Toshiba e-STUDIO281c Service Manual page 44

• LDR board:
This is the board on which the laser diode and the ASIC are mounted. The laser is emitted based on
the output image data signal from the ASIC on the LGC board.
• SNS board:
This is the board on which the light sensor for detecting the radiating position of the laser is
mounted.
It outputs the H-sync signal to the PWM (Pulse Width Modulator) on the LGC board.
• SFB board:
This is the board on which the circuit pattern is printed. It detects the position of the slide guide of the
bypass unit.
• ADU board:
This is the board to relay each signal between the ASIC on the LGC board and the electric parts
(motor, sensor, clutch) in the ADU.
• IH board:
This is the board to generate the electric power for driving the IH coil of the fuser unit from the AC
electric power input via the switching regulator. And then it is provided.
• DRV board:
This is the board on which the driver for driving the revolver motor, and exit motor are mounted.
• SYS board:
This is the main board taking a leading part in all systems. It consists of the System-CPU, ASIC,
memory (DIMM, Flash ROM, SRAM, NVRAM), RTC (Real Time Clock IC) etc. The System-CPU
controls each ASIC to perform the control of the image processing, image memory (page memory,
main memory, HDD), external interface (10/100 BASE-T/TX, USB, PCI, IEEE-1284), and FAX. And
based on the input data from the control panel, System-CPU communicates with Scanner-CPU on
the SLG board and Engine-CPU on the LGC board, and then issues an operation command to the
scanner and printer engine section.
• LGC board:
This is the board to mainly control the print function (printer engine). It consists of the Engine-CPU,
ASIC, memory (Flash ROM, SRAM, NVRAM), etc. The Engine-CPU controls each ASIC to drive I/O
(electrical parts) of each section in the system. It leads to the operation of the laser unit, revolver,
developer unit, drum, transfer belt, drawers, bypass unit, ADU, etc. And then the print is made.
• FIL board:
This is the board to cut off the noise of AC power from outside, and supply the driving AC power to
the damp heater for condensation prevention of each section (scanner and drum).
• HVT:
This is the board to generate the high voltage from +24V to provide the bias to the section of the
main charger, developer, and transfer.
• PS-ACC:
This is the unit to generate each DC voltage, which is used in the equipment, from external AC elec-
tric power input. And then it is provided to each electric part.
e-STUDIO281c/351c/451c OUTLINE OF THE MACHINE
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June 2005 © TOSHIBA TEC