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Intel Thermal/Mechanical Reference Design Information
Table 8. Reliability Test Results
Use
Condition
Continuous
Operation
On-off
Cycles
5.2.4
Recommended BIOS/CPU/Memory Test Procedures
This test is to ensure proper operation of the product before and after environmental
stresses, with the thermal mechanical enabling components assembled. The test shall
be conducted on a fully operational motherboard that has not been exposed to any
battery of tests prior to the test being considered.
Testing setup should include the following components, properly assembled and/or
connected:
• Appropriate system motherboard
• Processor
• All enabling components, including socket and thermal solution parts
• Power supply
• Disk drive
• Video card
• DIMM
• Keyboard
• Monitor
The pass criterion is that the system under test shall successfully complete the
checking of BIOS, basic processor functions and memory, without any errors.
Thermal and Mechanical Design Guidelines
Test Conditions
mechanism
T
= 75 ºC
LIQUID
for 16 weeks
T
= 50 ºC
LIQUID
T
= 50 ºC
LIQUID
T
= 50 ºC
LIQUID
T
= 35-60 ºC,
LIQUID
5500 cycles
T
= 35-60 ºC,
LIQUID
5500 cycles
T
= 35-60 ºC,
LIQUID
7500 cycles
Failure
1
0/10 failure
2
0.25-0.30 grams/week
3
Insignificant change in Ψca for 3
samples
4
2% average RPM degradation after 8
weeks for 3 samples
1
0/3 failure
2
3 grams loss after all cycles for 3
samples
4
No RPM degradation for 0/3 samples
Results
51
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