Quectel SG560D Series Hardware Design page 53

LDO18B_1V8 336
LDO17B_1V8 408
LDO12C_1V8 109
LDO8C_1V8 112
LDO3C_3V0 624
LDO2C_1V8 626
VRTC 312
USIM1_VDD 160
USIM2_VDD 172
SG560D_Series_Hardware_Design
1.8 V output
PO
(1.8 V output for I/O pull-up)
1.8 V output
PO
(1.8 V output for I/O power supply)
1.8 V output
PO (1.8 V output for I/O power supply
of LCM)
1.8 V output
PO
(1.8 V output for sensors)
3.0 V output
PO
(reserved power)
1.8 V output
PO
(reserved power)
PIO Power supply for RTC
PO (U)SIM1 card power supply
PO (U)SIM2 card power supply
Smart Module Series
Keep on.
When using it, it is
recommended to add
1–4.7 μF bypass
capacitors with a total
capacitance not
exceeding 14.1 μF.
When using it, it is
recommended to add
1–4.7 μF bypass
capacitors with a total
capacitance not
exceeding 18.8 μF.
When using it, it is
recommended to add
1–4 μF bypass
capacitors with a total
capacitance not
exceeding 4 μF.
When using it, it is
recommended to add
1–4.7 μF bypass
capacitors with a total
capacitance not
exceeding 18.8 μF.
When using them, it
is recommended to
add 1–4 μF bypass
capacitors with a total
capacitance not
exceeding 4 μF.
Either 1.8 V or 2.95 V
(U)SIM card is
supported and can be
identified
automatically by the
module.
When using them, it
is recommended to
add bypass
capacitors with a total
capacitance not
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