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Table 70. Particulate contamination specifications (continued)
Particulate contamination
Table 71. Gaseous contamination specifications
Gaseous contamination
Copper Coupon Corrosion rate
Silver Coupon Corrosion rate
NOTE:
Maximum corrosive contaminant levels measured at ≤50% relative humidity.
Thermal restriction matrix
Table 72. Thermal restriction matrix for processor and fans
Features, processor type
and specifications
Storage configuration
TDP (W)
150
Table 73. Thermal restriction matrix for GPGPU
Riser configurations
1A (Slot 1 Riser)
2C (Slot 1 Riser_PERC)
3A (Slot 1 Riser)
All (Slot 4 Riser)
Table 74. Thermal limitations of supported processors
CPU
HSK
Fan
TDP
type
type
6525
N, 24
Core,
Very
High
150 W
high
perform
perform
6244,
ance
ance
8
Core,
150 W
162
Technical specifications
Configuration type, and ambient temperature support
2 x 2.5-inch drives
Fan type: Very High Performance fan (VHP fan)
Ambient = 35°C
Yes (VHP fan)
Configuration type and ambient temperature support
2 x 2.5-inch drives
Fan type: Very High Performance fan (VHP fan)
Ambient = 30°C
VHP fan
VHP fan
VHP fan
VHP fan
Config 1A
ASHAR
ASHARE
ASHARE
E A4
A3
Not supported
Max 35°C
Specifications
NOTE:
This condition applies to data center and non-
data center environments.
Specifications
<300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
<200 Å/month as defined by ANSI/ISA71.04-2013
4 x 2.5-inch drives
Ambient = 35°C
Yes (VHP fan)
4 x 2.5-inch drives
VHP fan
VHP fan
VHP fan
VHP fan
Config 2C
ASHARE
ASHARE
A2
A4
A3
Not supported
6 x SSDs (EDSFF E1.L)
6 x SSDs (EDSFF E1.L)
Config 3A
ASHAR
ASHARE
ASHARE
E A2
A4
A3
Max
Not supported
35°C
ASHARE
A2
Max
35°C
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