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Summary of Contents for Intel Xeon Processor E5-1600
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Intel® Xeon® Processor E5-1600/ E5-2600/E5-4600 Product Families Datasheet - Volume One May 2012 Reference Number: 326508, Revision: 002...
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SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR.
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Intel® Turbo Boost Technology ................83 3.4.1 Intel® Turbo Boost Operating Frequency ...........83 Enhanced Intel SpeedStep® Technology ...............84 Intel® Intelligent Power Technology..............84 Intel® Advanced Vector Extensions (Intel® AVX) ..........84 Intel Dynamic Power Technology .................85 Power Management ....................87 ACPI States Supported ..................87 4.1.1 System States..................87...
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Signal Quality ....................181 7.10.1 DDR3 Signal Quality Specifications ............182 7.10.2 I/O Signal Quality Specifications............. 182 7.10.3 Intel QuickPath Interconnect Signal Quality Specifications......182 7.10.4 Input Reference Clock Signal Quality Specifications........182 7.10.5 Overshoot/Undershoot Tolerance............182 Processor Land Listing................... 187 Listing by Land Name ..................
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Figures Intel® Xeon® Processor E5-2600 Product Family on the 2 Socket Platform ......................14 PCI Express* Lane Partitioning and Direct Media Interface Gen 2 (DMI2)....17 PCI Express* Layering Diagram ................26 Packet Flow through the Layers ................27 Ping() ......................32 Ping() Example....................32 GetDIB() ......................32 Device Info Field Definition .................33...
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System Memory Power States ................88 DMI2/PCI Express* Link States................89 Intel QPI States....................89 G, S and C State Combinations................90 P_LVLx to MWAIT Conversion ................92 Coordination of Core Power States at the Package Level..........95 Intel® Xeon® Processor E5-1600/ E5-2600/E5-4600 Product Families Datasheet Volume One...
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PCI Express* Port 3 Signals ................143 PCI Express* Miscellaneous Signals ..............143 DMI2 and PCI Express* Port 0 Signals..............144 Intel QPI Port 0 and 1 Signals ................144 Intel QPI Miscellaneous Signals ................. 144 6-10 PECI Signals ....................145 6-11 System Reference Clock (BCLK{0/1}) Signals .............
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10-1 PWM Fan Frequency Specifications For 4-Pin Active Thermal Solution...... 254 10-2 8 Core / 6 Core Server Thermal Solution Boundary Conditions ....... 256 10-3 4 Core Server Thermal Solution Boundary Conditions ........... 256 Intel® Xeon® Processor E5-1600/ E5-2600/E5-4600 Product Families Datasheet Volume One...
Throughout this document, the Intel® Xeon® processor E5-1600/E5- 2600/E5-4600 product families may be referred to as simply the processor. Where information differs between the EP and EP 4S SKUs, this document uses specific Intel® Xeon® processor E5-1600 product family, Intel® Xeon® processor E5-2600 product family, and Intel®...
Intel® Xeon® Processor E5-4600 Product Family on the 4 Socket Platform 1.1.1 Processor Feature Details • Up to 8 execution cores • Each core supports two threads (Intel® Hyper-Threading Technology), up to 16 threads per socket Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
• Up to 20 MB last level cache (LLC): up to 2.5 MB per core instruction/data last level cache (LLC), shared among all cores • The Intel® Xeon® processor E5-4600 product family supports Directory Mode, Route Through, and Node IDs to reduce unnecessary Intel QuickPath Interconnect traffic by tracking cache lines present in remote sockets.
ECC (with or without data scrambler) or a predefined test pattern • Isochronous access support for Quality of Service (QoS), native 1 and 2 socket platforms - Intel® Xeon® processor E5-1600 and E5-2600 product families only • Minimum memory configuration: independent channel support with 1 DIMM populated •...
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• Supports receiving and decoding 64 bits of address from PCI Express*. — Memory transactions received from PCI Express* that go above the top of physical address space (when Intel VT-d is enabled, the check would be against the translated HPA (Host Physical Address) address) are reported as errors by the processor.
• Transparent to software • Processor and peer-to-peer writes and reads with 64-bit address support • APIC and Message Signaled Interrupt (MSI) support. Will send Intel-defined “End of Interrupt” broadcast message when initiated by the processor. • System Management Interrupt (SMI), SCI, and SERR error indication •...
— Reference Clock is 100 MHz — Slow boot speed initialization at 50 MT/s • Common reference clocking (same clock generator for both sender and receiver) • Intel® Interconnect Built-In-Self-Test (Intel® IBIST) for high-speed testability • Polarity and Lane reversal (Rx side only) 1.2.5...
Third generation Double Data Rate SDRAM memory technology that is the successor to DDR2 SDRAM Direct Memory Access Direct Media Interface DMI2 Direct Media Interface Gen 2 Digital Thermal Sensor Error Correction Code Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
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See the Intel® 64 and IA-32 Architectures Software Developer's Manuals for more detailed information. Flit Flow Control Unit. The Intel QPI Link layer’s unit of transfer; 1 Flit = 80-bits. Functional Operation Refers to the normal operating conditions in which all processor specifications, including DC, AC, system bus, signal quality, mechanical, and thermal, are satisfied.
