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AD5100
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
V
to GND
1MON
V
to GND
2MON
V
to GND
3MON
V
to GND
4MON
V
to GND
OTP
Digital Input Voltage to GND
(MR, WDI, SCL, SDA, AD0)
Digital Output Voltage to GND
(RESET, V
, SHDNWARN)
4OUT
Digital Output Voltage to GND (SHDN)
Operating Temperature Range
Storage Temperature Range
ESD Rating (HBM)
Maximum Junction Temperature (T
1
Power Dissipation
3
Thermal Impedance
θ
Junction-to-Ambient
JA
θ
Junction-to-Case
JC
IR Reflow Soldering (RoHS-Compliant Package)
Peak Temperature
Time at Peak Temperature
Ramp-Up Rate
Ramp-Down Rate
Time from 25°C to Peak Temperature
1
Values relate to the package being used on a 4-layer board.
2
T
= ambient temperature.
A
3
Junction-to-case resistance is applicable to components featuring a
preferential flow direction, for example, components mounted on a
heat sink. Junction-to-ambient resistance is more useful for air-cooled
PCB-mounted components.
Rating
−0.3 V, +33 V
−0.3 V, +33 V
−0.3 V, +7 V
−0.3 V, +33 V
−0.3 V, +7 V
0 V, +7 V
0 V, +7 V
0 V, +33 V
−40°C to +125°C
−65°C to +150°C
3.5 kV
)
150°C
Jmax
2
(T
− T
)/θ
Jmax
A
JA
105.44°C/W
38.8°C/W
260°C (+0°C)
20 sec to 40 sec
3°C/sec max
−6°C/sec max
8 minutes max
Rev. A | Page 8 of 36
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
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