Thermal Restriction Matrix; Gaseous Contamination Specifications; Thermal Restriction Matrix For Processor And Fans - Dell EMC XC Core XC6515 Installation And Service Manual

Table 81. Particulate contamination specifications (continued)
Particulate contamination
Conductive dust
Corrosive dust
Table 82. Gaseous contamination specifications
Gaseous contamination
Copper Coupon Corrosion rate
Silver Coupon Corrosion rate
NOTE: Maximum corrosive contaminant levels measured at ≤50% relative humidity.

Thermal restriction matrix

Table 83. Thermal restriction matrix for processor and fans
Configuration
Processor TDP
120 W
155 W
180 W
200 W
225 W
280 W
Specifications
Air must be free of conductive dust, zinc whiskers, or other
conductive particles.
•
•
Specifications
<300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
<200 Å/month as defined by ANSI/ISA71.04-2013
Processor cTDP Max
150 W
180 W
200 W
200 W
240 W
280 W
NOTE: Air filtering can also be accomplished by filtering
room air with MERV8 filter per ANSI/ASHARE Standard
127.
NOTE: This condition applies to data center and non-
data center environments.
NOTE: Common sources of conductive dust include
manufacturing processes, and zinc whiskers from the
plating on the bottom of raised floor tiles.
Air must be free of corrosive dust.
Residual dust present in the air must have a deliquescent point
less than 60% relative humidity.
NOTE: This condition applies to data center and non-
data center environments.
8 x 2.5-inch
STD fan
STD heat sink
STD fan
STD heat sink
STD fan
HPR heat sink
STD fan
HPR heat sink
HPR fan
HPR heat sink
HPR fan
HPR HSK with DIMM Blank
Technical specifications 141