Tcase: 6-Core 60W Thermal Profile 1U; Tcase: 6-Core 60W Thermal Specifications 1U - Intel Xeon Processor E5-1600 Datasheet

Thermal Management Specifications
5.1.3.8 6-Core 60W Thermal Specifications
Table 5-16. Tcase: 6-Core 60W Thermal Specifications 1U
Core
Frequency
Launch to FMB
Notes:
1. These values are specified at V
the processor is not to be subjected to any static V
specified ICC. Please refer to the electrical loadline specifications in
2. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
3. These specifications are based on final silicon characterization.
4. Power specifications are defined at all VIDs found in
multiple VIDs for each frequency.
5. FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
Figure 5-17. Tcase: 6-Core 60W Thermal Profile 1U
Notes:
1. Please refer to
2. Implementation of this Thermal Profile should result in virtually no TCC activation. Refer to the Intel®
Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide for
system and environmental implementation details.
Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families
Datasheet Volume One
Thermal Design Minimum
Power (W) T
CASE
60 5
for all processor frequencies. Systems must be designed to ensure
CC_MAX
Table 5-17 for discrete points that constitute the thermal profile.
Maximum
(°C) T (°C)
CASE
See Figure 5-17 and
and I combination wherein V
CC CC
Section
Table 7-3. The processor may be delivered under
Notes
Table 5-17 1, 2, 3, 4, 5
exceeds V at
CC CC_MAX
7.8.1.
.
CASE
121