO12 LDO5_1P8 120K NM_51K NM_51K NM_10K NM_51K NM_51K SD_DATA2 P1-DAT2 SD_DATA3 P2-CD/DAT3 SD_CMD P3-CMD P4-VDD SD_CLK P5-CLK P6-VSS SD_DATA0 P7-DAT0 SD_DATA1 P8-DAT1 SD_DET DETECTIVE Module 4.7 μF 33 pF SD Card Connector Figure 17: Reference Design for SD Card Interface SD_LDO11 is a peripheral driver power supply for SD card.

  • Page 53: Gpio Interfaces

    Smart Module Series SC606T Series Hardware Design SD_DATA2 32.11 SD_DATA3 32.11 3.12. GPIO Interfaces The module has multiple GPIO interfaces with power domain of 1.8 V. The pin definition is listed below. Table 15: Pin Definition of GPIO Interfaces Pin Name Pin No.

  • Page 54: I2C Interfaces

    Smart Module Series SC606T Series Hardware Design NOTES Wakeup: interrupt pins that can wake up the system. For more details about GPIO configuration, see document [2]. 3.13. I2C Interfaces Every model of the series provides five groups of I2C interfaces. As an open-drain output, each I2C interface should be pulled up to 1.8 V.

  • Page 55: Adc Interface

    Smart Module Series SC606T Series Hardware Design Table 17: Pin Definition of SPI Interfaces Pin Name Pin No Description Comment SPI_CS SPI chip select SPI_CLK SPI clock SPI_MOSI SPI master-out slave-in SPI_MISO SPI master-in salve-out FP_SPI_CS FP SPI chip select...
  • Page 56 Smart Module Series SC606T Series Hardware Design Table 19: Pin Definition of LCM Interfaces Pin Name Pin No. Description Comment Power supply for VDD of LDO6_1P8 1.8 V output sensor, camera, LCD and I2C’s pull-up circuits. Power supply for VDD of LDO17_2P85 2.85 V output...
  • Page 57 Smart Module Series SC606T Series Hardware Design DSI1_LN0_P LCD1 MIPI lane 0 data (+) DSI1_LN1_N LCD1 MIPI lane 1 data (-) DSI1_LN1_P LCD1 MIPI lane 1 data (+) DSI1_LN2_N LCD1 MIPI lane 2 data (-) DSI1_LN2_P LCD1 MIPI lane 2 data (+)
  • Page 58 Smart Module Series SC606T Series Hardware Design LDO17_2P 85 LDO6_1P8 LCM1_LED+ LEDA LCM1_LED- LEDK LPTE LCD1_TE RESET LCD1_RST LCD_ID PMU_MPP2 NC (SDA-TP) NC (SCL-TP) NC (RST-TP) 1 μ F 4.7 μ F 100 nF NC (EINT-TP) VIO18 VCC28 NC (VTP-TP)

  • Page 59: Touch Panel Interfaces

    Smart Module Series SC606T Series Hardware Design VBAT LCM0 (1)_LED+ Backlight Driver LCM0 (1)_LED- PMU_MPP4/GPIO_33 2.2 μ F Module Figure 20: Reference Design for LCM External Backlight Driver 3.17. Touch Panel Interfaces The module provides two touch panel interfaces for connection with touch panel, and also provides the corresponding power pins and interrupt pins.

  • Page 60: Camera Interfaces

    Smart Module Series SC606T Series Hardware Design TP1_I2C_SCL TP1 I2C clock 1.8 V power domain. TP1_I2C_SDA TP1 I2C data 1.8 V power domain. A reference design for touch panel interfaces is shown below. LDO6_1P8 LDO10_2P8 2.2K 2.2K SDA 1.8V TP_I2C_SDA TP_I2C_SCL SCL 1.8V...
  • Page 61 Smart Module Series SC606T Series Hardware Design 1.8 V output power for VDD of Vnom = 1.8 V Sensor, Camera, LCD and I2C’s LDO6_1P8 max = 300 mA pull-up circuits 2.85 V output power for VDD of LCD Vnom = 2.85 V...
  • Page 62 Smart Module Series SC606T Series Hardware Design CSI2_CLK_N MIPI clock of front camera (-) CSI2_CLK_P MIPI clock of front camera (+) CSI2_LN0_N MIPI lane 0 data of front camera (-) CSI2_LN0_P MIPI lane 0 data of front camera (+) CSI2_LN1_N...
  • Page 63 Smart Module Series SC606T Series Hardware Design AF_VDD LDO17_2P85 AVDD LDO22_2P8 DVDD LDO2_1P1 DOVDD MCAM_ RST LDO 6_1P8 MCAM_PWDN 2.2K 2.2K MCAM_MCLK CAM_I2C_ SDA CAM_I2C_ SCL CSI0_LN3_P CSI0_LN3_N CSI0_LN2_P CSI0_LN2_N CSI0_LN1_P CSI0_LN1_N CSI0_LN0_P CSI0_LN0_N 4.7 μ F AVDD CSI0_ CLK_P CSI0_ CLK_N 1 μ...

