Embedded Server Processor Thermal Profiles; Embedded Server Processor Elevated Tcase Sku Summary Table; Tcase: 8-Core Lv95W Thermal Specifications, Embedded Server Sku - Intel Xeon Processor E5-1600 Datasheet

Table 5-25. 4/2-Core 80W Thermal Profile Table 1U (Sheet 2 of 2)
5.1.4

Embedded Server Processor Thermal Profiles

Embedded server SKU's target operation at higher case temperatures and/or NEBS
thermal profiles for embedded communications server form factors. The thermal
profiles in this section pertain only to those specific SKU's. Network Equipment Building
System (NEBS) is the most common set of environmental design guidelines applied to
telecommunications equipment in the United States.
Digital Thermal Sensor (DTS) based thermal profiles are also provided for each
Embedded server SKU. The thermal solution is expected to be developed in accordance
with the Tcase thermal profile. Operational compliance monitoring of thermal
specifications and fan speed modulation may be done via the DTS based thermal
profile. The slope of a DTS profile assumes full fan speed which is not required over
much of the power range. At most power levels on embedded SKU's, temperatures of
the nominal profile are less than Tcontrol as indicated by the blue shaded region in each
DTS profile graph. As a further simplification, operation at DTS temperatures up to
Tcontrol is permitted at all power levels. Compliance to the DTS profile is required for
any temperatures exceeding Tcontrol.
Table 5-26. Embedded Server Processor Elevated Tcase SKU Summary Table
TDP SKU
LV95W-8C (8-core)
LV70W-8C (8-core)
5.1.4.1 8-Core LV95W Thermal Specifications
Table 5-27. Tcase: 8-Core LV95W Thermal Specifications, Embedded Server SKU
Core
Frequency
Launch to FMB
Notes:
1. These values are specified at V
the processor is not to be subjected to any static V
specified ICC. Please refer to the electrical loadline specifications in
2. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
3. These specifications are based on final silicon characterization.
4. Power specifications are defined at all VIDs found in
multiple VIDs for each frequency.
5. FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
132
Maximum T
Power (W)
75
80
Tcase Spec
Figure 5-28
Figure 5-30
Thermal Design
Power (W)
95
CC_MAX
Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families
Thermal Management Specifications
CASE
(°C)
4-core 4-core
68.8
70.0
DTS Spec
Figure 5-29
Figure 5-31
Minimum Maximum
T (°C) T
CASE CASE
5 See Figure 5-28
for all processor frequencies. Systems must be designed to ensure
and I combination wherein V
CC CC
Table 7-3. The processor may be delivered under
Maximum DTS (°C)
2-core
81.0 82.4
83.0 84.5
Notes
(°C)
and Table 5-28 1, 2, 3, 4, 5
exceeds V
CC CC_MAX
Section 7.8.1.
.
CASE
Datasheet Volume One
at