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CP6003-RA/RC
6.2.3
Catastrophic Cooling Failure Sensor
The Catastrophic Cooling Failure Sensor protects the processor from catastrophic overheating.
The Catastrophic Cooling Failure Sensor threshold is set well above the normal operating tem-
perature to ensure that there are no false trips. The processor will stop all executions when the
junction temperature exceeds approximately 125°C. Once activated, the event remains
latched until the CP6003-RA/RC undergoes a power-on restart (all power off and then on
again).
This function cannot be enabled or disabled in the uEFI BIOS. It is always enabled to ensure
that the processor is protected in any event.
Note ...
When the TH LED on the front panel is blinking red, it indicates that the proces-
sor temperature is above 125°C.
6.3
Chipset Thermal Monitor Feature
The Intel® QM67 chipset includes one on-die Thermal Diode Sensor to measure the chipset
die temperature.
The maximum Intel® QM67 chipset junction temperature is 108°C
6.4
External Thermal Regulation for CP6003-RA
To ensure the best possible basis for operational stability and long-term reliability, the CP6003-
RA is equipped with a heat sink. Coupled together with system chassis, which provides variable
configurations for forced airflow, controlled active thermal energy dissipation is guaranteed.
The physical size, shape, and construction of the heat sink ensures the lowest possible thermal
resistance. In addition, the CP6003-RA has been specifically designed to efficiently support
forced airflow as found in modern CompactPCI systems.
Thermal Characteristic Graphs for CP6003-RA
The thermal characteristic graphs shown on the following sections illustrate the maximum am-
bient air temperature as a function of the volumetric airflow rate for the power consumption in-
dicated. The diagrams are intended to serve as guidance for reconciling board and system with
the required computing power considering the thermal aspect. One diagram per CPU version
is provided. There are up to two curves representing upper level working points based on dif-
ferent levels of average CPU utilization. When operating below the corresponding curve, the
CPU runs steadily without any intervention of thermal supervision. When operated above the
corresponding curve, various thermal protection mechanisms may take effect resulting in tem-
porarily reduced CPU performance or finally in an emergency stop in order to protect the CPU
and the chipset from thermal destruction. In real applications this means that the board can be
operated temporarily at a higher ambient temperature or at a reduced flow rate and still provide
some margin for temporarily requested peak performance before thermal protection will be ac-
tivated.
An airflow of 2.0 m/s to 3.0 m/s is a typical value for a standard Kontron ASM rack. For other
racks or housings the available airflow will differ. The maximum ambient operating temperature
must be recalculated and/or measured for such environments. For the calculation of the
maximum ambient operating temperature, the processor and chipset junction temperature
must never exceed the specified limit for the involved processor and chipset.
ID 1046-3890, Rev. 1.0
Thermal Considerations
.
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