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PCI Express* Generation 2.0/3.0 PECI Platform Environment Control Interface Phit Physical Unit. An Intel® QPI terminology defining units of transfer at the physical layer. 1 Phit is equal to 20 bits in ‘full width mode’ and 10 bits in ‘half width mode’ Processor...
Overview Table 1-1. Referenced Documents (Sheet 2 of 2) Document Location Intel® Virtualization Technology Specification for Directed I/O http://download.intel.com/technolog Architecture Specification y/computing/vptech/Intel(r)_VT_for_ Direct_IO.pdf Intel® Trusted Execution Technology Software Development Guide http://www.intel.com/technology/sec urity/ State of Data The data contained within this document is the most accurate information available by the publication date of this document.
The type of memory supported by the processor is dependent on the target platform: • Intel® Xeon® processor E5 product family-based platforms support: — ECC registered DIMMs: with a maximum of three DIMMs per channel allowing up to eight device ranks per channel.
Physical Layer representation to the Data Link Layer representation and finally (for Transaction Layer Packets) to the form that can be processed by the Transaction Layer of the receiving device. Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
PCI Express* extends the configuration space to 4096 bytes per-device/function, as compared to 256 bytes allowed by the Conventional PCI Specification. PCI Express* configuration space is divided into a PCI-compatible region (which consists of the first Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
Intel QuickPath Interconnect The Intel QuickPath Interconnect is a high speed, packetized, point-to-point interconnect used in the 2nd Generation Intel(r) Core(TM) Processor Family. The narrow high-speed links stitch together processors in distributed shared memory and integrated I/O platform architecture. It offers much higher bandwidth with low latency.
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• The Protocol layer is the high-level set of rules for exchanging packets of data between devices. A packet is comprised of an integral number of Flits. The Intel QuickPath Interconnect includes a cache coherency protocol to keep the distributed memory and caching structures coherent during system operation. It supports both low-latency source snooping and a scalable home snoop behavior.
• Synchronization at the beginning of every message minimizes device timing accuracy requirements Note: The PECI commands described in this document apply primarily to the Intel® Xeon® processor E5-1600/E5-2600/E5-4600 product families. The processors utilizes the capabilities described in this document to indicate support for four memory channels.
2.5.1.3 Processor Interface Tuning and Diagnostics The processor Intel® Interconnect Built In Self Test (Intel® IBIST) allows for in-field diagnostic capabilities in the Intel® QPI and memory controller interfaces. PECI provides a port to execute these diagnostics via its PCI Configuration read and write capabilities in the BMC INIT mode.
Section 2.5.2.4 or using a RDMSR instruction. T application to fan speed control management is defined in CONTROL the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/ Mechanical Design Guide. Please refer to Section 2.5.7 for details regarding PECI temperature data formatting.
‘parameter’ field to specify the exact data being requested. The Read Length dictates the desired data return size. This command supports only dword responses on the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
Refer to Section 2.5.2.6 for more details on processor-specific services supported through this command. 2.5.2.5.1 Command Format The WrPkgConfig() format is as follows: Write Length: 0x0a(dword) Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
WrPkgConfig() Response Definition (Sheet 1 of 2) Response Meaning Bad Write FCS Electrical error or AW FCS failure Abort FCS Illegal command formatting (mismatched RL/WL/Command Code) CC: 0x40 Command passed, data is valid. Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
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The user should consult the Intel® 64 and IA-32 Architectures Software Developer’s Manual (SDM) Volumes 1, 2, and 3 or Intel® Xeon® Processor E5 Product Family Datasheet Volume Two for details on MSR and CSR register contents.
DRAM Power Read DRAM Maximum DRAM MSR 61Ch: Info Read power settings power settings & DRAM_POWER_INFO 0x0000 info to be used maximum time by power CSR: DRAM_POWER_INFO window limiting entity Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
The ‘Scaling Factor’ is used to convert memory transaction information to energy units in Joules and can be derived from system/memory configuration information. Refer to the Intel® 64 and IA-32 Architectures Software Developer’s Manual (SDM) Volumes 1, 2, and 3 for methods to program and access ‘Scaling Factor’...
TSOD or on-board DIMM sensor and requires that CLTT (closed loop throttling mode) be enabled and OLTT (open loop throttling mode) be disabled. Refer to Table 2-7 for channel index encodings. Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
This would include all the DIMMs within the channel and all the ranks within each of the DIMMs. Channels that are not populated will return the ‘ambient temperature’ on systems using activity-based temperature estimations or alternatively return a ‘zero’ for systems using sensor-based temperatures. Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
Table 2-7. A channel index of 0x00FF is used to specify the “all channels” case. While Intel requires reading the accumulated energy data at least once every 16 seconds to ensure functional correctness, a more realistic polling rate recommendation is once every 100 mS for better accuracy. This feature assumes a 200W memory capacity.
RST_CPL bit of the BIOS_RESET_CPL register. The DRAM power settings will be programmed during boot independent of the ‘DRAM Power Limit Enable’ bit setting. Please refer to the Intel® Xeon® Processor E5 Product Family Datasheet Volume Two for information on memory energy estimation methods and energy tuning options used by BIOS and other utilities for determining the range specified in the DRAM power settings.
Figure 2-20. DRAM Power Limit Performance Data Accumulated DRAM Throttle Time DRAM Power Limit Performance Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
The user should consult the appropriate Intel® 64 and IA-32 Architectures Software Developer’s Manual (SDM) Volumes 1, 2, and 3 or Intel® Xeon® Processor E5 Product Family Datasheet Volume Two for exact details on MSR or CSR register content.
