Thermal Management Specifications
Table 5-19. 4-Core 130W Thermal Profile Table 2U (Sheet 2 of 2)
Power (W)
5.1.3.10
4-Core 130W 1S WS Thermal Specifications
Table 5-20. Tcase: 4-Core 130W 1S WS Thermal Specifications, Workstation/Server
Platform
Core
Frequency
Launch to FMB
Notes:
1.
These values are specified at V
the processor is not to be subjected to any static V
specified ICC. Please refer to the electrical loadline specifications in
2.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
3.
These specifications are based on final silicon characterization.
4.
Power specifications are defined at all VIDs found in
multiple VIDs for each frequency.
5.
FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families
Datasheet Volume One
Maximum T
85
90
95
100
105
110
115
120
125
130
Thermal Design
Power (W)
130
CC_MAX
(°C)
CASE
64.9
65.8
66.7
67.6
68.5
69.4
70.3
71.2
72.1
73.0
Minimum
Maximum
T
(°C)
T
CASE
CASE
5
See
Figure 5-21
for all processor frequencies. Systems must be designed to ensure
and I
combination wherein V
CC
CC
Table
7-3. The processor may be delivered under
Maximum DTS (°C)
80.0
81.7
83.5
85.3
87.1
88.9
90.6
92.4
94.2
96.0
Notes
(°C)
and
Table 5-21
1, 2, 3, 4, 5
exceeds V
CC
CC_MAX
Section
7.8.1.
.
CASE
at
125
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