Intel Xeon E5-2400 Thermal/Mechanical Design Manual
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Intel Xeon E5-2400 Thermal/Mechanical Design Manual

Intel Xeon E5-2400 Thermal/Mechanical Design Manual

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Intel® Xeon® Processor E5-2400
Product Family
Thermal/Mechanical Design Guide
May 2012
Reference Number: 327250-001

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Summary of Contents for Intel Xeon E5-2400

  • Page 1 Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide May 2012 Reference Number: 327250-001...
  • Page 2 The Intel® Xeon® E5-2400 Product Family may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

  • Page 3: Table Of Contents

    Thermal Features ....................37 5.6.1 TCONTROL and DTS Relationship.............. 38 5.6.2 Short Duration TCC Activation and Catastrophic Thermal Management for Intel® Xeon® Processor E5-2400 Product Family....39 5.6.3 Intel® Turbo Boost Technology ..............40 Thermal Guidance ..................... 40 5.7.1 Thermal Excursion.................. 40 5.7.2...
  • Page 4 DTS Based Thermal Profile, Tcontrol and Margin for the Intel® Xeon® Processor E5-2400 Product Family ......41 5.8.4 Power Calculation for the Intel® Xeon® Processor E5-2400 Product Family ..42 5.8.5 Averaging the DTS Based Thermal Specification for the Intel® Xeon® Processor E5-2400 Product Family........42 5.8.6...
  • Page 5 Socket and ILM Mechanical Specifications ............. 30 Electrical Requirements for LGA1356 Socket ............31 Values Used to Generate Processor Thermal Specifications........33 Performance Expectations in Compact Electronics Bay (CEB) ........34 Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...
  • Page 6 TCONTROL and DTS Relationship .................38 Sign Convention ....................38 Relief for Intel® Xeon® Processor E5-2400 Product Family ......39 CONTROL Averaging Coefficients ..................43 Suppliers for the Intel Reference Thermal Solution ..........47 Suppliers for the Intel Collaboration Thermal Solution..........48 Suppliers for the Alternative Thermal Solution ............48 LGA1356 Socket, ILM and Back Plate..............50...
  • Page 7 Revision History Document Revision Description Date Number Number 327250 -001 • Initial release of the document. May 2012 § Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...
  • Page 8 Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 9: Introduction

    Introduction This document provides guidelines for the design of thermal and mechanical solutions for server and workstation processors in the Intel® Xeon® Processor E5-2400 Product Family platform. The processors covered include those listed in the Intel® Xeon® Processor E5-2400 Product Family Datasheet - Volume One. The components described in this document include: •...

  • Page 10: References

    The processor mates with the system board through this surface mount, 1356-contact socket. PECI The Platform Environment Control Interface (PECI) is a one-wire interface that provides a communication channel between Intel processor and chipset components to external monitoring devices. Case-to-ambient thermal characterization parameter (psi). A measure of thermal Ψ...
  • Page 11 The system ambient air temperature external to a system chassis. This temperature is usually measured at the chassis air inlets. A unit of measure used to define server rack spacing height. 1U is equal to 1.75 in, 2U equals 3.50 in, etc. § Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...
  • Page 12 Introduction Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 13: Lga1356 Socket

    Loading Mechanism (ILM). The design includes a back plate which is a key contributor in producing a uniform load on the socket solder joints. Socket loading specifications are listed in Section 4.4. Figure 2-1. LGA1356 Socket with Pick and Place Cover Removed Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 14: Lga1356 Socket Contact Numbering (Top View Of Socket)

    LGA1356 Socket Figure 2-2. LGA1356 Socket Contact Numbering (Top View of Socket) Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 15: Board Layout

    At this time, complete recommendations for pad definition and pad size do not exist for the LGA1356 socket. See Section 2.9 for more information on pad definition and pad size. Figure 2-3. LGA1356 Socket Land Pattern (Top View of Board) Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 16: Attachment To Motherboard

    The socket has the following solder ball material: • Lead free SAC (SnAgCu) solder alloy with a silver (Ag) content between 3% and 4% and a melting temperature of approximately 217 °C. The alloy must be Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 17: Contacts

