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Thermal Considerations
CP6003-RA/RC
6.5
Thermal Characteristics for the CP6003-RC
The thermal concept of the CP6003-RC is based on a specially designed full-board heat
spreader and wedge lock clamping mechanisms.
The heat spreader provides optimal heat transfer to the board's top and bottom edges as well
as enhanced structural support for ruggedized environments.
The wedge locks serve two functions. First, they provide a highly stable mechanical fixation of
the board in the chassis slot. When expanded using the proper torque value, they form with the
heat spreader practically a single physical unit capable of withstanding very high shock and vi-
bration forces. Second, they are the primary mechanism for conduction of heat from the board
to the system chassis.
Cooling of the CP6003-RC is a function of the system chassis which must provide adequate
conduction cooling capability. To determine cooling performance, the board temperature can
be measured at the reference point indicated in the figure below.
Figure 6-3:
Position of the Reference Point on the CP6003-RC
Reference Point
Page 6 - 8
ID 1046-3890, Rev. 1.0
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