Material And Recycling Requirements; Safety Requirements; Geometric Envelope For Intel Reference Atx Thermal Mechanical Design - Intel QX9770 - Core 2 Extreme Quad-Core Processor Design Manual

5.3

Material and Recycling Requirements

Material shall be resistant to fungal growth. Examples of non-resistant materials
include cellulose materials, animal and vegetable based adhesives, grease, oils, and
many hydrocarbons. Synthetic materials such as PVC formulations, certain
polyurethane compositions (e.g., polyester and some polyethers), plastics which
contain organic fillers of laminating materials, paints, and varnishes also are
susceptible to fungal growth. If materials are not fungal growth resistant, then MIL-
STD-810E, Method 508.4 must be performed to determine material performance.
Material used shall not have deformation or degradation in a temperature life test.
Any plastic component exceeding 25 grams must be recyclable per the European Blue
Angel recycling standards.
5.4

Safety Requirements

Heatsink and attachment assemblies shall be consistent with the manufacture of units
that meet the safety standards:
• UL Recognition-approved for flammability at the system level. All mechanical and
thermal enabling components must be a minimum UL94V-2 approved.
• CSA Certification. All mechanical and thermal enabling components must have
CSA certification.
• All components (in particular the heatsink fins) must meet the test requirements
of UL1439 for sharp edges.
• If the International Accessibility Probe specified in IEC 950 can access the moving
parts of the fan, consider adding safety feature so that there is no risk of personal
injury.
5.5 Geometric Envelope for Intel Reference ATX
Thermal Mechanical Design
Figure 66, Figure 67, and Figure 68 in Appendix G gives detailed reference ATX/μATX
motherboard keep-out information for the reference thermal/mechanical enabling
design. These drawings include height restrictions in the enabling component region.
The maximum height of the reference solution above the motherboard is 71.12 mm
[2.8 inches] except for the flexible hoses which transit the area to the heat exchanger
which is mounted on the back panel, and is compliant with the motherboard primary
side height constraints defined in the ATX Specification revision 2.2 and the microATX
Motherboard Interface Specification revision 1.2 found at http://www.formfactors.org.
Figure 16 shows the Intel
solution also requires suitable space to mount the heat exchanger fan combination on
the back panel. Figure 17 gives the required foot print on the back panel.
52
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ALCT Reference Design Major Components. The reference
LGA775 Socket Heatsink Loading
Thermal and Mechanical Design Guidelines