    2-5, a Pin1 indicator on the Pick and Place cover provides a visual reference for proper orientation with the socket. Figure 2-5. Pick and Place Cover ILM cover ILM Installation Pin 1 Pick and Place Cover Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 18: Package Installation / Removal

    • The socket has alignment walls at the four corners to provide final alignment of the package. Appendix D for information regarding a tool designed to provide mechanical assistance during processor installation and removal. Figure 2-6. Package Installation / Removal Features Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 19: Socket Standoffs And Package Seating Plane

    All markings must withstand 260 °C for 40 seconds (typical reflow/rework profile) without degrading, and must be visible after the socket is mounted on the motherboard. LGA1356 and the manufacturer's insignia are molded or laser marked on the side wall. Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 20: Component Insertion Forces

    LGA1356 Socket NCTF Solder Joints Intel has defined selected solder joints of the socket as non-critical to function (NCTF) for post environmental testing. The processor signals at NCTF locations are typically redundant ground or non-critical reserved, so the loss of the solder joint continuity at end of life conditions will not affect the overall product functionality.

  • Page 21: Lga1356 Nctf Solder Joints

    LGA1356 Socket Figure 2-8. LGA1356 NCTF Solder Joints § Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...
  • Page 22 LGA1356 Socket Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 23: Independent Loading Mechanism (Ilm) And Back Plate

    ILM as a system. These studies directly impact the design of the ILM. The Intel reference ILM will be “build to print” from Intel controlled drawings. Intel recommends using the Intel Reference ILM. Custom non-Intel ILM designs do not benefit from Intel's detailed studies and may not incorporate critical design parameters.

  • Page 24: Ilm Back Plate Design Overview

    1 assembly cycle = fasten the ILM assembly to the back plate with the four captive screws, torque to 9 ± 1 inch-pounds, unfasten ILM assembly from the back plate. Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 25: Assembly Of Ilm To A Motherboard

    3-3), the back plate is placed in a fixture. Holes in the motherboard provide alignment to the threaded studs. In step 2, the ILM assembly is placed over the socket and threaded studs. The Intel Reference Design ILM cover is not designed to nest over the Pick and Place cover. This feature helps prevent reinstallation of the Pick and Place cover, a step that can lead to socket bent contacts.

  • Page 26: Ilm Assembly

    ILM cover on board, and back plate in fixture, bottom of board, align ILM assembly align board holes to back plate studs. to back plate studs. Step 4 Step 5 Step 3 Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 27: Ilm Cover

    The ILM cover is designed to be interchangeable between different suppliers validated by Intel. Performance of the pop off feature may decline if the ILM cover supplier is different than the ILM supplier. The ILM cover can be removed manually if the pop off feature is not desirable, or not functional.
  • Page 28 Independent Loading Mechanism (ILM) and Back Plate Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 29: Lga1356 Socket, Ilm And Back Plate Electrical, Mechanical, And Environmental

    The power dissipated within the socket is a function of the current at the pin level and the effective pin resistance. To ensure socket long term reliability, Intel defines socket maximum temperature using a via on the underside of the motherboard. Exceeding the...

  • Page 30: Loading Specifications

    This is the minimum and maximum static force that can be applied by the heatsink and it’s retention solution to maintain the heatsink to IHS interface. This does not imply the Intel reference TIM is validated to these limits. TIM load range is documented in Section 5.2...

  • Page 31: Environmental Requirements

    A simplified process flow of this methodology can be seen in Figure 4-1. Since the LGA1356 socket is very similar to the LGA1366 socket, the LGA1356 socket is expected to perform similarly and full validation for the LGA1356 socket is avoided. Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 32: Flow Chart Of Knowledge-Based Reliability Evaluation Methodology

    Freeze stressing Perform stressing to requirements and perform validate accelerated additional data turns stressing assumptions and determine acceleration factors A detailed description of this methodology can be found at: ftp://download.intel.com/technology/itj/q32000/pdf/reliability.pdf. § Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 33: Thermal Solutions

    4. Reference system configuration. Processor is downstream from memory in EEB (Entry-Level Electronics Bay). Values above do not apply to LR-DIMM in an Intel Reference Design. Ducting is utilized to direct airflow. 5. Dimensions of heatsink do not include socket or processor.

