References; Definition Of Terms - Intel QX9770 - Core 2 Extreme Quad-Core Processor Design Manual

Intel core 2 extreme processor qx6800 and intel core 2 extreme processor qx9770 thermal and mechanical design guidelines
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Introduction
1.2

References

Material and concepts available in the following documents may be beneficial when
reading this document.
®
Intel
Core™2 Extreme Processor QX9000 Series and Intel
Core™2 Quad Processor Q9000 Series Datasheet
®
Intel
Core™2 Extreme Quad-Core Processor QX6000
Sequence and Intel
Datasheet
LGA775 Socket Mechanical Design Guide
Fan Specification for 4-wire PWM Controlled Fans
ATX Thermal Design Suggestions
microATX Thermal Design Suggestions
Balanced Technology Extended (BTX) System Design Guide
1.3

Definition of Terms

Term
T
T
T
T
T
C-MAX
T
LIQUID
Ψ
Ψ
Ψ
Thermal and Mechanical Design Guidelines
Document
®
Core™2 Quad Processor Q6000
The measured ambient temperature locally surrounding the processor. The ambient
temperature should be measured just upstream of a passive heatsink or at the fan
A
inlet for an active heatsink.
The case temperature of the processor, measured at the geometric center of the
C
topside of the IHS.
The ambient air temperature external to a system chassis. This temperature is usually
E
measured at the chassis air inlets.
Heatsink temperature measured on the underside of the heatsink base, at a location
corresponding to
S
The maximum case temperature as specified in a component specification.
Working fluid temperature as it leaves the pump (or enters the heat exchanger).
Case-to-ambient thermal characterization parameter (psi). A measure of thermal
solution performance using total package power. Defined as (T
Power.
CA
Note: Heat source must be specified for
Case-to-sink thermal characterization parameter. A measure of thermal interface
material performance using total package power. Defined as (T
Power.
CS
Note: Heat source must be specified for
Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal
performance using total package power. Defined as (T
SA
Note: Heat source must be specified for
®
Δ
Δ
Sequence
Description
T
.
C
Ψ
measurements.
Ψ
measurements.
Ψ
measurements.
Location
http://w.ww.intel.com/design/pro
cessor/datashts/318726.htm
http://developer.intel.com/design
/processor/datashts/315592.htm
http://intel.com/design/
Pentium4/guides/ 302666.htm
http://www.formfactors.org/
http://www.formfactors.org/
http://www.formfactors.org/
http://www.formfactors.org/
– T
) / Total Package
C
A
– T
) / Total Package
C
S
– T
) / Total Package Power.
S
A
11

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