Intel QX9770 - Core 2 Extreme Quad-Core Processor Design Manual page 5

B.2.1
B.2.2
B.3 Test Procedure Examples.......................................................................72
B.3.1
B.3.2
Appendix C Thermal Interface Management.........................................................................75
C.1 Bond Line Management .........................................................................75
C.2 Interface Material Area..........................................................................75
C.3 Interface Material Performance...............................................................75
Appendix D Case Temperature Reference Metrology..............................................................77
D.1 Objective and Scope .............................................................................77
D.2 Supporting Test Equipment....................................................................78
D.3 Thermal Calibration and Controls ............................................................79
D.4 IHS Groove .........................................................................................79
D.5 Thermocouple Attach Procedure .............................................................82
D.5.1
D.5.2
D.5.3
D.5.4
D.6 Thermocouple Wire Management ............................................................95
Appendix E Legacy Fan Speed Control ................................................................................97
E.1 Thermal Solution Design .......................................................................97
E.1.1
E.1.2
E.2 Board and System Implementation .........................................................99
E.2.1
E.3 Combining Thermistor and Digital Thermal sensor Control ........................ 103
E.4 Interaction of Thermal Profile and T
Appendix F BTX System Thermal Considerations................................................................ 109
Appendix G Mechanical Drawings ..................................................................................... 113
Appendix H Intel Enabled Reference Solution Information.................................................... 123
Thermal and Mechanical Design Guidelines
Heatsink Preparation................................................................69
Typical Test Equipment ............................................................72
Time-Zero, Room Temperature Preload Measurement ...................73
Preload Degradation under Bake Conditions ................................73
Thermocouple Conditioning and Preparation ................................82
Thermocouple Attachment to the IHS .........................................83
Solder Process ........................................................................88
Cleaning and Completion of Thermocouple Installation..................91
Determine Thermistor Set Points ...............................................97
Minimum Fan Speed Set Point ...................................................98
Choosing Fan Speed Control Settings .........................................99
E.2.1.1 Temperature to Begin Fan Acceleration ...................... 100
E.2.1.2 Minimum PWM Duty Cycle........................................ 102
............................................. 103
CONTROL
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