  • Page 34: Best-Fit Equations

    Electronics Bay). With the values above, the 25.5mm tall heatsink can meet the processor thermal specifications in Intel's Reference Design 10.5x12 inches CEB board. However, these CEB values are not used to generate processor thermal specifications. Ducting is utilized to direct airflow.

  • Page 35: Assembly

    (as little as 0 lbf) is acceptable from a socket loading perspective as long as the thermal specifications are met. Compliance to Board Keepout Zones in Appendix A is assumed for this assembly process. Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 36: Thermal Interface Material (Tim)

    Thermal characterization parameter from heatsink-to-local ambient Ψ (°C/W) is dependent on the thermal conductivity and geometry of the heatsink and dependent on the air velocity through the heatsink fins. Figure 5-3 illustrates the thermal characterization parameters. Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 37: Fan Speed Control

    Tcontrol and its upper and lower limits defined by hysteresis, can be used to avoid fan speed oscillation and undesirable noise variations. Thermal Features More information regarding processor thermal features is contained in the appropriate datasheet. Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 38: Tcontrol And Dts Relationship

    In some situations, use of T Relief can reduce average fan power and improve CONTROL acoustics. There are no plans to change Intel's specification or the factory configured values on individual processors. CONTROL Intel® Xeon® Processor E5-2400 Product Family...

  • Page 39: Short Duration Tcc Activation And Catastrophic Thermal Management For Intel® Xeon® Processor E5-2400 Product Family

    Section 5.8.3 Section 5.8.6 can be ignored. As compared to cooling to Tcontrol Relief, overcooling to Tcontrol_FSC: • May increase frequency benefit from Intel TBT as defined in Section 5.6.3. • Will increase acoustics • May result in lower wall power Customers must characterize a Tcontrol_offset value for their system to meet their goals for frequency, acoustics and wall power.

  • Page 40: Intel® Turbo Boost Technology

    , as temperature is not typically the limiter for these workloads. With Intel TBT enabled, the processor may run more consistently at higher power levels (but still within TDP), and be more likely to operate above T , as compared to CONTROL when Intel TBT is disabled.

  • Page 41: Dts Based Thermal Specification

    When all cores are active, a properly sized heatsink will be able to meet the DTS based thermal specification. When all cores are not active or when Intel Turbo Boost Technology is active, attempting to comply with the DTS based thermal specification may drive system fans to maximum speed.

  • Page 42: Power Calculation For The Intel® Xeon® Processor E5-2400 Product Family

    DTS command info is given in Section 5.6.1.1. 5.8.4 Power Calculation for the Intel® Xeon® Processor E5- 2400 Product Family To implement DTS based thermal specification, average power over time must be calculated: P = (E2 - E1) / (t2 - t1)

  • Page 43: Capabilities For The Follow-On Processor

    M < 0; gap to spec, fan speed must increase M ≥ 0; margin to spec, fan speed may decrease Use of RdPkgConfig(), Index 10 with the Intel® Xeon® Processor E5-2400 Product Family will return an illegal command. For the follow-on processor, coefficients (α...
  • Page 44 Thermal Solutions Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 45: Quality And Reliability Requirements

    LGA1356 Addendum and are available from socket suppliers listed in Appendix Intel Reference Component Validation Intel tests reference components both individually and as an assembly on mechanical test boards, and assesses performance to the envelopes specified in previous sections by varying boundary conditions.

  • Page 46: Recommended Bios/Processor/Memory Test Procedures

    RoHS compliant: Lead and other materials banned in RoHS Directive are either (1) below all applicable substance thresholds as proposed by the EU or (2) an approved/pending exemption applies. Note: RoHS implementation details are not fully defined and may change. § Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 47: A Component Suppliers

    Various suppliers have developed support components for processors in the Intel® Xeon® Processor E5-2400 Product Family-based platform. These suppliers and components are listed as a convenience to customers. Intel does not guarantee quality, reliability, functionality or compatibility of these components. The supplier list and/or the components may be subject to change without notice.

