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Thermal Considerations
Thermal characteristic curves
• Thermal characteristic curve of the CP6003-RA with maximum processor workload
and basic graphics operation
This load complies with the values indicated in Chapter 5.2, "Power Consumption of
the CP6003-RA/RC", Table 5-6.
• Thermal characteristic curve of the CP6003-RA with maximum processor and graph-
ics controller workload
This load complies with the values indicated in Chapter 5.2, "Power Consumption of
the CP6003-RA/RC", Table 5-7.
How to read the diagram
Select a specific CPU and choose a specific working point. For a given flow rate there is a max-
imum airflow input temperature (= ambient temperature) provided. Below this operating point,
thermal supervision will not be activated. Above this operating point, thermal supervision will
become active protecting the CPU from thermal destruction. The minimum airflow rate provid-
ed must be more than the value specified in the diagram.
Volumetric flow rate
The volumetric flow rate refers to an airflow through a fixed cross-sectional area (i.e. slot width
x depth. The volumetric flow rate is specified in m³/h (cubic-meter-per-hour) or cfm (cubic-feet-
per-minute) respectively.
Conversion: 1 cfm = 1.7 m³/h; 1 m³/h = 0.59 cfm
Airflow
At a given cross-sectional area and a required flow rate, an average, homogeneous airflow
speed can be calculated using the following formula:
Airflow = Volumetric flow rate / area.
The airflow is specified in m/s (meter-per-second) or in fps (feet-per-second) respectively.
Conversion: 1 fps = 0.3048 m/s; 1 m/s = 3.28 fps
The following figures illustrate the operational limits of the CP6003-RA taking into consideration
power consumption vs. ambient air temperature vs. airflow rate. The measurements were
made based on a 4HP slot and with both processor cores enabled.
Page 6 - 6
CP6003-RA/RC
ID 1046-3890, Rev. 1.0
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