Intel QX9770 - Core 2 Extreme Quad-Core Processor Design Manual page 6

Figures
Figure 1. Package IHS Load Areas .....................................................................13
Figure 2. Processor Case Temperature Measurement Location ............................... 17
Figure 3. Example Thermal Profile .....................................................................18
Figure 4. Processor Thermal Characterization Parameter Relationships....................24
Figure 5. Locations for Measuring Local Ambient Temperature, Active Heatsink ........27
Figure 6. Locations for Measuring Local Ambient Temperature, Liquid-Cooling Heat
Figure 7. Locations for Measuring Local Ambient Temperature, Passive Heatsink ......28
Figure 8. Concept for Clocks under Thermal Monitor Control..................................33
Figure 9. Thermal Monitor 2 Frequency and Voltage Ordering ................................34
Figure 10. T
Figure 11. Random Vibration PSD......................................................................44
Figure 12. Shock Acceleration Curve ..................................................................45
Figure 13. The Assembly Cumulative Mass Loss Data in Continuous Operation
Figure 14. Thermal Resistance Curve for Liquid Loss of Reservoir ........................... 49
Figure 15. Reservoir Location............................................................................50
Figure 16. Intel
Figure 17. Heat Exchanger Fan Combination Foot Print View .................................53
Figure 18. Structure to Motherboard Interface.....................................................54
Figure 19. Diagram of Location of Heat Exchanger VR and Socket Airflow Cooling
Figure 20. CPU Maximum Current Draw for Heat Exchanger Fan Speed ...................56
Figure 21. Intel
Figure 22. PID Controller Fundamentals .............................................................59
Figure 23. Intel
Figure 24. Example Acoustic Fan Speed Control Implementation ............................ 61
Figure 25. Digital Thermal Sensor and Thermistor................................................62
Figure 26. Board Deflection Definition ................................................................65
Figure 27. Example: Defining Heatsink Preload Meeting Board Deflection Limit ........67
Figure 28. Load Cell Installation in Machined Heatsink Base Pocket - Bottom View ...70
Figure 29. Load Cell Installation in Machined Heatsink Base Pocket - Side View .......71
Figure 30. Preload Test Configuration.................................................................71
Figure 31. Omega Thermocouple .......................................................................79
Figure 32. 775-LAND LGA Package Reference Groove Drawing...............................80
Figure 33. IHS Groove on the 775-LAND LGA Package..........................................81
Figure 34. IHS Groove Orientation Relative to the LGA775 Socket .......................... 81
Figure 35. Inspection of Insulation on Thermocouple............................................82
Figure 36. Bending the Tip of the Thermocouple ..................................................83
Figure 37. Securing Thermocouple Wires with Kapton* Tape Prior to Attach ............83
Figure 38. Thermocouple Bead Placement...........................................................84
Figure 39. Position Bead on the Groove Step.......................................................85
Figure 44. Detailed Thermocouple Bead Placement ..............................................85
Figure 41. Third Tape Installation ......................................................................86
Figure 42. Measuring Resistance between Thermocouple and IHS ..........................86
Figure 43. Applying Flux to the Thermocouple Bead .............................................87
Figure 44. Cutting Solder .................................................................................87
Figure 45. Positioning Solder on IHS ..................................................................88
Figure 46. Solder Station Setup ........................................................................89
Figure 47. View Through Lens at Solder Station...................................................90
Figure 48. Moving Solder back onto Thermocouple Bead .......................................90
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Exchanger.........................................................................................28
for Digital Thermometer ........................................................37
CONTROL
Test at 50 ºC and 1450 RPM ..............................................................49
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ALCT Reference Design Major Components .................................53
Feature...........................................................................................55
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Quiet System Technology Overview ...........................................58
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Quiet System Technology Platform Requirements ........................ 60
LGA775 Socket Heatsink Loading
Thermal and Mechanical Design Guidelines