NEC mPD780344 Series User Manual page 485

8-bit single-chip microcontrollers

Table of Contents

Table 28-1. Surface Mounting Type Soldering Conditions (3/3)

(3) µ PD78F0354F1-DA3: 113-pin plastic FBGA (10 × 10)

µ PD78F0354YF1-DA3: 113-pin plastic FBGA (10 × 10)

Soldering Method

Infrared reflow

Package peak temperature: 235°C, Time: 30 seconds max.

(at 210°C or higher), Count: Two times or less, Exposure limit:

Package peak temperature: 215°C, Time: 40 seconds max.

(at 200°C or higher), Count: Two times or less, Exposure limit:

Note After opening the dry pack, store it at 25°C or less and 65%RH or less for the allowable storage period.

Caution Do not use different soldering methods together.

CHAPTER 28 RECOMMENDED SOLDERING CONDITIONS

Soldering Conditions

(after that, prebake at 125°C for 10 hours)

(after that, prebake at 125°C for 10 hours)

User's Manual U15798EJ2V0UD

Condition Symbol