Figure 5. Locations For Measuring Local Ambient Temperature, Active Heatsink - Intel QX9770 - Core 2 Extreme Quad-Core Processor Design Manual

Intel core 2 extreme processor qx6800 and intel core 2 extreme processor qx9770 thermal and mechanical design guidelines

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Thermal Metrology

heatsink. If a barrier is used, the thermocouple can be taped directly to the barrier

with a clear tape at the horizontal location as previously described, half way between

the fan hub and the fan housing. If a variable speed fan is used, it may be useful to

add a thermocouple taped to the barrier above the location of the temperature sensor

used by the fan to check its speed setting against air temperature. When measuring

in a chassis with a live motherboard, add-in cards, and other system components,

it is likely that the T

distribution across the inlet fan section.

For passive heatsinks, thermocouples should be placed approximately 13 mm to

25 mm [0.5 to 1.0 in] away from processor and heatsink as shown in Figure 7. The

thermocouples should be placed approximately 51 mm [2.0 in] above the baseboard.

This placement guideline is meant to minimize the effect of localized hot spots from

baseboard components.

Note: Testing an active heatsink with a variable speed fan can be done in a thermal chamber

to capture the worst-case thermal environment scenarios. Otherwise, when doing a

bench top test at room temperature, the fan regulation prevents the heatsink from

operating at its maximum capability. To characterize the heatsink capability in the

worst-case environment in these conditions, it is then necessary to disable the fan

regulation and power the fan directly, based on guidance from the fan supplier.

Figure 5. Locations for Measuring Local Ambient Temperature, Active Heatsink

NOTE: Drawing Not to Scale

Thermal and Mechanical Design Guidelines

measurements will reveal a highly non-uniform temperature

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Qx68000 core 2 extreme