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PACKAGE_ENERGY_STATUS package. CSR: PACKAG_ENERGY_STATUS Power Limit for MSR 638h: PP0_POWER_LIMIT the VCC Power Program power limit 0x0000 Power Limit Data Plane Write / for VCC power plane CSR: PP0_POWER_LIMIT Read Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
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Read Mode associated valid that IERR was caused by a core timeout Thermal margin Read margin to Thermal Margin to processor 0x0000 processor thermal Read thermal profile load line or load line Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
Processor Flag[2:0] as shown in Figure 2-22 is typically unique to the platform type and processor stepping. Refer to the Intel® 64 and IA-32 Architectures Software Developer’s Manual (SDM) Volumes 1, 2, and 3 for more information. Figure 2-22. Platform ID Data...
[12:8] is 10000b and the time unit [19:16] is 1010b. Actual unit values are calculated as shown in Table 2-9. Figure 2-27. Package Power SKU Unit Data 16 15 Reserved Time Unit Reserved Energy Unit Reserved Power Unit Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
PCU enough time to sample energy information and enforce the limit. The minimum value of the ‘time window’ can be obtained by reading bits [21:15] of the PWR_LIMIT_MISC_INFO CSR using the PECI RdPCIConfigLocal() command. Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
‘instantaneous’ value and not the ‘average’ value as returned by the PECI GetTemp() described in Section 2.5.2.3. Figure 2-29. Package Temperature Read Data Sign PECI Temperature PECI Temperature RESERVED (Integer Value) (Fractional Value) Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
A bit set to ‘1’ is ignored and results in no change to any sticky log bits. For example, to clear the TCC Activation Log bit and retain all other log bits, the Thermal Status Read should send a mask of 0xFFFFFFFD. Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
Actual current limit data is contained only in the lower 13 bits of the response data. The default return value of 0x438 corresponds to a current limit value of 135A. Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
Section 2.5.2.6.13. While Intel requires reading the accumulated energy data at least once every 16 seconds to ensure functional correctness, a more realistic polling rate recommendation is once every 100mS for better accuracy. This feature assumes a 150W processor. In general, as the power capability decreases, so will the minimum polling rate requirement.
PECI. Intel recommends exclusive use of just one entity or interface, PECI for instance, to manage all processor package power limiting and budgeting needs. If PECI is being...
32-bit counter that wraps around. The unit for time is determined as per the Package Power SKU Unit settings described in Section 2.5.2.6.13. Figure 2-37. Package Power Limit Performance Data Accumulated CPU Throttle Time Accumulated CPU Throttle Time Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
Any power management entity monitoring this indicator should sample it at least once every 4 seconds to enable detection of wraparounds. Refer to the processor Intel® 64 and IA-32 Architectures Software Developer’s Manual (SDM) Volumes 1, 2, and 3, for details on programming the Energy/Performance Bias (MSR_MISC_PWR_MGMT) register to set the ‘Energy Efficiency’...
This PECI service will continue to return valid margin values even when the processor die temperature exceeds T jmax Figure 2-41. DTS Thermal Margin Read Sign Thermal Margin Therm al Margin RESERVED (Integer Value) (Fractional Value) Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
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RdIAMSR() The RdIAMSR() PECI command provides read access to Model Specific Registers (MSRs) defined in the processor’s Intel® Architecture (IA). MSR definitions may be found in the Intel® 64 and IA-32 Architectures Software Developer’s Manual (SDM) Volumes 1, 2, and 3. Refer to...
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Thread (0,1) Mask for Core4 Figure 2-43. RdIAMSR() Note: The 2-byte MSR Address field and read data field defined in Figure 2-43 are sent in standard PECI ordering with LSB first and MSB last. Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
IA32_MCG_CAP[7:0] MSR (0x0179). This register may be alternatively read using a RDMSR BIOS instruction. Please consult the Intel® 64 and IA-32 Architectures Software Developer’s Manual (SDM) Volumes 1, 2, and 3 for more information on the exact number of cores supported by a particular processor SKU.
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10. Reads to a machine check bank within a core or thread that is disabled will return all zeroes with a completion code of 0x90. 11. For SKUs where Intel QPI is disabled or absent, reads to the corresponding machine check banks will return all zeros with a completion code of 0x40.
Actual PCI bus numbers for all PCI devices including the PCH are programmable by BIOS. The bus number for PCH devices may be obtained by reading the CPUBUSNO CSR. Refer to the Intel® Xeon® Processor E5 Product Family Datasheet Volume Two document for details on this register.
The RdPCIConfigLocal() command provides sideband read access to the PCI configuration space that resides within the processor. This includes all processor IIO and uncore registers within the PCI configuration space as described in the Intel® Xeon® Processor E5 Product Family Datasheet Volume Two document.