  • Page 64: Design Considerations

    Smart Module Series SC606T Series Hardware Design AF_ VDD LDO17_2P85 AVDD LDO22_2P8 DVDD LDO2_1P1 DOVDD LDO6_1P8 MCAM_ RST MCAM_PWDN MCAM_MCLK CAM_I2C_SDA CAM_I2C_SCL CSI0_LN3_P CSI0_LN3_N CSI0_LN2_P CSI0_LN2_N CSI0_LN1_P CSI0_LN1_N CSI0_LN0_P CSI0_LN0_N CSI0_CLK_P 1 μ F DOVDD CSI0_CLK_N AVDD 4.7 μ F...
  • Page 65 Smart Module Series SC606T Series Hardware Design traces. For the same group of DSI or CSI signals, the length of all MIPI traces should be kept the same. In order to avoid crosstalk, keep the intra-lane spacing as wide as the MIPI trace and the inter-lane spacing two times the MIPI trace width.
  • Page 66 Smart Module Series SC606T Series Hardware Design DSI1_LN2_N 14.86 -0.36 DSI1_LN2_P 14.5 DSI1_LN3_N 15.73 0.15 DSI1_LN3_P 15.88 CSI0_CLK_N 16.54 0.03 CSI0_CLK_P 16.57 CSI0_LN0_N 17.47 -0.07 CSI0_LN0_P 17.4 CSI0_LN1_N 12.13 -0.05 CSI0_LN1_P 12.08 CSI0_LN2_N 9.56 0.14 CSI0_LN2_P CSI0_LN3_N 8.73 0.13 CSI0_LN3_P 8.86...

  • Page 67: Sensor Interfaces

    Smart Module Series SC606T Series Hardware Design CSI2_LN0_N 22.07 -0.07 CSI2_LN0_P 22.00 CSI2_LN1_N 22.54 -0.49 CSI2_LN1_P 22.05 CSI2_LN2_N 22.03 -0.11 CSI2_LN2_P 21.92 CSI2_LN3_N 21.90 0.59 CSI2_LN3_P 22.49 3.19. Sensor Interfaces The module communicates with sensors via the I2C interface, which supports the communication with various sensors such as acceleration sensors, gyroscopic sensors, compasses, optical sensors and temperature sensors.
  • Page 68 Smart Module Series SC606T Series Hardware Design Table 24: Pin Definition of Audio Interfaces Pin Name Pin No. Description Comment MIC1_P Microphone input for channel 1 (+) MIC1_N Microphone input for channel 1 (-) If unused, connect this MIC_GND Microphone reference ground pin to the ground.

  • Page 69: Reference Design For Microphone Interfaces

    Smart Module Series SC606T Series Hardware Design 3.20.1. Reference Design for Microphone Interfaces MIC1_P MIC1_N ECM-MIC 33 pF Module Figure 24: Reference Design for Analog ECM-type Microphone 100 pF MIC_ BIAS MIC_ GND 33 pF MIC3_P MEMS-MIC Module 33 pF...

  • Page 70: Reference Design For Earpiece Interface

    Smart Module Series SC606T Series Hardware Design 3.20.2. Reference Design for Earpiece Interface 33 pF EAR_P 33 pF EAR_N 33 pF Module Figure 26: Reference Design for Earpiece Interface 3.20.3. Reference Design for Headphone Interface MIC_GND MIC2_P HPH_L HS_DET HPH_R...

  • Page 71: Reference Design For Loudspeaker Interface

    Smart Module Series SC606T Series Hardware Design 3.20.4. Reference Design for Loudspeaker Interface SPK_P EARP SPK_N 33 pF 33 pF Module Figure 28: Reference Design for Loudspeaker Interface 3.20.5. Design Considerations It is recommended to use the electret microphone with dual built-in capacitors (e.g. 10 pF and 33 pF) for filtering out RF interference, and thereby reducing TDD noise.
  • Page 72 Smart Module Series SC606T Series Hardware Design the reference design shown below. Figure 29: Reference Design for USB_BOOT SC606T_Series_Hardware_Design 71 / 116...

