Processor Heat Sink Module (Phm); Rd Gen Intel® Xeon® Scalable Processor Family - Platinum, Gold - H, Hl; Figure 23. Processor Heat Sink Module (Phm) Assembly - Intel M70KLP Series Technical Product Specification

Intel® Server System M70KLP Family Technical Product Specification
4.1

Processor Heat Sink Module (PHM)

Processors in this system are part of an assembly referred to as a PHM (Processor Heat sink Module). A PHM
consists of a processor, a processor carrier clip, and the processor heat sink, which is preassembled into a
single module before placement onto the processor socket assembly on the server board. The PHM concept
reduces the risk of damaging pins within the processor socket during the installation process. Reference the
Intel® Server System M70KLP Service Guide for complete PHM assembly and installation instructions.

Figure 23. Processor Heat Sink Module (PHM) Assembly

rd
4.2 3 Gen Intel® Xeon® Scalable Processor Family – Platinum, Gold – H, HL
The Intel® Server System M70KLP product family supports the 3 rd Gen Intel® Xeon® Scalable processor
family. Within this processor family, only Platinum and Gold processor SKUs that end in H or HL with a TDP
of ≤ 250W will be supported. All other processor SKUs within the 3 rd Gen Intel® Xeon® Scalable processor
family and all previous generation Intel® Xeon® processors are not supported.
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