Quectel SG560D Series Hardware Design page 8

8 Storage, Manufacturing and Packaging ...................................................................................... 128
8.1. Storage Conditions ............................................................................................................. 128
8.2. Manufacturing and Soldering .............................................................................................. 129
8.3. Packaging Specification ...................................................................................................... 131
8.3.1. Injection Tray ............................................................................................................. 131
8.3.2. Packaging Process .................................................................................................... 132
9 Appendix References ................................................................................................................... 133
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