Response timeout. The processor was not able to generate the required response in a timely fashion. Retry is appropriate. CC: 0x81 Response timeout. The processor is not able to allocate resources for servicing this command at this time. Retry is appropriate. Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
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Description: Writes the data sent to the requested register address. Write Length dictates the desired write granularity. The command always returns a completion code indicating pass/fail status. Refer to Section 2.5.5.2 for details on completion codes. Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
Retry may be appropriate after modification of PECI wake mode behavior if appropriate. CC: 0x90 Unknown/Invalid/Illegal Request CC: 0x91 PECI control hardware, firmware or associated logic error. The processor is unable to process the request. Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
IIO functions as described in Table 2-15. Refer to the Intel® Xeon® Processor E5 Product Family Datasheet Volume Two for more details on specific register definitions. It also enables writing to processor REUT (Robust Electrical Unified Test) registers associated with the Intel QPI, PCIe* and DDR3 functions.
2-17. These package strap(s) are evaluated at the assertion of PWRGOOD (as depicted in Figure 2-49). Refer to the appropriate Platform Design Guide (PDG) for recommended resistor values for establishing non-default SOCKET_ID settings. Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
Not measurable. PECI client will not return valid data in core C-state that is C3 or deeper RdPCIConfigLocal() May require package ‘pop-up’ to C2 state WrPCIConfigLocal() May require package ‘pop-up’ to C2 state RdPCIConfig() May require package ‘pop-up’ to C2 state Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
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BMC. In this mode, the socket performs a minimal amount of internal configuration and then waits for the BMC or service processor to complete the initialization. Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
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2.5.3.7.2 Link Init Mode In cases where the socket is not one Intel QPI hop away from the Firmware Agent socket, or a working link to the Firmware Agent socket cannot be resolved, the socket is placed in Link Init mode. The socket performs a minimal amount of internal configuration and waits for complete configuration by BIOS.
The Pass/Fail mask defined in Table 2-21 applies to all codes, and general response policies may be based on this information. Refer to Section 2.5.6 for originator response policies and recommendations. Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
GetTemp() response data. The output of this filter produces temperatures at the full 1/64°C resolution even though the DTS itself is not this accurate. Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
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Table 2-24. Error Codes and Descriptions Error Code Description 0x8000 General Sensor Error (GSE) 0x8001 Reserved 0x8002 Sensor is operational, but has detected a temperature below its operational range (underflow) 0x8003-0x81ff Reserved § Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
OS’s and applications without any special steps. • Enhanced: Intel VT enables VMMs to run 64-bit guest operating systems on IA x86 processors. • More reliable: Due to the hardware support, VMMs can now be smaller, less complex, and more efficient.
3.1.3 Intel VT-d Objectives The key Intel VT-d objectives are domain-based isolation and hardware-based virtualization. A domain can be abstractly defined as an isolated environment in a platform to which a subset of host physical memory is allocated. Virtualization allows for the creation of one or more partitions on a single system.
Intel TXT is a set of extensions designed to provide a measured and controlled launch of system software that will then establish a protected environment for itself and any additional software that it may execute.
Intel® AES New Instructions (Intel® AES-NI), which is defined by FIPS Publication number 197. Since Intel AES-NI is the dominant block cipher, and it is deployed in various protocols, the new instructions will be valuable for a wide range of applications.
TDP limit. Note: Intel Turbo Boost Technology is only active if the operating system is requesting the P0 state. For more information on P-states and C-states refer to Section 4, “Power Management”.
3D modeling and analysis, scientific simulation, and financial analysts. Intel AVX is a comprehensive ISA extension of the Intel® 64 Architecture. The main elements of Intel AVX are: • Support for wider vector data (up to 256-bit) for floating-point computation.
— Application domain can scale out with advanced platform interconnect fabrics, such as Intel QPI. • Power Efficiency - Intel AVX is extremely power efficient. Incremental power is insignificant when the instructions are unused or scarcely used. Combined with the...
• Register CKE Power Down: — IBT-ON mode: Both CKE’s are de-asserted, the Input Buffer Terminators (IBTs) are left “on”. — IBT-OFF mode: Both CKE’s are de-asserted, the Input Buffer Terminators (IBTs) are turned “off”. Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
Deep Power Down Down Power off Off, except RTC Suspend to RAM Power off Off, except RTC Suspend to Disk Power off Off, except RTC Soft Off Power off Power off Hard off Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
C-states have longer entry and exit latencies. 4.2.1 Enhanced Intel SpeedStep® Technology The following are the key features of Enhanced Intel SpeedStep Technology: • Multiple frequency and voltage points for optimal performance and power efficiency. These operating points are known as P-states.
However, software may make C-state requests using the legacy method of I/O reads from the ACPI-defined processor clock control registers, referred to as P_LVLx. This method of requesting C-states provides legacy support for operating systems that initiate C-state transitions via I/O reads. Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
MWAIT C-state request. Therefore, P_LVLx reads do not directly result in I/O reads to the system. The feature, known as I/O MWAIT redirection, must be enabled in the BIOS. To enable it, refer to the Intel® 64 and IA-32 Architectures Software Developer’s Manual (SDM) Volumes 1, 2, and 3 .
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Power Management A System Management Interrupt (SMI) handler returns execution to either Normal state or the C1/C1E state. See the Intel® 64 and IA-32 Architectures Software Developer’s Manual (SDM) Volumes 1, 2, and 3 for more information. While a core is in C1/C1E state, it processes bus snoops and snoops from other threads.
The package C-states fall into two categories: independent and coordinated. C0/C1/ C1E are independent, while C2/C3/C6 are coordinated. Starting with the 2nd Generation Intel(r) Core(TM) Processor Family, package C-states are based on exit latency requirements which are accumulated from the PCIe* devices, PCH, and software sources.