  • Page 48: Alternative Thermal Solution

    Component Suppliers Table A-2. Suppliers for the Intel Collaboration Thermal Solution Assembly Component Description Supplier PN Supplier Contact Info Assembly, 2U URS Heatsink Supplier Designed Foxconn Foxconn Heatsink, Intel Solution with pn 1A016500 Xeon processor Intel-specified Intel Collaboration Ray Wang...
  • Page 49 SKUs up G520 to 95W www.Dynatron-Corp.com CoolJag not capable for 80W (2-core, 1 Low Cost JAC0B40A socket); capable for all other SKUs up to 95W www.CoolJag.com Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 50: Socket, Ilm And Back Plate

    Notes: 1) Standard - Design and technology similar to Intel Reference or Collaboration designs, however, may not meet thermal requirements for all processor SKUs. 2) Performance - 1U Heatsink designed with premium materials or technology expected to provide optimum thermal performance for all processor SKUs.

  • Page 51: Mechanical Drawings

    25.5 mm Reference Heatsink Fin and Base (Sheet 2 of 2) Figure B-30 25.5 mm Reference Heatsink Assembly with TIM (Sheet 1 of 2) Figure B-31 25.5 mm Reference Heatsink Assembly with TIM (Sheet 2 of 2) Figure B-32 Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 52: Board Keepin / Keepout Zones (Sheet 1 Of 4)

    Mechanical Drawings Figure B-1. Board Keepin / Keepout Zones (Sheet 1 of 4) Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 53: B-2 Board Keepin / Keepout Zones (Sheet 2 Of 4)

    Mechanical Drawings Figure B-2. Board Keepin / Keepout Zones (Sheet 2 of 4) Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 54: B-3 Board Keepin / Keepout Zones (Sheet 3 Of 4)

    Mechanical Drawings Figure B-3. Board Keepin / Keepout Zones (Sheet 3 of 4) Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 55: B-4 Board Keepin / Keepout Zones (Sheet 4 Of 4)

    Mechanical Drawings Figure B-4. Board Keepin / Keepout Zones (Sheet 4 of 4) Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 56: B-5 1U Reference Heatsink Assembly (Sheet 1 Of 2)

    Mechanical Drawings Figure B-5. 1U Reference Heatsink Assembly (Sheet 1 of 2) Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 57: B-6 1U Reference Heatsink Assembly (Sheet 2 Of 2)

    Mechanical Drawings Figure B-6. 1U Reference Heatsink Assembly (Sheet 2 of 2) Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 58: B-7 1U Reference Heatsink Fin And Base (Sheet 1 Of 2)

    Mechanical Drawings Figure B-7. 1U Reference Heatsink Fin and Base (Sheet 1 of 2) Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 59: B-8 1U Reference Heatsink Fin And Base (Sheet 2 Of 2)

    Mechanical Drawings Figure B-8. 1U Reference Heatsink Fin and Base (Sheet 2 of 2) Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 60: B-9 Heatsink Shoulder Screw (1U, 2U And Tower)

    Mechanical Drawings Figure B-9. Heatsink Shoulder Screw (1U, 2U and Tower) Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 61: B-10 Heatsink Compression Spring (1U, 2U And Tower)

    Mechanical Drawings Figure B-10. Heatsink Compression Spring (1U, 2U and Tower) Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 62: B-11 Heatsink Retaining Ring (1U, 2U And Tower)

    Mechanical Drawings Figure B-11. Heatsink Retaining Ring (1U, 2U and Tower) Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 63: B-12 Heatsink Load Cup (1U, 2U And Tower)

    Mechanical Drawings Figure B-12. Heatsink Load Cup (1U, 2U and Tower) Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 64: B-13 2U Collaborative Heatsink Assembly (Sheet 1 Of 2)

    Mechanical Drawings Figure B-13. 2U Collaborative Heatsink Assembly (Sheet 1 of 2) Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 65: B-14 2U Collaborative Heatsink Assembly (Sheet 2 Of 2)

