Intel QX9770 - Core 2 Extreme Quad-Core Processor Design Manual page 4

4.2.8
4.2.9
4.2.10
4.2.11
5 Intel Thermal/Mechanical Reference Design Information .......................................39
5.1 Validation Results for the ATX Reference Design .......................................39
5.1.1
5.1.2
5.1.3
5.1.4
5.1.5
5.1.6
5.2 Environmental Reliability Testing ............................................................44
5.2.1
5.2.2
5.2.3
5.2.4
5.3 Material and Recycling Requirements ......................................................52
5.4 Safety Requirements ............................................................................52
5.5 Geometric Envelope for Intel Reference ATX Thermal Mechanical Design ......52
5.6 Reference Attach Mechanism..................................................................54
5.7 Socket and Voltage Regulation Cooling Strategy .......................................55
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6 Intel Quiet System Technology (Intel
6.1 Intel
6.1.1
6.1.2
6.2 Board and System Implementation of Intel
6.3 Intel
6.4 Fan Hub Thermistor and Intel
Appendix A LGA775 Socket Heatsink Loading ......................................................................63
A.1 LGA775 Socket Heatsink Considerations ..................................................63
A.2 Metric for Heatsink Preload for ATX/uATX Designs Non-Compliant with Intel
Reference Design .................................................................................64
A.2.1
A.2.2
A.2.3
A.2.4
A.2.5
A.3 Heatsink Selection Guidelines.................................................................68
Appendix B Heatsink Clip Load Metrology ............................................................................69
B.1 Overview ............................................................................................69
B.2 Test Preparation...................................................................................69
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THERMTRIP# Signal.................................................................36
Cooling System Failure Warning ................................................36
Digital Thermal Sensor.............................................................37
Platform Environmental Control Interface (PECI).......................... 38
Heatsink Performance ..............................................................40
Acoustics ...............................................................................40
Altitude..................................................................................41
Reference Heatsink Thermal Validation .......................................41
Fan Motor Performance ............................................................42
Pump Motor Performance .........................................................43
Structural Reliability Testing .....................................................44
5.2.1.1 Random Vibration Test Procedure................................44
5.2.1.2 Shock Test Procedure ................................................45
Power Cycling .........................................................................46
Reliability Testing ....................................................................46
5.2.3.1 Tubing Material Selection ...........................................48
5.2.3.2 Reservoir Sizing .......................................................48
5.2.3.3 Reliability Test Results...............................................50
Recommended BIOS/CPU/Memory Test Procedures ......................51
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Quiet System Technology Algorithm...............................................57
Output Weighting Matrix ..........................................................58
Proportional-Integral-Derivative (PID) ........................................58
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QST Configuration & Tuning..........................................................62
Heatsink Preload Requirement Limitations...................................64
Motherboard Deflection Metric Definition.....................................64
Board Deflection Limits ............................................................66
Board Deflection Metric Implementation Example.........................66
Additional Considerations .........................................................67
A.2.5.1 Motherboard Stiffening Considerations .........................68
LGA775 Socket Heatsink Loading
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QST) .....................................................57
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Quiet System Technology .......60
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QST ........................................................62
Thermal and Mechanical Design Guidelines
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