Figure 33. Ihs Groove On The 775-Land Lga Package; Figure 34. Ihs Groove Orientation Relative To The Lga775 Socket - Intel QX9770 - Core 2 Extreme Quad-Core Processor Design Manual
Intel core 2 extreme processor qx6800 and intel core 2 extreme processor qx9770 thermal and mechanical design guidelines
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Case Temperature Reference Metrology
The orientation of the groove relative to the package pin 1 indicator (gold triangle in
one corner of the package) is shown. Figure 33 for the 775-Land LGA package IHS.
Figure 33. IHS Groove on the 775-LAND LGA Package
indicator
When the processor is installed in the LGA775 socket, the groove is perpendicular to
the socket load lever, and on the opposite side of the lever, as shown Figure 34.
Figure 34. IHS Groove Orientation Relative to the LGA775 Socket
Select a machine shop that is capable of holding drawing specified tolerances. IHS
groove geometry is critical for repeatable placement of the thermocouple bead,
ensuring precise thermal measurements. The specified dimensions minimize the
impact of the groove on the IHS under the socket load. A larger groove may cause the
IHS to warp under the socket load such that it does not represent the performance of
an ungrooved IHS on production packages.
Inspect parts for compliance to specifications before accepting from machine shop.
Thermal and Mechanical Design Guidelines
Pin1
IHS Groove
81
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