Autonomous power reduction actions which are based on idle timers, can trigger depending on the activity in the system. The package enters the C1 low power state when: Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
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• L3 shared cache retains context and becomes inaccessible in this state. • Additional power savings actions, as allowed by the exit latency requirements, include putting Intel QPI and PCIe* links in L1, the uncore is not available, further voltage reduction can be taken.
Power Management • Additional power savings actions, as allowed by the exit latency requirements, include putting Intel QPI and PCIe* links in L1, the uncore is not available, further voltage reduction can be taken. In package C6 state, all cores have saved their architectural state and have had their core voltages reduced to zero volts.
(1.5 V or 1.35 V) to the DDR IO must be maintained. 4.3.2.2 Self Refresh Exit Self refresh exit can be either a message from an external unit or as reaction for an incoming transaction. Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
(typically handled automatically when input receiver is disabled). DMI2/PCI Express* Power Management Active State Power Management (ASPM) support using L1 state, L0s is not supported. § Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
This section provides data necessary for developing a complete thermal solution. For more information on designing a component level thermal solution, refer to the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide .
Some processor SKUs support two thermal profiles; refer to Table 5-1for a summary of the planned SKUs and their supported thermal profiles. Both ensure adherence to Intel reliability requirements. Thermal Profile 2U is representative of a volumetrically unconstrained thermal solution (that is, industry enabled 2U heatsink). With single thermal profile, it is expected that the Thermal Control Circuit (TCC) would be activated for very brief periods of time when running the most power intensive applications.
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DTS PECI commands will also support DTS temperature data readings. Please see Section 2.5.7, “DTS Temperature Data” for PECI command details. Also, refer to the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide for details on DTS based thermal solution design considerations.
Table 5-3 for discrete points that constitute the thermal profile. Implementation of this Thermal Profile should result in virtually no TCC activation. Refer to the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide for system and environmental implementation details.
Table 5-3 for discrete points that constitute the thermal profile. Implementation of this Thermal Profile should result in virtually no TCC activation. Refer to the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide for system and environmental implementation details.
Table 5-5 for discrete points that constitute the thermal profile. Implementation of this Thermal Profile should result in virtually no TCC activation. Refer to the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide for system and environmental implementation details.
Table 5-5 for discrete points that constitute the thermal profile. Implementation of this Thermal Profile should result in virtually no TCC activation. Refer to the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide for system and environmental implementation details.
Power specifications are defined at all VIDs found in Table 7-3. The processor may be delivered under multiple VIDs for each frequency. FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor frequency requirements. Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
Notes: Please refer to Table 5-7 for discrete points that constitute this thermal profile. Refer to the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide for system and environmental implementation details. Figure 5-6. DTS: 8-Core 130W Thermal Profile 1U...
Please refer to Table 5-7 for discrete points that constitute the thermal profile. Refer to the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide for system and environmental implementation details. Table 5-7. 8/6-Core 130W Thermal Profile Table 1U (Sheet 1 of 2) Maximum T (°C)
7-3. The processor may be delivered under multiple VIDs for each frequency. FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor frequency requirements. Figure 5-8. Tcase: 6-Core 130W 1S WS Thermal Profile Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
Table 5-9 for discrete points that constitute the thermal profile. Implementation of this Thermal Profile should result in virtually no TCC activation. Refer to the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide for system and environmental implementation details.
Power specifications are defined at all VIDs found in Table 7-3. The processor may be delivered under multiple VIDs for each frequency. FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor frequency requirements. Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
Table 5-11 for discrete points that constitute the thermal profile. Implementation of this Thermal Profile should result in virtually no TCC activation. Refer to the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide for system and environmental implementation details.
Thermal Management Specifications Refer to the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide for system and environmental implementation details. Table 5-11. 8-Core 115W Thermal Profile Table 1U Power (W) Maximum T (°C) Maximum DTS (°C) CASE 55.0 55.0 56.1...
Please refer to Table 5-13 for discrete points that constitute this thermal profile. Refer to the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide for system and environmental implementation details. Figure 5-13. DTS: 8-Core 95W Thermal Profile 1U Notes: Some processor units may be tested to lower TDP and the TEMPERATURE_TARGET MSR will be aligned to that lower TDP.
Table 5-13 for discrete points that constitute this thermal profile. Refer to the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide for system and environmental implementation details. Table 5-13. 8/6-Core 95W Thermal Profile Table 1U (Sheet 1 of 2) Maximum T (°C)
Table 5-15 for discrete points that constitute the thermal profile. Implementation of this Thermal Profile should result in virtually no TCC activation. Refer to the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide for system and environmental implementation details.
Table 5-15 for discrete points that constitute the thermal profile. Implementation of this Thermal Profile should result in virtually no TCC activation. Refer to the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide for system and environmental implementation details.
Table 5-17 for discrete points that constitute the thermal profile. Implementation of this Thermal Profile should result in virtually no TCC activation. Refer to the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide for system and environmental implementation details.
Table 5-17 for discrete points that constitute the thermal profile. Implementation of this Thermal Profile should result in virtually no TCC activation. Refer to the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide for system and environmental implementation details.
Table 5-19 for discrete points that constitute the thermal profile. Implementation of this Thermal Profile should result in virtually no TCC activation. Refer to the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide for system and environmental implementation details.
