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v Additional thermal grease is not added to the existing thermal grease on the heat
Notes:
v Read the safety information on page vii.
v Read the "Installation guidelines" on page 275.
v Read "Handling static-sensitive devices" on page 277.
To replace damaged or contaminated thermal grease on the microprocessor and
heat sink, complete the following steps:
1. Place the heat sink on a clean work surface.
2. Remove the cleaning pad from its package and unfold it completely.
3. Use the cleaning pad to wipe the thermal grease from the bottom of the heat
4. Use a clean area of the cleaning pad to wipe the thermal grease from the
5. Use the thermal-grease syringe to place 9 uniformly spaced dots of 0.02 mL
6. Install the heat sink onto the microprocessor as described in 8 on page 333.
Removing the system-board tray
Notes:
1. Before you replace the system-board tray, make sure that you backup any
sink and microprocessor.
sink.
Note: Make sure that all of the thermal grease is removed.
microprocessor; then, dispose of the cleaning pad after all of the thermal grease
is removed.
Microprocessor
each on the top of the microprocessor. The outermost dots must be within
approximately 5 mm of the edge of the microprocessor; this is to ensure uniform
distribution of the grease.
Note: If the grease is properly applied, approximately half of the grease will
remain in the syringe.
features on demand (FoD) keys that were enabled. Remember to re-enable the
features on demand (FoD) keys after installing the new system-board tray. For
more information on Features on Demand (FoD), including instructions for
automating the activation and installation of the activation key by using IBM
0.02 mL of thermal
grease
Chapter 5. Removing and replacing server components
335
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