Pci Express; Thermal Management Support; Package Summary; Terminology - Intel Xeon Processor E5-1600 Datasheet

• Memory thermal monitoring via MEM_HOT_C01_N and MEM_HOT_C23_N Signals
1.3.4

PCI Express

• L0s is not supported
• L1 ASPM power management capability
1.3.5 Intel QuickPath Interconnect
• L0s is not supported
• L0p and L1 power management capabilities
1.4

Thermal Management Support

• Digital Thermal Sensor with multiple on-die temperature zones
• Adaptive Thermal Monitor
• THERMTRIP_N and PROCHOT_N signal support
• On-Demand mode clock modulation
• Open and Closed Loop Thermal Throttling (OLTT/CLTT) support for system memory
in addition to Hybrid OLTT/CLTT mode
• Fan speed control with DTS
• Two integrated SMBus masters for accessing thermal data from DIMMs
• New Memory Thermal Throttling features via MEM_HOT_C{01/23}_N signals
• Running Average Power Limit (RAPL), Processor and DRAM Thermal and Power
Optimization Capabilities
1.5

Package Summary

The processor socket is a 52.5 x 45 mm FCLGA package (LGA2011-0 land FCLGA10).
1.6

Terminology

ASPM
BMC
Cbo
DDR3
DMA
DMI
DMI2
DTS
ECC
20
Term
Active State Power Management
Baseboard Management Controllers
Cache and Core Box. It is a term used for internal logic providing ring interface to
LLC and Core.
Third generation Double Data Rate SDRAM memory technology that is the
successor to DDR2 SDRAM
Direct Memory Access
Direct Media Interface
Direct Media Interface Gen 2
Digital Thermal Sensor
Error Correction Code
Description
Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families
Overview
Datasheet Volume One