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LTM4683
ABSOLUTE MAXIMUM RATINGS
(Note 1)
Terminal Voltages
V
(Note 4), SV
, I
INnn
IN_nn
V
, RUNP ........................................ –0.3V to 16V
IN_VBIAS
+
(SV
– I
), (I
IN_nn
IN_nn
IN_nn
SWn ............................ −1V to 16V, −5V to 16V Transient
INTV
, V
......................................... –0.3V to 6V
CC_nn
BIAS
V
.........................................................–0.3V to 1.0V
OUTn
+
V
......................................................–0.3V to 1.0V
OSNSn
−
V
..................................................... –0.3V to 0.3V
OSNSn
RUNn, SDA_nn, SCL_nn, ALERT_nn ......... –0.3V to 5.5V
FSWPH_nn_CFG, VOUTn_CFG,
VTRIMn_CFG, ASEL_nn .......................... –0.3V to 2.75V
FAULTn, SYNC_nn, SHARE_CLK_nn,
WP_nn, PGOODn ...................................... −0.3V to 3.6V
COMPna, COMPnb .................................... –0.3V to 2.7V
TSNSn ....................................................... –0.3V to 0.8V
n = 0, 1, 2, 3 and nn = 01, 23
V
and V
are outputs not to be driven.
DD33_nn
DD25_nn
Temperatures
Internal Operating Temperature Range
(Notes 2, 13, 15, 16) ............................... –40°C to 125°C
Storage Temperature Range .................. –55°C to 125°C
Peak Solder Reflow Package Body Temperature ... 245°C
ORDER INFORMATION
PART NUMBER
PAD OR BALL FINISH
LTM4683EY#PBF
SAC305 (RoHS)
LTM4683IY#PBF
SAC305 (RoHS)
• Contact the factory for parts specified with wider operating temperature
ranges. Pad or ball finish code is per IPC/JEDEC J-STD-609.
4
+
−
, I
,
IN_nn
IN_nn
+
−
– I
) ....... –0.3V to 0.3V
IN_nn
PART MARKING
DEVICE
LTM4683Y
LTM4683Y
For more information
PIN CONFIGURATION
1
2
VTRIM1_CFG
V
DD25_01
SW0
SHARE_CLK_01
VTRIM0_CFG
V
DD33_01
–
V
OSNS1
COMP1b
+
V
OSNS1
COMP1a
SW1
PGOOD1
PGOOD0
SV
IN_01
INTV
CC_01
V
IN_VBIAS
+
V
OSNS2
SW2
–
V
OSNS2
COMP2a
COMP2b
TSNS2
SDA_23
SYNC_23
SW3
ALERT_23
SCL_23
RUN3
T
= 125°C, θ
JMAX
NOTES:
1) θ VALUES ARE DETERMINED BY SIMULATION PER JESD51 CONDITIONS, WEIGHT = 6.4g (TYP .).
2) θ
VALUE IS OBTAINED WITH DEMO BOARD.
JA
3) SEE THERMAL CONSIDERATIONS AND OUTPUT CURRENT DERATING FOR LAB MEASUREMENT
AND DERATING INFORMATION.
PACKAGE
FINISH CODE
TYPE
e1
BGA
e1
BGA
•
Recommended LGA and BGA PCB Assembly and Manufacturing
Procedures
•
LGA and BGA Package and Tray Drawings
www.analog.com
TOP VIEW
3
4
5
6
7
8
9
10 11 12 13 14
15
V
GND
OUT0
SDA_01
V
SCL_01
IN01
WP_01
V
OUT1
GND
GND
V
RUNP
BIAS
–
IN_23
+
V
V
IN_23
IN23
OUT2
TSNS3
RUN2
V
GND
OUT3
BGA PACKAGE
330-PIN (15mm × 22mm × 5.71mm)
= 2.8°C/W, θ
= 1.4°C/W, θ
= 4.73°C/W
JCtop
JCbottom
JA
MSL
TEMPERATURE RANGE
RATING
(SEE NOTE 2)
4
–40°C to 125°C
4
–40°C to 125°C
A
B
ALERT_01
C
SYNC_01
D
TSNS1
TSNS0
E
SGND_01
F
G
COMP0a
COMP0b
H
–
V
OSNS0
+
IN_01
J
+
V
OSNS0
–
IN_01
K
L
M
N
INTV
CC_23
SV
IN_23
P
R
+
V
OSNS3
PGOOD2
T
–
V
OSNS3
PGOOD3
U
SGND_23
V
COMP3a
FAULT2
W
COMP3b
FAULT3
Y
WP_23
V
DD33_23
AA
AB
Rev. 0
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