  • Page 73: Wi-Fi And Bt

    Smart Module Series SC606T Series Hardware Design Wi-Fi and BT The module provides a shared antenna interface ANT_WIFI/BT for Wi-Fi and Bluetooth (BT) functions. The interface impedance is 50 Ω. External antennas such as the PCB antenna, the sucker antenna, and the ceramic antenna can be connected to the module via the interface to provide Wi-Fi and BT functions.
  • Page 74 Smart Module Series SC606T Series Hardware Design 802.11g 54 Mbps 14 dBm ±2.5 dB 802.11n HT20 MCS0 15 dBm ±2.5 dB 802.11n HT20 MCS7 13 dBm ±2.5 dB 802.11n HT40 MCS0 14 dBm ±2.5 dB 802.11n HT40 MCS7 13 dBm ±2.5 dB 802.11a...

  • Page 75: Bt Function Overview

    Smart Module Series SC606T Series Hardware Design 802.11n HT20 MCS7 -69 dBm 802.11n HT40 MCS0 -85 dBm 802.11n HT40 MCS7 -67 dBm 802.11a 6 Mbps -90 dBm 802.11a 54 Mbps -71 dBm 802.11n HT20 MCS0 -86 dBm 802.11n HT20 MCS7...

  • Page 76: Bt Performance

    Smart Module Series SC606T Series Hardware Design Table 27: BT Data Rate and Versions Version Data rate Maximum Application Throughput 1 Mbit/s > 80 kbit/s 2.0+EDR 3 Mbit/s > 80 kbit/s 3.0+HS 24 Mbit/s Refer to 3.0+HS 24 Mbit/s Refer to 4.0 LE 60 Mbit/s Refer to 4.2 LE...

  • Page 77: Gnss

    Smart Module Series SC606T Series Hardware Design GNSS The module integrates a GNSS engine (Gen 8C) which supports multiple positioning and navigation systems including GPS, GLONASS, and BeiDou. With an embedded LNA, the positioning accuracy of the module has been significantly improved.
  • Page 78 Smart Module Series SC606T Series Hardware Design ⚫ In user systems, GNSS RF signal traces and RF components should be placed far away from high-speed circuits, switched-mode power supplies, power inductors, the clock circuit of single-chip microcomputers, etc. ⚫ For applications with a harsh electromagnetic environment or high ESD-protection requirements, it is recommended to add ESD protection diodes for the antenna interface.

  • Page 79: Antenna Interfaces

    Smart Module Series SC606T Series Hardware Design Antenna Interfaces The module provides five antenna interfaces for five types of antennas: the main antenna, the Rx-diversity/MIMO antenna, the GNSS antenna, the Wi-Fi/BT antenna and the FM antenna. Each antenna port has an impedance of 50 Ω.
  • Page 80 Smart Module Series SC606T Series Hardware Design LTE-FDD B5 869–894 824–849 LTE-FDD B8 925–960 880–915 LTE-FDD B11 1476–1496 1428–1448 LTE-FDD B18 860–875 815–830 LTE-FDD B19 875–890 830–845 LTE-FDD B21 1496–1511 1448–1463 LTE-FDD B26 758–788 703–733 LTE-FDD B28A 758–788 703–733 LTE-FDD B28B 773–803...
  • Page 81 Smart Module Series SC606T Series Hardware Design LTE-FDD B4 2110–2155 1710–1755 LTE-FDD B5 869–894 824–849 LTE-FDD B7 2620–2690 2500–2570 LTE-FDD B8 925–960 880–915 LTE-FDD B20 791–821 832–862 LTE-FDD B28A 758–788 703–733 LTE-FDD B28B 773–803 718–748 LTE-TDD B38 2570–2620 2570–2620 LTE-TDD B40 2300–2400...

  • Page 82: Reference Design For Main And Rx-Diversity Antenna Interfaces

    Smart Module Series SC606T Series Hardware Design LTE-FDD B26 859–894 814–849 LTE-FDD B66 2110–2200 1710–1780 LTE-FDD B71 617–652 663–698 LTE-TDD B41 2496–2690 2496–2690 NOTE The bandwidth of LTE-TDD B41 for SC606T-EM, SC606T-JP, SC606T-NAD is 200 MHz (2496–2690 MHz), and the corresponding uplink EARFCN ranges from 39650 to 41589.

