Table 5-7.
8/6-Core 130W Thermal Profile Table 1U (Sheet 2 of 2)
Power (W)
5.1.3.4
6-Core 130W 1S WS Thermal Specifications
Table 5-8.
Tcase: 6-Core 130W 1S WS Thermal Specifications
Core
Frequency
Launch to FMB
Notes:
1.
These values are specified at V
the processor is not to be subjected to any static V
specified ICC. Please refer to the electrical loadline specifications in
2.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
3.
These specifications are based on final silicon characterization.
4.
Power specifications are defined at all VIDs found in
multiple VIDs for each frequency.
5.
FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
Figure 5-8.
Tcase: 6-Core 130W 1S WS Thermal Profile
112
Maximum T
8/6-core
100
78.5
105
79.6
110
80.7
115
81.8
120
82.9
125
84.0
130
85.0
Thermal Design
Minimum
Power (W)
T
130
for all processor frequencies. Systems must be designed to ensure
CC_MAX
Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families
Thermal Management Specifications
(°C)
CASE
8-core
90.0
91.7
93.3
95.0
96.7
98.3
100.0
Maximum
(°C)
T
(°C)
CASE
CASE
5
See
Figure 5-8
Table 5-9
and I
combination wherein V
CC
CC
Section
Table
7-3. The processor may be delivered under
Maximum DTS (°C)
6-Core
93.4
95.2
97.1
98.9
100.7
102.6
104.4
Notes
and
1, 2, 3, 4, 5
exceeds V
CC
CC_MAX
7.8.1.
.
CASE
Datasheet Volume One
at