Table 5-19 for discrete points that constitute the thermal profile. Implementation of this Thermal Profile should result in virtually no TCC activation. Refer to the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide for system and environmental implementation details.
Power specifications are defined at all VIDs found in Table 7-3. The processor may be delivered under multiple VIDs for each frequency. FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor frequency requirements. Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
This Thermal Profile is representative of a volumetrically constrained platform. Please refer to Table 5-21 for discrete points that constitute this thermal profile. Refer to the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide for system and environmental implementation details. Figure 5-22. DTS: 4-Core 130W 1S WS Thermal Profile...
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86.3 66.0 88.2 67.0 90.0 5.1.3.11 4-Core 95W Thermal Specifications The 4-Core 95W thermal specifications only applies to the Intel® Xeon® Processor E5- 4600 Product Family. Table 5-22. Tcase: 4-Core 95W Thermal Specifications 1U Core Thermal Design Minimum Maximum Notes...
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Table 5-23 for discrete points that constitute the thermal profile. Implementation of this Thermal Profile should result in virtually no TCC activation. Refer to the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide for system and environmental implementation details.
Table 5-23 for discrete points that constitute the thermal profile. Implementation of this Thermal Profile should result in virtually no TCC activation. Refer to the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide for system and environmental implementation details.
Table 5-25 for discrete points that constitute the thermal profile. Implementation of this Thermal Profile should result in virtually no TCC activation. Refer to the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide for system and environmental implementation details.
Table 5-25 for discrete points that constitute the thermal profile. Implementation of this Thermal Profile should result in virtually no TCC activation. Refer to the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide for system and environmental implementation details.
Power specifications are defined at all VIDs found in Table 7-3. The processor may be delivered under multiple VIDs for each frequency. FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor frequency requirements. Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
Table 5-28 for discrete points that constitute the thermal profile. Implementation of this Thermal Profile should result in virtually no TCC activation. Refer to the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide for system and environmental implementation details.
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Table 5-28 for discrete points that constitute the thermal profile. Implementation of this Thermal Profile should result in virtually no TCC activation. Refer to the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide for system and environmental implementation details.
VIDs for each frequency. FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor frequency requirements. Figure 5-30. Tcase: 8-Core LV70W Thermal Profile, Embedded Server SKU Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
Table 5-30 for discrete points that constitute the thermal profile. Implementation of this Thermal Profile should result in virtually no TCC activation. Refer to the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide for system and environmental implementation details.
T temperature CASE measurements should be made. For detailed guidelines on temperature measurement methodology, refer to the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide . Figure 5-32. Case Temperature (T ) Measurement Location CASE Notes: Figure is not to scale and is for reference only.
In addition, a thermal solution that is significantly under-designed may not be capable of cooling the processor even when the TCC is active continuously. Refer to the Intel® Xeon® Processor E5-1600/E5-2600/ E5-4600 Product Families Thermal/Mechanical Design Guide for information on designing a compliant thermal solution.
SVID/frequency points. Transition of the SVID code will occur first, to insure proper operation once the processor reaches its normal operating frequency. Refer to Figure 5-33 for an illustration of this ordering. Figure 5-33. Frequency and Voltage Ordering Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
(using Freq/SVID control). Clock modulation is not activated in this case. The TCC will remain active until the system de-asserts PROCHOT_N. Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
5.2.6.1.1 Open Loop Thermal Throttling (OLTT) Pure energy based estimation for systems with no BMC or Intel ME. No memory temperature information is provided by the platform or DIMMs. The CPU is informed of the ambient temperature estimate by the BIOS or by a device via the PECI interface.
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PCU. When needed, system memory is then throttled using CAS bandwidth control. The processor supports dynamic reprogramming of the memory thermal limits based on system thermal state by the BMC or Intel ME. 5.2.6.3 MEM_HOT_C01_N and MEM_HOT_C23_N Signal The processor includes a pair of new bi-directional memory thermal status signals useful for manageability schemes.
On Die Termination. Enables DRAM on die termination during Data Write or Data Read transactions. DDR{0/1/2/3}_PAR_ERR_N Parity Error detected by Registered DIMM (one for each channel). DDR{0/1/2/3}_RAS_N Row Address Strobe. DDR{0/1/2/3}_WE_N Write Enable. Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
Signal Name Description QPI_RBIAS This input is used to control Intel QPI bias currents. QPI_RBIAS is required to be connected as if the link is being used even when Intel QPI is not used. Refer to the appropriate Platform Design Guide (PDG) for further details.
TRST_N (Test Reset) resets the Test Access Port (TAP) logic. TRST_N must be driven TRST_N low during power on Reset. Note: Refer to the appropriate Platform Design Guide (PDG) for Debug Port implementation details. Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
• 0: Service Processor Boot Mode Disabled. Example boot modes: Local PCH (this processor hosts a legacy PCH with firmware behind it), Intel QPI Link Boot (for processors one hop away from the FW agent), or Intel QPI Link Init (for processors more than one hop away from the firmware agent).
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SOCKET_ID[1:0] Socket ID Strap. Socket identification configuration straps for establishing the PECI address, Intel QPI Node ID, and other settings. This signal is used in combination with FRMAGENT to determine whether the socket is a legacy socket, bootable firmware agent is present, and DMI links are used in PCIe* mode (instead of DMI2 mode).