  • Page 83: Reference Designs For Rf Layouts

    Smart Module Series SC606T Series Hardware Design 6.1.2. Reference Designs for RF Layouts For the user’s PCB, the characteristic impedance of all RF traces should be controlled to 50 Ω. The impedance of the RF traces is usually determined by the trace width (W), the materials’ dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S).

  • Page 84: Wi-Fi/Bt And Fm Antenna Interfaces

    Smart Module Series SC606T Series Hardware Design Figure 34: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, the following principles should be complied with in RF layout design: ⚫ Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 Ω.

  • Page 85: Gnss Antenna Interface

    Smart Module Series SC606T Series Hardware Design Table 35: Wi-Fi/BT and FM Frequency Type Frequency Unit 2402–2482 802.11a/b/g/n/ac 5180–5825 BT 4.2 LE 2402–2480 76–108 The reference circuit designs for the Wi-Fi/BT antenna interface and the FM antenna interface are shown below.

  • Page 86: Reference Design For Passive Antenna

    Smart Module Series SC606T Series Hardware Design Table 36: Pin Definition of GNSS Antenna Pin Name Pin No. Description Comment 50 Ω impedance ANT_GNSS GNSS antenna Interface For test purpose only. GNSS_LNA_EN LNA enable control If unused, keep it open.

  • Page 87: Reference Design For Active Antenna

    Smart Module Series SC606T Series Hardware Design 6.3.2. Reference Design for Active Antenna The active antenna is powered by a 56 nH inductor through the antenna's signal path. The common power supply voltage ranges from 3.3 V to 5.0 V. Featuring low power consumption, the active antenna requires a stable and clean power.

  • Page 88: Recommended Rf Connector For Antenna Installation

    Smart Module Series SC606T Series Hardware Design Polarization Type: Vertical Cable Insertion Loss: < 1 dB (GSM850, EGSM900, WCDMA B5/B6/B8/B19, LTE B5/B8/B12/B13/B14/B17/B18/B19/B20/B26/B28A/B28B/B71) Cable Insertion Loss: < 1.5 dB (DCS1800, PCS1900, WCDMA B1/B2/B4, LTE B1/B2/B3/B4/B11/B21/B25/B34/B39/B66) Cable Insertion Loss: < 2 dB (LTE-FDD B7, LTE-TDD B38/B40/B41) VSWR: ≤...
  • Page 89 Smart Module Series SC606T Series Hardware Design Figure 39: Dimensions of the U.FL-R-SMT Connector (Unit: mm) The U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 40: Mechanicals of U.FL-LP Connectors The following figure describes the form factor of the mated connectors.
  • Page 90 Smart Module Series SC606T Series Hardware Design Figure 41: Form Factor of Mated Connectors (Unit: mm) For more details, please visit http://www.hirose.com. SC606T_Series_Hardware_Design 89 / 116...

  • Page 91: Reliability, Electrical And Radio Characteristics

    Smart Module Series SC606T Series Hardware Design Reliability, Electrical and Radio Characteristics 7.1. Absolute Maximum Ratings The absolute maximum ratings of the power and voltage supplied to the digital and analog pins of the module are listed in the following table.

  • Page 92: Operating And Storage Temperatures

    Smart Module Series SC606T Series Hardware Design Peak supply current Maximum power control level (during a VBAT at EGSM900 transmission slot) USB_VBUS Supply voltage of a VRTC 3.25 backup battery 7.3. Operating and Storage Temperatures The operating and storage temperatures are listed in the following table.
  • Page 93 Smart Module Series SC606T Series Hardware Design @ DRX=8 Sleep (USB disconnected) @ DRX = 9 Sleep (USB disconnected) 4.13 @ DRX = 6 LTE-FDD supply current Sleep (USB disconnected) 3.15 @ DRX = 8 Sleep (USB disconnected) 3.95 @ DRX = 6...
  • Page 94 Smart Module Series SC606T Series Hardware Design LTE-FDD B19 @ max power LTE-FDD B21 @ max power LTE-FDD B26 @ max power LTE-FDD B28A @ max power LTE-FDD B28B @ max power LTE-TDD B41 @ max power Table 43: SC606T-EM Current Consumption...
  • Page 95 Smart Module Series SC606T Series Hardware Design EGSM900 @ PCL 5 EGSM900 @ PCL 12 EGSM900 @ PCL 19 DCS1800 @ PCL 0 DCS1800 @ PCL 7 DCS1800 @ PCL 15 PCS1900 @ PCL 0 PCS1900 @ PCL 7 PCS1900 @ PCL 15...
  • Page 96 Smart Module Series SC606T Series Hardware Design DCS1800 (4UL/1DL) @ PCL 0 PCS1900 (1UL/4DL) @ PCL 0 PCS1900 (2UL/3DL) @ PCL 0 PCS1900 (3UL/2DL) @ PCL 0 PCS1900 (4UL/1DL) @ PCL 0 GSM850 (1UL/4DL) @ PCL 8 GSM850 (2UL/3DL) @ PCL 8...

