Processor Replacement For Liquid-Cooled Configurations; Figure 162. Removing Screws On Top Of Processor Cold Plate; Figure 163. Removing The Velcro* Tape In The Middle Of The Cold Plates - Intel D50DNP Series Integration And Service Manual

7.3.3

Processor Replacement for Liquid-Cooled Configurations

Components Required for Each Processor
4 th Gen Intel® Xeon® Scalable processor in the shipping tray
•
• Matching processor carrier clip
Existing processor cold plate
•
New thermal interface material (TIM) Dow Corning TC-5622*
•
Required Tools and Supplies
• Anti-static wrist strap and conductive workbench pad (recommended)
ESD gloves (recommended)
•
Adjustable torque T30 Torx* screwdriver
•
• D50TNP liquid-cooling VR TIM application tools (iPC TNPLCVRTLS)
D50TNP liquid-cooling VR TIM application nozzles (iPC TNPLCVRTNZ)
•
• D50TNP liquid-cooling VR TIM compound (iPC TNPLCVRCMPD)
Caution: Full ESD precautions should be followed to perform assembly and installation of the PHM to the
server board. Wear ESD gloves to prevent electrostatic damage and oxidation or foreign materials on
processor package and land pads.
1. Remove the screws and the clips that hold the outer hoses on top of the processor cold plate
(see Letter A).

Figure 163. Removing the Velcro* Tape in the Middle of the Cold Plates

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Intel® Server D50DNP Family Integration and Service Guide

Figure 162. Removing Screws on Top of Processor Cold Plate