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Intel QX68000 Core 2 Extreme Manuals
Manuals and User Guides for Intel QX68000 Core 2 Extreme. We have
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Intel QX68000 Core 2 Extreme manual available for free PDF download: Design Manual
Intel QX68000 Core 2 Extreme Design Manual (123 pages)
Intel Core 2 Extreme Processor QX6800 and Intel Core 2 Extreme Processor QX9770 Thermal and Mechanical Design Guidelines
Brand:
Intel
| Category:
Computer Hardware
| Size: 2.78 MB
Table of Contents
Table of Contents
3
Revision History
8
1 Introduction
9
Document Goals and Scope
9
Importance of Thermal Management
9
Document Goals
9
Document Scope
10
References
11
Definition of Terms
11
2 Processor Thermal/Mechanical Information
13
Mechanical Requirements
13
Processor Package
13
Figure 1. Package IHS Load Areas
13
Heatsink Attach
15
General Guidelines
15
The Pump Assembly Clip Load Requirement
15
Additional Guidelines
16
Thermal Requirements
16
Processor Case Temperature
16
Thermal Profile
17
Figure 2. Processor Case Temperature Measurement Location
17
Control
18
Figure 3. Example Thermal Profile
18
Heatsink Design Considerations
19
Heatsink Size
20
Package IHS Flatness
20
Thermal Interface Material
21
System Thermal Solution Considerations
21
Chassis Thermal Design Capabilities
21
Improving Chassis Thermal Performance
21
Table 1. Heatsink Inlet Temperature of Intel Reference Thermal Solutions
21
Summary
22
System Integration Considerations
22
3 Thermal Metrology
23
Characterizing Cooling Performance Requirements
23
Figure 4. Processor Thermal Characterization Parameter Relationships
24
Example
25
Processor Thermal Solution Performance Assessment
26
Local Ambient Temperature Measurement Guidelines
26
Figure 5. Locations for Measuring Local Ambient Temperature, Active Heatsink
27
Figure 6. Locations for Measuring Local Ambient Temperature, Liquid-Cooling Heat
28
Figure 7. Locations for Measuring Local Ambient Temperature, Passive Heatsink
28
Processor Case Temperature Measurement Guidelines
29
4 Thermal Management Logic and Thermal Monitor Feature
31
Processor Power Dissipation
31
Thermal Monitor Implementation
31
PROCHOT# Signal
32
Thermal Control Circuit
32
Thermal Monitor 2
33
Figure 8. Concept for Clocks under Thermal Monitor Control
33
Operation and Configuration
34
Figure 9. Thermal Monitor 2 Frequency and Voltage Ordering
34
On-Demand Mode
35
System Considerations
35
Operating System and Application Software Considerations
36
THERMTRIP# Signal
36
Cooling System Failure Warning
36
Digital Thermal Sensor
37
Figure 10. T
37
For Digital Thermometer
37
Platform Environmental Control Interface (PECI)
38
5 Intel Thermal/Mechanical Reference Design Information
39
Validation Results for the ATX Reference Design
39
Heatsink Performance
40
Acoustics
40
Table 2. Intel Liquid Cooled Reference Design Performance (ALCT)
40
Table 3. Acoustic Results
40
Altitude
41
Reference Heatsink Thermal Validation
41
Fan Motor Performance
42
Table 4. Fan Electrical Performance Requirements
42
Pump Motor Performance
43
Table 5. Pump Electrical Performance Requirements
43
Environmental Reliability Testing
44
Structural Reliability Testing
44
Random Vibration Test Procedure
44
Figure 11. Random Vibration PSD
44
Shock Test Procedure
45
Figure 12. Shock Acceleration Curve
45
Power Cycling
46
Reliability Testing
46
Table 6. the Reliability Test Matrix
47
