Manufacturing And Soldering - Quectel BG95 A-GL Series Hardware Design

NOTE
1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to
the air is forbidden.
2. Take out the module from the package and put it on high-temperature-resistant fixtures before
baking. All modules must be soldered to PCB within 24 hours of the baking, otherwise put them in
the drying oven. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking
procedure.
3. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules.

9.2. Manufacturing and Soldering

Push the squeegee to apply the solder paste on the stencil surface, thus making the paste fill the stencil
openings and then penetrate the PCB. Apply proper force on the squeegee to produce a clean stencil
surface on a single pass. To guarantee module soldering quality, 0.13–0.15 mm stencil thickness for the
module is recommended. For more details, see document [6].
The peak reflow temperature should be 235–246 ºC, with 246 ºC as the absolute maximum reflow
temperature. To avoid module damage caused by repeated heating, it is strongly recommended that the
module should be mounted only after reflow soldering of the other side of PCB has been completed. The
recommended reflow soldering thermal profile (lead-free reflow soldering) and related parameters are
shown below.
Figure 44: Recommended Reflow Soldering Thermal Profile
BG95xA-GL_Hardware_Design
LPWA Module Series
95 / 102