Processor Technology; Memory Technology - HP Z210 Maintenance And Service Manual

Convertible mini tower workstation
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The following figure shows the typical system board block diagram.
Figure 1-1
NOTE:
The x1, x4, and x16 designators describe the mechanical length of the slot. The number in
parentheses lists the number of electrical PCIe lanes routed to the expansion slot. For example, x16(4)
means that the expansion slot is mechanically a x16 length connector, with four PCIe lanes connected.

Processor technology

This workstation uses the latest 32nm process SKT-H2 chipset, with support for the Intel® Xeon®
Processor E3 Family or 2nd generation Intel Core(TM) processors up to 95W. These processors
incorporate an integrated 2-channel memory controller, microarchitecture improvements, integrated
graphics (some models) and Advanced Vector Extensions (AVX) to increase floating point performance.
In addition, the chipset uses the Intel DMIx4 interface to connect the processor and I/O controller.

Memory technology

The workstation dual in-line memory modules (DIMMs) are based on DDR3 1066/1333MHz
technology. Error checking and correcting (ECC) and non-ECC DIMMs are supported. Two direct-attach
memory channels permit low latency access and fast data transfer to improve performance. System
memory sizes up to 32GB (using 8GB DIMMs) are supported.
NOTE:
To optimize performance, distribute the DIMMs across both memory channels. See
on page 83
2
Chapter 1 Product overview
System board block diagram
for more information.
Memory
ENWW

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