Document Scope - Intel QX9770 - Core 2 Extreme Quad-Core Processor Design Manual

1.1.3

Document Scope

This design guide supports the following processor:
• Intel
• Intel
In this document when a reference is made to "the processor" it is intended that this
includes all the processors supported by this document. If needed for clarity, the
specific processor will be listed.
In this document, when a reference is made to "the datasheet", the reader should
refer to the Intel
Processor Q9000 Series Datasheet and Intel
Δ
QX6000
as appropriate. If needed for clarity the specific processor datasheet will be
referenced.
Chapter 2 of this document discusses package thermal mechanical requirements to
design a thermal solution for the processor in the context of personal computer
applications. Chapter 3 discusses the thermal solution considerations and metrology
recommendations to validate a processor thermal solution.
Chapter 4 addresses the benefits of the processor's integrated thermal management
logic for thermal design.
Chapter 5 gives information on the Intel reference thermal solution called ALCT (Intel
Advanced Liquid Cooling Technology) for the processor. Chapter 6 discusses the
implementation of Intel
The physical dimensions and thermal specifications of the processor that are used in
this document are for illustration only. Refer to the datasheet for the product
dimensions, thermal power dissipation and maximum case temperature. In case of
conflict, the data in the datasheet supersedes any data in this document.
10
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Core™2 Extreme processor QX6800 B3 Stepping
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Core™2 Extreme processor QX9770 C0 Stepping
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Core™2 Extreme Processor QX9000 Series and Intel
®
Sequence and Intel Core™2 Quad Processor Q6000
®
Quiet System Technology.
LGA775 Socket Heatsink Loading
®
Core™2 Extreme Quad-Core Processor
Δ
Sequence Datasheet,
Thermal and Mechanical Design Guidelines
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Core™2 Quad