(sDP) platforms should choose this setting if the Node Controller does not support Intel TXT. 1 = Default. The platform is Intel TXT enabled. All sockets should be set to one. In a non- Scalable DP platform this is the default. When this is set, Intel TXT functionality requires user to explicitly enable Intel TXT via BIOS setup.
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Variable power supply for the processor system agent units. These include logic (non-I/O) for the integrated I/O controller, the integrated memory controller (iMC), the Intel QPI agent, and the Power Control Unit (PCU). The output voltage of this supply is selected by the processor, using the serial voltage ID (SVID) bus.
7.1.4 Intel QuickPath Interconnect (Intel QPI) The processor provides two Intel QPI port for high speed serial transfer between other processors. Each port consists of two uni-directional links (for transmit and receive). A differential signaling scheme is utilized, which consists of opposite-polarity (DP, DN) signal pairs.
The processor core, processor uncore, Intel® QuickPath Interconnect link, PCI Express* and DDR3 memory interface frequencies) are generated from BCLK{0/1}_DP and BCLK{0/1}_DN signals. There is no direct link between core frequency and Intel QuickPath Interconnect link frequency (for example, no core frequency to Intel QuickPath Interconnect multiplier).
Due to the voltage levels supported by other components in the JTAG and Test Access Port (TAP) logic, Intel recommends the processor be first in the TAP chain, followed by any other components within the system. Please refer to the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families –...
Vout MAX register (30h) is programmed by the processor to set the maximum supported VID code and if the programmed VID code is Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
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The SetVID-slow command is preemptive, the VR interrupts its current processes and moves to the new VID. This is the instruction used for normal P-state voltage change. This command is used in the processor for the Intel Enhanced SpeedStep Technology transitions.
The processor must re-issue low power state (PS1 or PS2) command if it is in a low current condition at the new higher voltage. See Figure 7-2 for VR power state transitions. Figure 7-2. VR Power-State Transitions Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
Analog reference or output. May be used as a threshold voltage or for buffer compensation Asynchronous Signal has no timing relationship with any system reference clock. CMOS CMOS buffers: 1.05 V or 1.5 V tolerant Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
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Direct Media Interface Gen 2 signals. These signals are compatible with PCI Express* 2.0 and 1.0 Signaling Environment AC Specifications. Intel QPI Current-mode 6.4 GT/s and 8.0 GT/s forwarded-clock Intel QuickPath Interconnect signaling Open Drain CMOS Open Drain CMOS (ODCMOS) buffers: 1.05 V tolerant PCI Express* PCI Express* interface signals.
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Analog Input/Output QPI_RBIAS Platform Environmental Control Interface (PECI) Single ended PECI PECI System Reference Clock (BCLK{0/1}) Differential CMOS1.05v Input BCLK{0/1}_D[N/P] SMBus Single ended Open Drain CMOS Input/ DDR_SCL_C{01/23} Output DDR_SDA_C{01/23} PEHPSCL PEHPSDA Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
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VSS_VTTD_SENSE VTTD_SENSE VSA_SENSE VSS_VSA_SENSE Notes: Refer to Section 6, “Signal Descriptions” for signal description details. DDR{0/1/2/3} refers to DDR3 Channel 0, DDR3 Channel 1, DDR3 Channel 2 and DDR3 Channel 3. Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
7.4. The signal used to latch PROCHOT_N for enabling FRB mode is RESET_N. BIST_ENABLE is sampled at RESET_N de-assertion and CPU_ONLY_RESET de-assertion (on the falling edge). This signal is sampled after PWRGOOD assertion. Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
SVID SVIDCLK Mixing Processors Intel supports and validates and four two processor configurations only in which all processors operate with the same Intel QuickPath Interconnect frequency, core frequency, power segment, and have the same internal cache sizes. Mixing components operating at different internal clock frequencies is not supported and will not be validated by Intel.
Electrical Specifications Technology transitions signal. Please refer to the Intel® 64 and IA-32 Architectures Software Developer’s Manual (SDM) Volumes 1, 2, and 3 for details on the FLEX_RATIO MSR and setting the processor core frequency. Not all operating systems can support dual processors with mixed frequencies. Mixing...
Provided as general guidance only, Intel board products are specified and certified to meet the following temperature and humidity limits (Non-Operating Temperature Limit: -40°C to 70°C & Humidity: 50% to 90%, non condensing with a maximum wet bulb of 28°C).