    Mechanical Drawings Figure B-14. 2U Collaborative Heatsink Assembly (Sheet 2 of 2) Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 66: B-15 2U Collaborative Heatsink Volumetric (Sheet 1 Of 2)

    Mechanical Drawings Figure B-15. 2U Collaborative Heatsink Volumetric (Sheet 1 of 2) Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 67: B-16 2U Collaborative Heatsink Volumetric (Sheet 2 Of 2)

    Mechanical Drawings Figure B-16. 2U Collaborative Heatsink Volumetric (Sheet 2 of 2) Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 68: B-17 Tower Collaborative Heatsink Assembly (Sheet 1 Of 2)

    Mechanical Drawings Figure B-17. Tower Collaborative Heatsink Assembly (Sheet 1 of 2) Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 69: B-18 Tower Collaborative Heatsink Assembly (Sheet 2 Of 2)

    Mechanical Drawings Figure B-18. Tower Collaborative Heatsink Assembly (Sheet 2 of 2) Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 70: B-19 Tower Collaborative Heatsink Volumetric (Sheet 1 Of 2)

    Mechanical Drawings Figure B-19. Tower Collaborative Heatsink Volumetric (Sheet 1 of 2) Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 71: B-20 Tower Collaborative Heatsink Volumetric (Sheet 2 Of 2)

    Mechanical Drawings Figure B-20. Tower Collaborative Heatsink Volumetric (Sheet 2 of 2) Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 72: B-21 1U Reference Heatsink Assembly With Tim (Sheet 1 Of 2)

    Mechanical Drawings Figure B-21. 1U Reference Heatsink Assembly with TIM (Sheet 1 of 2) Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 73: B-22 1U Reference Heatsink Assembly With Tim (Sheet 2 Of 2)

    Mechanical Drawings Figure B-22. 1U Reference Heatsink Assembly with TIM (Sheet 2 of 2) Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 74: B-23 2U Reference Heatsink Assembly With Tim (Sheet 1 Of 2)

    Mechanical Drawings Figure B-23. 2U Reference Heatsink Assembly with TIM (Sheet 1 of 2) Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 75: B-24 2U Reference Heatsink Assembly With Tim (Sheet 2 Of 2)

    Mechanical Drawings Figure B-24. 2U Reference Heatsink Assembly with TIM (Sheet 2 of 2) Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 76: B-25 Tower Reference Heatsink Assembly With Tim (Sheet 1 Of 2)

    Mechanical Drawings Figure B-25. Tower Reference Heatsink Assembly with TIM (Sheet 1 of 2) Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 77: B-26 Tower Reference Heatsink Assembly With Tim (Sheet 2 Of 2)

    Mechanical Drawings Figure B-26. Tower Reference Heatsink Assembly with TIM (Sheet 2 of 2) Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 78: B-27 25.5 Mm Reference Heatsink Assembly (Sheet 1 Of 2)

    Mechanical Drawings Figure B-27. 25.5 mm Reference Heatsink Assembly (Sheet 1 of 2) Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 79: B-28 25.5 Mm Reference Heatsink Assembly (Sheet 2 Of 2)

    Mechanical Drawings Figure B-28. 25.5 mm Reference Heatsink Assembly (Sheet 2 of 2) Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 80: B-29 25.5 Mm Reference Heatsink Fin And Base (Sheet 1 Of 2)

    Mechanical Drawings Figure B-29. 25.5 mm Reference Heatsink Fin and Base (Sheet 1 of 2) Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 81: B-30 25.5 Mm Reference Heatsink Fin And Base (Sheet 2 Of 2)

    Mechanical Drawings Figure B-30. 25.5 mm Reference Heatsink Fin and Base (Sheet 2 of 2) Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 82: B-31 25.5 Mm Reference Heatsink Assembly With Tim (Sheet 1 Of 2)

    Mechanical Drawings Figure B-31. 25.5 mm Reference Heatsink Assembly with TIM (Sheet 1 of 2) Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 83: B-32 25.5 Mm Reference Heatsink Assembly With Tim (Sheet 2 Of 2)

