Bond-Prime Hardware - Leica BOND-PRIME User Manual

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In this section:
1.1 About the BOND System
1.2 The BOND-PRIME Processing Module
1.3 The Hood
1.4 Preload and Unload Drawers
1.5 Slide Drawer Inserts, Waste Drains and Sumps, and Pickup Filter
1.6 Reagent Platform
1.7 Bulk Containers
1.8 Reservoir Cabinet
1.9 AC power switch
1.10 Reagent Trays
1.11 The Work Surface (under the Hood)
1.12 Work Surface (front view)
1.13 Connect the processing module and switch on
1.14 Disconnect the processing module
1.15 Move a processing module to a new location
1.16 Decommission and dispose of a processing module
BOND-PRIME User Manual, 91.7500.501 A07
Copyright © 2023 Leica Biosystems Melbourne Pty Ltd

BOND-PRIME hardware

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