  • Page 97: Rf Output Power

    Smart Module Series SC606T Series Hardware Design B8 (HSDPA) @ max power B1 (HSUPA) @ max power B2 (HSUPA) @ max power B4 (HSUPA) @ max power B5 (HSUPA) @ max power B8 (HSUPA) @ max power LTE-FDD B1 @ max power...
  • Page 98 Smart Module Series SC606T Series Hardware Design Table 44: SC606T-JP RF Output Power Frequency Max. Min. WCDMA B1 24 dBm +1/-3 dB < -49 dBm WCDMA B6 24 dBm +1/-3 dB <- 49 dBm WCDMA B8 24 dBm +1/-3 dB <...
  • Page 99 Smart Module Series SC606T Series Hardware Design WCDMA B1 24 dBm +1/-3 dB < -49 dBm WCDMA B2 24 dBm +1/-3 dB < -49 dBm WCDMA B4 24 dBm +1/-3 dB < -49 dBm WCDMA B5 24 dBm +1/-3 dB <...

  • Page 100: Rf Receiving Sensitivity

    Smart Module Series SC606T Series Hardware Design LTE-FDD B4 23 dBm ±2 dB < -39 dBm LTE-FDD B5 23 dBm ±2 dB < -39 dBm LTE-FDD B7 23 dBm ±2 dB < -39 dBm LTE-FDD B12 23 dBm ±2 dB <...
  • Page 101 Smart Module Series SC606T Series Hardware Design WCDMA B8 -109.5 -109.5 -111 -104.7 dBm WCDMA B19 -109.5 -108 -110.5 -106.7 dBm LTE-FDD B1 (10 MHz) -99.5 -96.3 dBm LTE-FDD B3 (10 MHz) -99.5 -93.3 dBm LTE-FDD B5 (10 MHz) -94.3 dBm LTE-FDD B8 (10 MHz) -99.5...
  • Page 102 Smart Module Series SC606T Series Hardware Design WCDMA B5 -109.5 -108 -110.5 -104.7 dBm WCDMA B8 -109 -109 -110.5 -104.7 dBm LTE-FDD B1 (10 MHz) -100 -96.3 dBm LTE-FDD B2 (10 MHz) -100 -94.3 dBm LTE-FDD B3 (10 MHz) -96.5 -96.5...

  • Page 103: Electrostatic Discharge

    Smart Module Series SC606T Series Hardware Design LTE-FDD B7 (10 MHz) -94.3 dBm LTE-FDD B12 (10 MHz) -97.5 -98.5 -93.3 dBm LTE-FDD B13 (10 MHz) -95.5 -97.5 -93.3 dBm LTE-FDD B14 (10 MHz) -93.3 dBm LTE-FDD B17 (10 MHz) -93.3 dBm LTE-FDD B25 (10 MHz) -92.8 dBm...

  • Page 104: Mechanical Dimensions

    Smart Module Series SC606T Series Hardware Design Mechanical Dimensions This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimension tolerances are ±0.05 mm unless otherwise specified. 8.1. Mechanical Dimensions of the Module...
  • Page 105 Smart Module Series SC606T Series Hardware Design Figure 43: Bottom Dimensions (Perspective View) NOTE The package warpage level of the module conforms to JEITA ED-7306 standard. SC606T_Series_Hardware_Design 104 / 116...

  • Page 106: Recommended Footprint

    Smart Module Series SC606T Series Hardware Design 8.2. Recommended Footprint Figure 44: Recommended Footprint (Perspective View) NOTES For easy maintenance of the module, keep about 3 mm between the module and other components on the host PCB. All RESERVED pins should be kept open and MUST NOT be connected to ground.

  • Page 107: Top And Bottom Views Of The Module

    8.3. Top and Bottom Views of the Module Figure 45: Top and Bottom Views NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. SC606T_Series_Hardware_Design 106 / 116...

