Contents
1
Introduction .....................................................................................................9
1.1
1.1.1
1.1.2
1.1.3
1.2
References ..........................................................................................11
1.3
Definition of Terms ...............................................................................11
2
2.1
2.1.1
2.1.2
2.2
2.2.1
2.2.2
2.2.3
2.3
2.3.1
2.3.2
2.3.3
2.4
2.4.1
2.4.2
2.4.3
2.5
3
Thermal Metrology ..........................................................................................23
3.1
3.1.1
3.2
3.3
3.4
4
4.1
4.2
4.2.1
4.2.2
4.2.3
4.2.4
4.2.5
4.2.6
4.2.7
Thermal and Mechanical Design Guidelines
Document Goals........................................................................9
Document Scope .....................................................................10
Processor Package...................................................................13
Heatsink Attach ......................................................................15
2.1.2.1
2.1.2.2
2.1.2.3
Thermal Profile .......................................................................17
T
..................................................................................18
Heatsink Size..........................................................................20
Summary ...............................................................................22
Example ................................................................................25
PROCHOT# Signal ...................................................................32
Thermal Monitor 2 ...................................................................33
On-Demand Mode ...................................................................35
3
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