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Term
TIM
P
MAX
TDP
IHS
LGA775 Socket
ACPI
Bypass
Thermal
Monitor
TCC
DTS
T
DIODE
FSC
T
CONTROL_BASE
T
CONTROL_OFFSET
T
CONTROL
PWM
Health Monitor
Component
BTX
TMA
12
Thermal Interface Material: The thermally conductive compound between the heatsink
and the processor case. This material fills the air gaps and voids, and enhances the
transfer of the heat from the processor case to the heatsink.
The maximum power dissipated by a semiconductor component.
Thermal Design Power: a power dissipation target based on worst-case applications.
Thermal solutions should be designed to dissipate the thermal design power.
Integrated Heat Spreader: a thermally conductive lid integrated into a processor
package to improve heat transfer to a thermal solution through heat spreading.
The surface mount socket designed to accept the processors in the 775–Land LGA
package.
Advanced Configuration and Power Interface.
Bypass is the area between a passive heatsink and any object that can act to form a
duct. For this example, it can be expressed as a dimension away from the outside
dimension of the fins to the nearest surface.
A feature on the processor that attempts to keep the processor die temperature within
factory specifications.
Thermal Control Circuit: Thermal Monitor uses the TCC to reduce die temperature by
lowering effective processor frequency when the die temperature has exceeded its
operating limits.
Digital Thermal Sensor: Processor die sensor temperature defined as an offset from
the onset of PROCHOT#.
Temperature reported from the on-die thermal diode.
Fan Speed Control: Thermal solution that includes a variable fan speed which is
driven by a PWM signal and uses the digital thermal sensor as a reference to change
the duty cycle of the PWM signal.
Constant from the processor datasheet that is added to the T
T
results in the value for
CONTROL
Value read by the BIOS from a processor MSR and added to the
T
results in the value for
CONTROL
T
is the specification limit for use with the digital thermal sensor.
CONTROL
Pulse width modulation is a method of controlling a variable speed fan. The enabled
4 wire fans use the PWM duty cycle % from the fan speed controller to modulate the
fan speed.
Any standalone or integrated component that is capable of reading the processor
temperature and providing the PWM signal to the 4 pin fan header.
Balanced Technology Extended
Thermal Module Assembly. The heatsink, fan and duct assembly for the BTX thermal
solution
LGA775 Socket Heatsink Loading
Description
§
Thermal and Mechanical Design Guidelines
that
CONTROL_OFFSET
T
that
CONTROL_BASE
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