Module And Chassis Specific Features; Table 5. 1U Compute Module Specific Features - Intel D50DNP Series Integration And Service Manual

6.6

Module and Chassis Specific Features

Intel® Server Board D50DNP1SB defines many characteristics of the modules. The following tables show
module-specific characteristics only. Refer to the board specification table in the previous section for
common family features.
Feature
Maximum
• Up to 350 W (D50DNP1MHCPLC)
Processor Thermal • Up to 270 W (D50DNP1MHEVAC)
Design Power (TDP) • Up to 250 W (D50DNP1MHCPAC)
• Up to 16 DDR5 RDIMMs or 8 DDR5 RDIMMs plus 8 Intel® Optane™ PMem 300 series modules in air-
Memory Support
• 16 DDR5 RDIMMs in liquid-cooled modules
Expansion Options
Riser Slot 1 supports 1U single PCIe* slot riser card assembly (iPC DNP1UMRISER)
• with single PCIe 5.0 x16 slot supporting one low profile PCIe add-in card.
• PCIe 5.0 lanes routed from CPU 1 through an MCIO* cable.
Riser Slot 2 supports 1U single PCIe slot riser card assembly (iPC DNP1URISER)
• with single PCIe 5.0 x16 slot supporting one low profile PCIe add-in card.
Riser Slots
• PCIe 5.0 lanes routed from CPU 0.
• D50DNP1MHEVAC does not support a low-profile PCIe add-in card in Riser Slot 2 because the EVAC
extension occupies this space. M.2 SSD is still supported in Riser Slot 2.
• Each 1U riser can accommodate one SATA or PCIe 3.0 NVMe* 80/110mm M.2 SSD drive. SATA and PCIe
lanes are routed from the Intel® C741 chipset
• The PCIe slots in 1U riser cards provide up to 25 W of power.
• PCIe lanes routed from processor/chipset support Intel® VMD.
Intel® Server D50DNP Family Integration and Service Guide

Table 5. 1U Compute Module Specific Features

cooled modules
Description
107