Samsung MultiXpress M5370 Series Service Manual page 3

2.6.2. Fuser unit drive ........................................................................................................... 2 − 41
2.6.3. Fuser unit temperature control........................................................................................ 2 − 42
2.7. Laser Scanning Unit (LSU)........................................................................................................ 2 − 43
2.7.1. LSU overview............................................................................................................. 2 − 43
2.7.2. Laser Scanning Optical path .......................................................................................... 2 − 45
2.7.3. Laser synchronizing detectors ........................................................................................ 2 − 46
2.8. Drive System .......................................................................................................................... 2 − 48
2.8.1. Drive Motors .............................................................................................................. 2 − 48
2.8.2. Main Drive Unit.......................................................................................................... 2 − 49
2.8.2.1.
2.8.2.2.
2.8.3. Fuser_Exit Drive ......................................................................................................... 2 − 52
2.9. Scanner System ....................................................................................................................... 2 − 53
2.9.1. Scanner System overview ............................................................................................. 2 − 53
2.9.2. Scanning System Components ....................................................................................... 2 − 54
2.10. Dual Scan Document Feeder(DSDF) (M5370LX_M4370LX) .......................................................... 2 − 55
2.10.1. DSDF(Dual Scan Document Feeder) overview.................................................................. 2 − 55
2.10.2. Electrical parts location ................................................................................................ 2 − 56
2.10.3. DSDF Drive System .................................................................................................... 2 − 58
2.11. Reverse Automatic Document Feeder(RADF) (M5360RX).............................................................. 2 − 60
2.11.1. RADF overview .......................................................................................................... 2 − 60
2.11.2. Electrical parts location ................................................................................................ 2 − 61
2.11.3. RADF Drive System .................................................................................................... 2 − 63
2.12. Hardware Configuration ............................................................................................................ 2 − 67
2.12.1. Main board................................................................................................................. 2 − 70
2.12.2. MSOK ...................................................................................................................... 2 − 73
2.12.3. Fax Joint PBA ............................................................................................................ 2 − 74
2.12.4. Fax Card (Optional) ..................................................................................................... 2 − 74
2.12.5. FDI (Optional) ............................................................................................................ 2 − 75
2.12.6. OPE Hub PBA and OPE Joint Board............................................................................... 2 − 76
2.12.7. SMPS board ............................................................................................................... 2 − 78
2.12.8. Fuser Drive Board (FDB).............................................................................................. 2 − 80
2.12.9. HVPS board ............................................................................................................... 2 − 81
2.12.10. Finisher PBA.............................................................................................................. 2 − 83
2.12.11. SCF_HCF board.......................................................................................................... 2 − 84
2.12.12. CRUM Joint PBA........................................................................................................ 2 − 84
2.12.13. Sub-Cassette PBA ....................................................................................................... 2 − 85
2.12.14. CRUM PBA .............................................................................................................. 2 − 85
2.12.15. Eraser PBA ................................................................................................................ 2 − 86
2.12.16. Fuser CRUM PBA....................................................................................................... 2 − 86
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Main Drive (OPC_Regi._Pick-up_MP_Duplex) .................................................. 2 − 50
Main Drive (Deve_Agitaitor_Toner Supply) ....................................................... 2 − 51
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