Reservoir Sizing
48
Table 7. the Weekly Loss Rate of Different Tubing Materials
48
Tubing Material Selection
48
Figure 13. the Assembly Cumulative Mass Loss Data in Continuous Operation
49
Figure 14. Thermal Resistance Curve for Liquid Loss of Reservoir
49
Figure 15. Reservoir Location
50
Reliability Test Results
50
Recommended Bios/Cpu/Memory Test Procedures
51
Table 8. Reliability Test Results
51
Material and Recycling Requirements
52
Safety Requirements
52
Geometric Envelope for Intel Reference ATX Thermal Mechanical Design
52
Figure 16. Intel ALCT Reference Design Major Components
53
Figure 17. Heat Exchanger Fan Combination Foot Print View
53
Reference Attach Mechanism
54
Figure 18. Structure to Motherboard Interface
54
Socket and Voltage Regulation Cooling Strategy
55
Figure 19. Diagram of Location of Heat Exchanger VR and Socket Airflow Cooling
55
Figure 20. CPU Maximum Current Draw for Heat Exchanger Fan Speed
56
Table 9. Maximum Estimated Processor Current Capability at 35 ºC External
56
Quiet System Technology
57
Intel ® Quiet System Technology Algorithm
57
Qst)
57
Output Weighting Matrix
58
Proportional-Integral-Derivative (PID)
58
Figure 21. Intel Quiet System Technology Overview
58
Figure 22. PID Controller Fundamentals
59
Board and System Implementation of Intel
60
Quiet System Technology
60
Figure 23. Intel ® Quiet System Technology Platform Requirements
60
Figure 24. Example Acoustic Fan Speed Control Implementation
61
Intel ® QST Configuration & Tuning
62
Fan Hub Thermistor and Intel
62
Qst
62
Figure 25. Digital Thermal Sensor and Thermistor
62
Appendix A LGA775 Socket Heatsink Loading
63
LGA775 Socket Heatsink Considerations
63
Metric for Heatsink Preload for Atx/Uatx Designs Non-Compliant with Intel Reference Design
64
Heatsink Preload Requirement Limitations
64
Motherboard Deflection Metric Definition
64
Figure 26. Board Deflection Definition
65
Table 10. Board Deflection Configuration Definitions
65
Board Deflection Limits
66
Board Deflection Metric Implementation Example
66
Additional Considerations
67
A.2.5 Additional Considerations
67
Figure 27. Example: Defining Heatsink Preload Meeting Board Deflection Limit
67
A.2.5.1 Motherboard Stiffening Considerations
68
Heatsink Selection Guidelines
68
Motherboard Stiffening Considerations
68
Heatsink Clip Load Metrology
69
Overview
69
Test Preparation
69
Heatsink Preparation
69
Test Procedure Examples
72
Table 11. Typical Test Equipment
72
Preload Degradation under Bake Conditions
73
Time-Zero, Room Temperature Preload Measurement
73
Appendix B Heatsink Clip Load Metrology
69
B.1 Overview
69
B.2 Test Preparation
69
B.2.1 Heatsink Preparation
69
Figure 28. Load Cell Installation in Machined Heatsink Base Pocket - Bottom View
70
Figure 29. Load Cell Installation in Machined Heatsink Base Pocket - Side View
71
Figure 30. Preload Test Configuration
71
Typical Test Equipment
72
Appendix C Thermal Interface Management
75
Bond Line Management
75
Interface Material Area
75
Interface Material Performance
75
Appendix D Case Temperature Reference Metrology
77
Objective and Scope
77
Supporting Test Equipment
78
Thermal Calibration and Controls
79
IHS Groove
79
D.4 IHS Groove
79
Figure 31. Omega Thermocouple
79
Figure 32. 775-LAND LGA Package Reference Groove Drawing
80
Figure 33. IHS Groove on the 775-LAND LGA Package
81
Figure 34. IHS Groove Orientation Relative to the LGA775 Socket
81
Thermocouple Attach Procedure
