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Figure 41. Third Tape Installation
12. Place a 3
Figure 41. This tape will create a solder dam to prevent solder from flowing into
the larger IHS groove section during the melting process.
13. Measure resistance from thermocouple end wires (hold both wires to a DMM
probe) to the IHS surface. This should be the same value as measured during the
thermocouple conditioning Section D.5.1, step 3 (Figure 42)
Figure 42. Measuring Resistance between Thermocouple and IHS
86
rd
piece of tape at the end of the step in the groove as shown in
Case Temperature Reference Metrology
Thermal and Mechanical Design Guidelines
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