Intel® Server D50DNP Family Integration and Service Guide
2.2 Processor Assembly and Installation
2.2.1
Heat Sinks
The Intel® D50DNP air-cooled modules support 1U height heat sinks and 2U height heat sinks as shown in
the following figures. The compute module uses 1U height heat sinks. The management module and PCIe*
accelerator module use 2U height heat sinks.
Note: Heat sinks are only supported on air-cooled modules.
There are two types of 2U heat sinks: front heat sink and back heat sink. There are three types of 1U heat
sinks: front heat sink, back heat sink, and enhanced volume air cooling (EVAC) heat sink (front position only).
The heat sinks are shown in the following figures. The front heat sink type is used for CPU 0 and the back
heat sink type is used for CPU 1. The exploded views in the figures show the difference. The back heat sink
types have more heat venting fins.
Note: Heat sinks are not interchangeable. The descriptions provided earlier must be followed.
Figure 6. 1U Supported Standard Processor Heat Sinks
The EVAC heat sink is only used in the front for CPU 0. The compute module supporting the EVAC heat sink
uses the standard back heat sink for CPU 1.
Figure 7. 1U Supported EVAC Processor Heat Sinks
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