82
Thermocouple Conditioning and Preparation
82
Figure 35. Inspection of Insulation on Thermocouple
82
Thermocouple Attachment to the IHS
83
Figure 36. Bending the Tip of the Thermocouple
83
Figure 37. Securing Thermocouple Wires with Kapton* Tape Prior to Attach
83
Figure 38. Thermocouple Bead Placement
84
Figure 39. Position Bead on the Groove Step
85
Figure 44. Detailed Thermocouple Bead Placement
85
Figure 41. Third Tape Installation
86
Figure 42. Measuring Resistance between Thermocouple and IHS
86
Figure 43. Applying Flux to the Thermocouple Bead
87
Figure 44. Cutting Solder
87
Solder Process
88
D.5.3 Solder Process
88
Figure 45. Positioning Solder on IHS
88
Figure 46. Solder Station Setup
89
Figure 47. View through Lens at Solder Station
90
Figure 48. Moving Solder Back Onto Thermocouple Bead
90
Cleaning and Completion of Thermocouple Installation
91
Figure 49. Removing Excess Solder
91
Figure 50. Thermocouple Placed into Groove
92
Figure 51. Removing Excess Solder
92
Figure 52. Filling Groove with Adhesive
93
Figure 53. Application of Accelerant
93
Figure 54. Removing Excess Adhesive from IHS
94
Figure 55. Finished Thermocouple Installation
94
Thermocouple Wire Management
95
Figure 56. Thermocouple Wire Management
95
Appendix E Legacy Fan Speed Control
97
Thermal Solution Design
97
Determine Thermistor Set Points
97
Minimum Fan Speed Set Point
98
Figure 57. Thermistor Set Points
98
Board and System Implementation
99
Choosing Fan Speed Control Settings
99
Figure 58. Example Fan Speed Control Implementation
99
Figure 59. Fan Speed Control
100
Temperature to Begin Fan Acceleration
100
Figure 60. Temperature Range = 5 °C
101
Figure 61. Temperature Range = 10 °C
102
Minimum PWM Duty Cycle
102
Combining Thermistor and Digital Thermal Sensor Control
103
Interaction of Thermal Profile and T
103
Control
103
Figure 62. Digital Thermal Sensor and Thermistor
103
Table 12. FSC Definitions
104
Figure 63. FSC Definition Example
105
Table 13. ATX FSC Settings
106
Table 14. BTX Fan Speed Control Settings
106
Appendix Fbtx System Thermal Considerations
109
Figure 64. System Airflow Illustration with System Monitor Point Area Identified
110
Figure 65. Thermal Sensor Location Illustration
111
Appendix G Mechanical Drawings
113
Figure 66. Atx/Μatx Motherboard Keep-Out Footprint Definition and Height
113
Restrictions for Enabling Components - Sheet 1
113
Figure 67. Atx/Μatx Motherboard Keep-Out Footprint Definition and Height
113
Restrictions for Enabling Components - Sheet 2
113
Figure 68. Atx/Μatx Motherboard Keep-Out Footprint Definition and Height
113
Restrictions for Enabling Components - Sheet 3
113
Figure 69. Balanced Technology Extended (BTX) Thermal Module Keep out Volumetric - Sheet 1
117
Figure 70. Balanced Technology Extended (BTX) Thermal Module Keep out Volumetric - Sheet 2
118
Figure 71. Balanced Technology Extended (BTX) Thermal Module Keep out Volumetric - Sheet 3
119
Figure 72. Balanced Technology Extended (BTX) Thermal Module Keep out Volumetric - Sheet 4
120
Figure 73. Balanced Technology Extended (BTX) Thermal Module Keep out Volumetric - Sheet 5
121
Figure 74. Intel Advanced Liquid Cooling Technology Assembly
122
Appendix H Intel Enabled Reference Solution Information
123
Table 15. Intel Representative Contact for Licensing Information
123
Table 16. Intel Reference Component ATX Thermal Solution Providers
123
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