DC specifications are only valid while meeting specifications for case temperature specified in Section 5), clock frequency, and input voltages. Care should be CASE taken to read all notes associated with each specification. Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
13. DC + AC + Ripple = Total Tolerance 14. For Power State Functions see Section 7.1.9.3.5. 15. V does not have a loadline, the output voltage is expected to be the VID value. SA_VID Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
(T ) shown in Section 5, CASE “Thermal Management Specifications”. I is specified at the relative V point on the V load line. The processor is CC_MAX CC_MAX Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
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1,2,3,4,5,6 VID - 0.129 VID - 0.144 VID - 0.159 1,2,3,4,5,6 VID - 0.133 VID - 0.148 VID - 0.163 1,2,3,4,5,6 Notes: The loadline specification includes both static and transient limits. Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
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1,2,3,4,5,6 VID - 0.021 VID - 0.036 VID - 0.051 1,2,3,4,5,6 VID - 0.025 VID - 0.040 VID - 0.055 1,2,3,4,5,6 VID - 0.029 VID - 0.044 VID - 0.059 1,2,3,4,5,6 Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
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The Adaptive Loadline Positioning slope is 0.8 m . The 4/2-core Icc ranges are as follows: • 0-150 A for 130 W processor 0-135 A for 95 W processo • • 0-100 A for 80 W processor Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
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VID + 0.000 VID - 0.000 VID - 0.020 Maximum VID - 0.040 VID - 0.060 VID - 0.080 Typical VID - 0.100 VID - 0.120 Minimum VID - 0.140 VID - 0.160 Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
VID). These specifications apply to the processor die voltage as measured across the VCC_SENSE and VSS_VCC_SENSE lands. Table 7-15. V Overshoot Specifications (Sheet 1 of 2) Symbol Parameter Units Figure Notes Magnitude of V overshoot above VID OS_MAX Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
0.57*V 2, 4, 5 DDR3 Data Buffer On Resistance Data ODT On-Die Termination for Data Signals PAR_ERR_N ODT On-Die Termination for Parity Error Signals Reference Clock Signals, Command, and Data Signals Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
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11. DRAM_PWR_OK_C{01/23} must have a maximum of 30 ns rise or fall time over VCCD * 0.55 +300 mV and -200 mV and the edge must be monotonic. 12. The DDR01/23_RCOMP error tolerance is ± 15% from the compensated value. Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
The rising edge of BCLK{0/1}_DN is equal to the falling edge of BCLK{0/1}_DP. For Vin between 0 and Vih. Table 7-19. SMBus DC Specifications (Sheet 1 of 2) Symbol Parameter Units Notes Input Low Voltage 0.3*V Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
7.8.3.3 Intel QuickPath Interconnect DC Specifications Intel QuickPath Interconnect specifications are defined at the processor lands. Please refer to the appropriate platform design guidelines for specific implementation details. In most cases, termination resistors are not required as these are integrated into the processor silicon.
Signal Quality specifications for PCIe* Signals are included as part of the PCIe* DC specifications. Various scenarios have been simulated to generate a set of layout guidelines which are available in the appropriate Platform Design Guide (PDG). Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
Intel QuickPath Interconnect Signal Quality Specifications Signal Quality specifications for Differential Intel® QuickPath Interconnect Signals are included as part of the Intel QuickPath Interconnect signal quality specifications. Various scenarios have been simulated to generate a set of layout guidelines which are available in the appropriate Platform Design Guide (PDG).
However most systems will have multiple overshoot and/or undershoot events that each have their own set of parameters (duration, AF and magnitude). While each overshoot on its own may meet Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
0.2835 V 3 ns 5 ns 1.2600 V 0.210 V 5 ns 5 ns Figure 7-11. Maximum Acceptable Overshoot/Undershoot Waveform Over Shoot Over Shoot Duration Under Shoot Duration Under Shoot § Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
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Land Name (Sheet 46 of 49) Land Name Land No. Buffer Type Direction Land Name Land No. Buffer Type Direction DD38 DE17 DE41 DE53 DF12 DF36 DF42 DF44 DF46 DF48 DF50 DF52 Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
Figure 9-1 shows a sketch of the processor package components and how they are assembled together. Refer to the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide for complete details on the LGA2011-0 land FCLGA10 socket.
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6. All drawing dimensions are in millimeters (mm). 7. Guidelines on potential IHS flatness variation with socket load plate actuation and installation of the cooling solution is available in the Intel® Xeon® Processor E5- 1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide .
Dynamic loading is defined as an 11 ms duration average load superimposed on the static load requirement. See Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide for minimum socket load to engage processor within socket. Package Handling Guidelines...
2600 product family (LGA2011-0 land FCLGA10) processors will be offered as Intel boxed processors, however the thermal solutions will be sold separately. Boxed processors will not include a thermal solution in the box. Intel will offer boxed thermal solutions separately through the same distribution channels. Please reference Section 10.1.1...
PWM and PECI interface along with Digital Thermal Sensors (DTS). 10.1.3 Intel Thermal Solution STS200P and STS200PNRW (Boxed 25.5 mm Tall Passive Heat Sink Solutions) The STS200P and STS200PNRW are available for use with boxed processors that have TDP’s of 130W and lower.
None of the heat sink solutions exceed a mass of 550 grams. Note that this is per processor, a dual processor system will have up to 1100 grams total mass in the heat sinks. See Section 9.6 for details on the processor mass test. Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
For specific design details on the standard and narrow ILM-RS and the Backplate please refer to the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide .
These thermal solutions are for use with processor SKUs no higher than 130W (6 and 8 Core), or 80W (4 Core). Note: Please refer to the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide for detailed mechanical drawings of the STS200P and STS200PNRW.
Table 10-2 Table 10-3 for detailed dimensions. Dimensions of heatsinks do not include socket or processor. 10.4 Boxed Processor Contents The Boxed Processor and Boxed Thermal Solution contents are outlined below. Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Datasheet Volume One...
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Boxed Processor Specifications Boxed Processor • Intel® Xeon® processor E5-2600 product family • Installation and warranty manual • Intel Inside Logo Boxed Thermal Solution • Thermal solution assembly • Thermal interface material (pre-applied) • Installation and warranty manual § Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families...
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