Absolute Maximum Ratings; Order Information; Pin Configuration - Analog Devices Linear LTM 4700 User Manual

Dual 50a or single 100a µmodule regulator with digital power system management
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LTM4700

ABSOLUTE MAXIMUM RATINGS

(Note 1)
Terminal Voltages:
+
V
(Note 4), SV
, I
, I
INn
IN
IN
SW0, SW1 .................. −1V to 18V, −5V to 25V Transient
V
........................................................ –0.3V to 3.6V
OUTn
INTV
, V
.............................................. –0.3V to 6V
CC
BIAS
+
+
V
, V
......................................... –0.3V to 6V
OSNS0
OSNS1
V
, V
...................................... –0.3V to 0.3V
OSNS0
OSNS1
RUNn, SDA, SCL, ALERT ........................... –0.3V to 5.5V
F
, V
, V
SWPH_CFG
OUTn_CFG
TRIMn_CFG
FAULTn, SYNC, SHARE_CLK, WP,
PGOOD0, PGOOD1 .................................... −0.3V to 3.6V
+
+
(SV
– IN
), (I
– I
) ......................... –0.3V to +0.3V
IN
IN
IN
COMPna, COMPnb, .................................. –0.3V to 2.7V
TSNS0a, TSNS1a ...................................... –0.3V to 2.2V
TSNS0b, TSNS1b ...................................... –0.3V to 0.8V
RUNP ........................................................ –0.3V to SV
Temperatures
Internal Operating Temperature Range
(Notes 2, 13, 17, 18) ............................... –40°C to 125°C
Storage Temperature Range .................. –55°C to 125°C
Peak Solder Reflow Package Body Temperature ... 245°C

ORDER INFORMATION

PART NUMBER
PAD OR BALL FINISH
LTM4700EY#PBF
SAC305 (RoHS)
LTM4700IY#PBF
LTM4700IY
SnPb (63/37)
• Contact the factory for parts specified with wider operating temperature
ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609.
4
...................... –0.3V to 18V
IN
, ASEL ...–0.3V to 2.75V
PART MARKING*
DEVICE
LTM4700Y
LTM4700Y
LTM4700Y
For more information

PIN CONFIGURATION

1
2
3
4
5
A
B
C
D
E
SW1
F
G
H
J
K
L
GND
M
N
IN
P
R
T
U
SW0
V
W
Y
AA
AB
1
2
3
4
5
330-PIN (15mm × 22mm × 7.87mm)
T
= 125°C, θ
= 3.1°C/W, θ
JMAX
JCtop
θ VALUES DETERMINED PER JESD51-12
PACKAGE
FINISH CODE
TYPE
e1
BGA
e0
BGA
Recommended LGA and BGA PCB Assembly and Manufacturing
Procedures
LGA and BGA Package and Tray Drawings
www.analog.com
TOP VIEW
6
7
8
9
10
11
12
13
14
GND
GND
GND
GND
GND
GND
GND
GND
GND
V
V
IN1
GND
GND
GND
OUT1
GND
GND
GND
GND
GND
GND
GND
V
GND
GND
GND TSNS1b
DD25
V
V
ASEL FAULT1 FAULT0 SDA
TRIM1_CFG
OUT1_CFG
WP V
V
FSWPH_CFG RUN0 ALERT
SCL
TRIM0_CFG
OUT0_CFG
SHARE_CLK V
GND
GND
RUN1 TSNS0a SYNC
DD33
COMP1a COMP1b
TSNS1a GND
+
SGND
V
V
COMP0b GND
OSNS1
OSNS1
GND PGOOD1 GND
GND
GND COMP0a V
OSNS0
GND
GND
GND
GND
GND
I
V
IN
OSNS0
GND
INTV
GND
GND
I
+
PGOOD0
CC
IN
GND
GND
V
GND
GND TSNS0b
BIAS
GND
GND
GND
V
V
SV
GND
GND
IN0
OUT0
IN
GND
GND
GND
GND
RUNP
GND
GND
GND
GND
GND
GND
GND
6
7
8
9
10
11
12
13
14
BGA PACKAGE
= 1°C/W, θ
= 1.75°C/W, θ
JCbottom
JB
JA
WEIGHT = 9.5g
MSL
TEMPERATURE RANGE
RATING
(SEE NOTE 2)
4
–40°C to 125°C
4
–40°C to 125°C
15
GND
GND
+
15
= 8.5°C/W
Rev. B

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