  • Page 108: Storage, Manufacturing And Packaging

    Smart Module Series SC606T Series Hardware Design Storage, Manufacturing and Packaging 9.1. Storage The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: The temperature should be 23 ±5 °C and the relative humidity should be 35–60%.

  • Page 109: Manufacturing And Soldering

    Smart Module Series SC606T Series Hardware Design NOTES This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. 2. To avoid blistering, layer separation and other soldering issues, it is forbidden to expose the module to the air for a long time. If the temperature and moisture do not conform to IPC/JEDEC J-STD-033 or the relative moisture is over 60%, It is recommended to start the solder reflow process within 24 hours after the package is removed.

  • Page 110: Packaging

    PCB or shielding cover, and prevent the coating material from flowing into the module 9.3. Packaging SC606T series module is packaged in tape and reel carriers. Each reel is 330 mm in diameter and contains 200 modules. The following figures show the package details, measured in mm. SC606T_Series_Hardware_Design...
  • Page 111 Smart Module Series SC606T Series Hardware Design Figure 47: Tape Dimensions Figure 48: Reel Dimensions Table 52: Reel Packaging Model Name MOQ for MP Minimum Package: 200 pcs Minimum Package × 4 = 800 pcs Size: 398 mm × 383 mm × 83 mm Size: 420 mm ×...
  • Page 112 Smart Module Series SC606T Series Hardware Design Appendix A References Table 53: Related Documents Document Name Description Quectel_Smart_EVB-G2_User_Guide EVB User Guide for SC606T Series Quectel_SC606T_Series_GPIO_Configuration GPIO Configuration of SC606T Series Quectel_RF_Layout_Application_Note RF Layout Application Note Quectel_Module_Secondary_SMT_User_Guide Module Secondary SMT User Guide...
  • Page 113 Smart Module Series SC606T Series Hardware Design Downlink Discontinuous Reception Digital Signal Processor Electret Condenser Microphone Enhanced Data Rate Enhanced Full Rate EGSM Extended GSM900 band (includes standard GSM900 band) Eccentric Rotating Mass eSCO Extended Synchronous Connection Oriented Electrostatic Discharge...
  • Page 114 Smart Module Series SC606T Series Hardware Design Liquid Crystal Display LCD Module Light Emitting Diode Land Grid Array Low Noise Amplifier Linear Resonant Actuator LTE-TDD Long-Term Evolution Time-Division Duplex Medium Access Control Modulation and Coding Scheme MEMS Micro-Electro-Mechanical System MIMO...
  • Page 115 Smart Module Series SC606T Series Hardware Design Red-Green-Blue Relative Humidity RHCP Right Hand Circularly Polarized Real Time Clock Request to Send Receive Synchronous Connection Oriented Short Message Service Serial Peripheral Interface Station Time Division Distortion Terminal Equipment Touch Panel Transmitting Direction UART Universal Asynchronous Receiver &...
  • Page 116 Smart Module Series SC606T Series Hardware Design Minimum Output High Level Voltage Value Maximum Output Low Level Voltage Value VSWR Voltage Standing Wave Ratio WCDMA Wideband Code Division Multiple Access WLAN Wireless Local Area Network WLED White Light-Emitting Diode WUXGA...
  • Page 117 Smart Module Series SC606T Series Hardware Design Appendix B GPRS Coding Schemes Table 55: Description of Different Coding Schemes Scheme CS-1 CS-2 CS-3 CS-4 Code Rate Pre-coded USF Radio Block excl.USF and BCS Tail Coded Bits Punctured Bits Data Rate Kb/s 9.05...
  • Page 118 Smart Module Series SC606T Series Hardware Design Appendix C GPRS Multi-slot Classes Thirty-three classes of GPRS multi-slot modes are defined for MS in GPRS specifications. The multi-slot class varies from product to product, and determines the maximum achievable data rates in both uplink and downlink directions.
  • Page 119 Smart Module Series SC606T Series Hardware Design SC606T_Series_Hardware_Design 118 / 116...
  • Page 120 Smart Module Series SC606T Series Hardware Design Appendix D EDGE Modulation and Coding Schemes Table 57: EDGE Modulation and Coding Schemes Coding Modulation Coding Family 1 Timeslot 2 Timeslot 4 Timeslot Schemes MCS-1 GMSK 8.80 kbps 17.60 kbps 35.20 kbps...

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