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Thermal Specifications
Table 6-3.
Quad-Core Intel® Xeon® Processor X5300 Series Thermal Specifications
Core
Frequency
Launch to FMB
Notes:
1.
These values are specified at V
the processor is not to be subjected to any static V
specified I
2.
Maximum Power is the highest power the processor will dissipate, regardless of its VID. Maximum Power is
measured at maximum T
3.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
4.
These specifications are based on silicon characterization.
5.
Power specifications are defined at all VIDs found in
X5300 Series may be shipped under multiple VIDs for each frequency.
6.
FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
Figure 6-2.Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profiles
75
75
70
70
65
65
60
60
55
55
50
50
45
45
40
40
Notes:
1.
Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile A is representative of a volumetrically
unconstrained platform. Please refer to
2.
Implementation of Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile A should result in
virtually no TCC activation. Furthermore, utilization of thermal solutions that do not meet processor Quad-
Core Intel® Xeon® Processor X5300 Series Thermal Profile A will result in increased probability of TCC
activation and may incur measurable performance loss. (See
3.
Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile B is representative of a volumetrically
constrained platform. Please refer to
4.
Implementation of Thermal Profile B will result in increased probability of TCC activation and measurable
performance loss. Furthermore, utilization of thermal solutions that do not meet Thermal Profile B do not
meet the processor's thermal specifications and may result in permanent damage to the processor.
5.
Refer to the Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines for
system and environmental implementation details.
Quad-Core Intel® Xeon® Processor 5300 Series Datasheet
Maximum
Power
Design Power
(W)
145
CC_MAX
. Please refer to the loadline specifications in
CC
.
CASE
TCASE_MAX is a thermal solution design point.
TCASE_MAX is a thermal solution design point.
In actuality, units will not significantly exceed
In actuality, units will not significantly exceed
TCASE_MAX_A due to TCC activation.
TCASE_MAX_A due to TCC activation.
Thermal Profile B
Thermal Profile B
Y = 0.224*x + 43.1
Y = 0.224*x + 43.1
0
0
10
10
20
20
30
30
Thermal
Minimum
T
CASE
(W)
(°C)
120
5
for all processor frequencies. Systems must be designed to ensure
and I
combination wherein V
CC
CC
Section
2.
Table
2-3. The Quad-Core Intel® Xeon® Processor
Thermal Profile A
Thermal Profile A
Y = 0.171*x + 42.5
Y = 0.171*x + 42.5
40
40
50
50
60
60
70
70
Pow e r [W]
Pow e r [W]
Table 6-4
for discrete points that constitute the thermal profile.
Section 6.3
Table 6-5
for discrete points that constitute the thermal profile.
Maximum
T
Notes
CASE
(°C)
See
Figure
6-2;
1, 2, 3, 4, 5, 6
Table
6-4;
Table 6-5
exceeds V
CC
.
CASE
80
80
90
90
100
100
110
110
for details on TCC activation).
at
CC_MAX
120
120
91
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