    Mechanical Drawings Figure B-32. 25.5 mm Reference Heatsink Assembly with TIM (Sheet 2 of 2) Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...
  • Page 84 Mechanical Drawings § Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 85: C Socket Mechanical Drawings

    “Socket Mechanical Drawing (Sheet 1 of 4)” Figure C-1 “Socket Mechanical Drawing (Sheet 2 of 4)” Figure C-2 “Socket Mechanical Drawing (Sheet 3 of 4)” Figure C-3 “Socket Mechanical Drawing (Sheet 4 of 4)” Figure C-4 Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 86: C-1 Socket Mechanical Drawing (Sheet 1 Of 4)

    Socket Mechanical Drawings Figure C-1. Socket Mechanical Drawing (Sheet 1 of 4) Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 87: C-2 Socket Mechanical Drawing (Sheet 2 Of 4)

    Socket Mechanical Drawings Figure C-2. Socket Mechanical Drawing (Sheet 2 of 4) Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 88: C-3 Socket Mechanical Drawing (Sheet 3 Of 4)

    Socket Mechanical Drawings Figure C-3. Socket Mechanical Drawing (Sheet 3 of 4) Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 89: C-4 Socket Mechanical Drawing (Sheet 4 Of 4)

    Socket Mechanical Drawings Figure C-4. Socket Mechanical Drawing (Sheet 4 of 4) Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...
  • Page 90 Socket Mechanical Drawings § Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 91: D Processor Installation Tool

    Processor Installation Tool The following optional tool is designed to provide mechanical assistance during processor installation and removal. Contact the supplier for details regarding this tool: Billy Hsieh billy.hsieh@tycoelectronics.com +81 44 844 8292 Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 92: D-1 Processor Installation Tool

    Processor Installation Tool Figure D-1. Processor Installation Tool § Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 93: E Embedded Thermal Solutions

    C is allowed for Short- Term NEBS excursions. 5. All heatsinks are Non-Direct Chassis Attach (DCA) 6. See Section 5.1 for standard 1U solutions that do not need to meet NEBS. Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 94: Thermal Design Guidelines

    High Case Temperature Thermal Profile Processors that offer a High case temperature thermal profile are specified in the Intel® Xeon® Processor E5-2400 Product Family Datasheet - Volume One. High case temperature thermal profiles help relieve thermal constraints for Short-Term NEBS conditions. To help reliability, processors must meet the nominal thermal profile...

  • Page 95: Mechanical Drawings And Supplier Information

    Appendix B for retention and keep out drawings. The part number below represent Intel reference designs for a ATCA reference heatsink. Customer implementation of these components may be unique and require validation by the customer. Customers can obtain these components directly from the supplier below.

  • Page 96: Mechanical Drawings List

    ATCA Reference Heat Sink Assembly (Sheet 2 of 2) Figure E-4 ATCA Reference Heatsink Fin and Base (Sheet 1 of 2) Figure E-5 ATCA Reference Heatsink Fin and Base (Sheet 2 of 2) Figure E-6 Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 97: E-3 Atca Reference Heat Sink Assembly (Sheet 1 Of 2)

    Embedded Thermal Solutions Figure E-3. ATCA Reference Heat Sink Assembly (Sheet 1 of 2) Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 98: E-4 Atca Reference Heat Sink Assembly (Sheet 2 Of 2)

    Embedded Thermal Solutions Figure E-4. ATCA Reference Heat Sink Assembly (Sheet 2 of 2) Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 99: E-5 Atca Reference Heatsink Fin And Base (Sheet 1 Of 2)

    Embedded Thermal Solutions Figure E-5. ATCA Reference Heatsink Fin and Base (Sheet 1 of 2) Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

  • Page 100: E-6 Atca Reference Heatsink Fin And Base (Sheet 2 Of 2)

    Embedded Thermal Solutions Figure E-6. ATCA Reference Heatsink Fin and Base (Sheet 2 of 2) § Intel® Xeon® Processor E5-2400 Product Family Thermal/Mechanical Design Guide...

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