Table Of Contents - Intel QX9770 - Core 2 Extreme Quad-Core Processor Design Manual

Intel core 2 extreme processor qx6800 and intel core 2 extreme processor qx9770 thermal and mechanical design guidelines
Table of Contents

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Contents
1
Introduction .....................................................................................................9
1.1
Document Goals and Scope .....................................................................9
1.1.1
1.1.2
1.1.3
1.2
References ..........................................................................................11
1.3
Definition of Terms ...............................................................................11
2
Processor Thermal/Mechanical Information .........................................................13
2.1
Mechanical Requirements ......................................................................13
2.1.1
2.1.2
2.2
Thermal Requirements ..........................................................................16
2.2.1
2.2.2
2.2.3
2.3
Heatsink Design Considerations ..............................................................19
2.3.1
2.3.2
2.3.3
2.4
System Thermal Solution Considerations .................................................21
2.4.1
2.4.2
2.4.3
2.5
System Integration Considerations..........................................................22
3
Thermal Metrology ..........................................................................................23
3.1
Characterizing Cooling Performance Requirements ....................................23
3.1.1
3.2
Processor Thermal Solution Performance Assessment ................................26
3.3
Local Ambient Temperature Measurement Guidelines.................................26
3.4
Processor Case Temperature Measurement Guidelines ...............................29
4
Thermal Management Logic and Thermal Monitor Feature .....................................31
4.1
Processor Power Dissipation ...................................................................31
4.2
Thermal Monitor Implementation ............................................................31
4.2.1
4.2.2
4.2.3
4.2.4
4.2.5
4.2.6
4.2.7
Thermal and Mechanical Design Guidelines
Importance of Thermal Management ............................................9
Document Goals........................................................................9
Document Scope .....................................................................10
Processor Package...................................................................13
Heatsink Attach ......................................................................15
2.1.2.1
General Guidelines ....................................................15
2.1.2.2
2.1.2.3
Additional Guidelines .................................................16
Processor Case Temperature .....................................................16
Thermal Profile .......................................................................17
T
..................................................................................18
Heatsink Size..........................................................................20
Package IHS Flatness...............................................................20
Thermal Interface Material........................................................21
Chassis Thermal Design Capabilities...........................................21
Improving Chassis Thermal Performance ....................................21
Summary ...............................................................................22
Example ................................................................................25
PROCHOT# Signal ...................................................................32
Thermal Control Circuit ............................................................32
Thermal Monitor 2 ...................................................................33
Operation and Configuration .....................................................34
On-Demand Mode ...................................................................35
System Considerations.............................................................35
3

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